Active patch antenna transmitter
First Claim
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1. A microwave antenna transmitter device comprising:
- a conductive ground plane;
a dielectric substrate disposed upon said ground plane, said substrate having an opening formed therein exposing an area of said ground plane;
an electrically conductive antenna patch disposed upon said dielectric substrate so as to surround said substrate opening;
a source of electrical energy; and
a packageless IMPATT diode chip electrically coupled to said source of electrical energy for generating microwave frequency energy therefrom, said diode chip conductively coupled to said antenna patch and to said ground plane and said diode chip being disposed upon said ground plane within said opening in said substrate in a spaced relationship with said substrate.
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Abstract
A "packageless" diode chip is integrated into a microstrip patch antenna. Application of DC current to the device results in efficient radiation of high powered microwave frequency signals directly into free space.
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Citations
15 Claims
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1. A microwave antenna transmitter device comprising:
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a conductive ground plane; a dielectric substrate disposed upon said ground plane, said substrate having an opening formed therein exposing an area of said ground plane; an electrically conductive antenna patch disposed upon said dielectric substrate so as to surround said substrate opening; a source of electrical energy; and a packageless IMPATT diode chip electrically coupled to said source of electrical energy for generating microwave frequency energy therefrom, said diode chip conductively coupled to said antenna patch and to said ground plane and said diode chip being disposed upon said ground plane within said opening in said substrate in a spaced relationship with said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A millimeter wave antenna transmitter comprising:
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a conductive ground plane; a dielectric substrate disposed on said ground plane, said substrate having an opening formed therein exposing an area of said ground plane within said opening; an electrically conductive antenna patch disposed upon said dielectric substrate, said antenna patch surrounding said substrate opening; a packageless millimeter wave impact avalanche transit time (IMPATT) diode chip disposed upon said ground plane within said substrate opening and spaced from said substrate, said diode chip conductively coupled to said antenna patch by a conductor spanning said substrate opening and contacting said diode chip substantially in the center of said substrate opening; a heat sink disposed between said diode chip and said ground plane to absorb heat dissipated by said diode chip; an integral tuning stub electrically coupled to said antenna patch; a DC bias line for electrically coupling a DC power source to said antenna patch; and means for preventing high frequency signals being transmitted from the antenna patch toward the DC power source including a plurality of radial stubs intersecting said bias line one quarter wavelength from said antenna patch, wherein said antenna patch, DC bias line, tuning stub, and means for preventing further comprise a conductive metallic film on said substrate.
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Specification