Integral cooling system for electric components

• US 5,309,319 A
• Filed: 03/27/1992
• Issued: 05/03/1994
• Est. Priority Date: 02/04/1991
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Messina, Gaetano P.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/860,226
• Time in Patent Office: 767 Days
• Field of Search: 357/82, 165/80.4, 165/104.33, 165/142, 165/143, 62/418, 361/382, 361/385-388, 361/400, 361/403, 361/405, 361/689, 361/699, 361/702, 361/704, 361/707, 257/707, 257/714, 257/720
• US Class Current: 361/699
• CPC Class Codes: H01L 23/4336 in combination with jet impingement
• CPC Class Codes: H01L 23/4338 Pistons, e.g. spring-loaded members
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integral cooling system for cooling a plurality of electronic components, including: a cooling fluid manifold for mounting over the plurality of electronic components; a main fluid inflow duct within the manifold for supplying pumped cooling fluid; a main fluid outflow duct within the manifold for removing pumped cooling fluid; for each respective electronic component of the plurality of electronic components: a component cooling chamber within the manifold, for application of cooling fluid to an area immediately adjacent the electronic component; a fluid supplying duct within the manifold to supply cooling fluid from the main fluid inflow duct to the chamber; and, a fluid removing duct within the manifold to remove cooling fluid from the chamber to the main fluid outflow duct. In preferred embodiments, there is a thermally-conductive slug or piston disposed between the respective electronic component and component cooling chamber to prevent direct application of a flow of the pumped cooling fluid to the respective electronic component, and to encourage uniform cooling across the respective electronic component.

Claims

1. An integral cooling system which cools a plurality of electronic components, said system comprising:

a one-piece cooling liquid manifold mounted over said plurality of electronic components;

a main liquid inflow duct formed unitarily within said manifold for supplying cooling liquid;

a main liquid outflow duct formed unitarily within said manifold for removing cooling liquid;

a plurality of component cooling chambers formed unitarily within said manifold, for application of cooling liquid separately to an area immediately adjacent each of said plurality of electronic components;

a plurality of liquid supplying ducts formed unitarily within said manifold to supply cooling liquid from said main liquid inflow duct to each said chamber;

a plurality of liquid removing ducts formed unitarily within said manifold to remove cooling liquid from each said chamber to said main liquid outflow duct,

each said chamber being enclosed except for said liquid supplying duct and said liquid removing duct; and

a thermally-conductive slug disposed between each of said electronic components and a respective one of said component cooling chambers to prevent direct application of a flow of said cooling liquid to each of said electronic components, and to encourage uniform cooling across each of said electronic components, said slug being in direct contact with the cooling liquid in each said component cooling chamber.

2. A system as claimed in claim 1, further comprising:

a thermally-conductive slug disposed between each of said electronic components and a respective one of said component cooling chambers to prevent direct application of a flow of said cooling liquid to each of said electronic components, and to encourage uniform cooling across each of said electronic components.

3. A system as claimed in claim 2, further comprising:

a seal between said manifold and each said slug to maintain said cooling liquid within each said cooling chamber and prevent said cooling liquid from directly contacting said each of said electronic components.

4. A system as claimed in claim 2:

wherein each said slug has at least one of a predetermined thickness and predetermined material conductivity property to provide a predetermined power dissipation capability.

5. A system as claimed in claim 2:

wherein each said slug is provided with channels in a star-shaped pattern to encourage a predetermined flow of said cooling liquid across each said slug.

6. A system as claimed in claim 1:

wherein each said liquid supplying duct comprises a portion for directing a flow of said cooling liquid into direct contact with each said electronic component.

7. A system as defined in claim 1:

wherein said plurality of component cooling chambers are arranged along respective lengths of said main liquid inflow duct and main liquid outflow duct, and each said liquid supplying duct and each said liquid removing duct is provided in an arrangement such that cooling liquid is supplied in parallel to and removed in parallel from said plurality of component cooling chambers, the arrangement further being such that a pumping pressure resistance across said main liquid inflow and outflow ducts is maintained low.

8. A system as claimed in claim 7:

wherein said main liquid outflow duct has a longitudinal cross-section which is one of tapered or stepped, increasing in cross-section in the direction of fluid flow.

9. A system as claimed in claim 1:

wherein at least one of said main liquid inflow duct, said main liquid outflow duct, each said component cooling chamber, each said liquid supplying duct, and each said liquid removing duct comprises a flow control arrangement for defining a volume of cooling liquid applied to said electronic components.

10. A system as claimed in claim 1:

wherein said manifold is made of a substantially homogeneous material.

11. A system as claimed in claim 1, further comprising:

at least one of water and a liquid fluorocarbon as said cooling liquid;

a pump for pumping said cooling liquid; and

,

at least one of a chiller and condenser for cooling said cooling liquid.

12. A system as claimed in claim 1:

wherein said main liquid inflow duct has a longitudinal cross-section which is one of tapered or stepped, decreasing in cross-section in the direction of fluid flow.

13. A system as claimed in claim 2:

wherein each said slug is provided with channels in a grooved pattern to encourage a predetermined flow of said cooling liquid across each said slug.

14. An integral cooling system which cools a plurality of electronic components, said system comprising:

a one-piece cooling liquid manifold mounted over said plurality of electronic components;

a main liquid inflow duct formed unitarily within said manifold for supplying cooling liquid;

a main liquid outflow duct formed unitarily within said manifold for removing cooling liquid;

a plurality of component cooling chambers formed unitarily within said manifold, for application of cooling liquid separately to an area immediately adjacent each of said plurality of electronic components;

a plurality of liquid supplying ducts formed unitarily within said manifold to supply cooling liquid from said main liquid duct to each said chamber;

a plurality of liquid removing ducts formed unitarily within said manifold to remove cooling liquid from each said chamber to said main liquid outflow duct,

each said chamber being enclosed except for said liquid supplying duct and said liquid removing duct; and

a piston within each said cooling chamber, each said piston being biased to maintain contact between each said piston and each of said electronic components, to prevent direct application of a flow of said cooling liquid to each of said electronic components, and to encourage uniform cooling across each of said electronic components.

15. A system as claimed in claim 14, further comprising:

a seal between said manifold and each said piston to maintain said cooling liquid within each said cooling chamber and prevent said cooling liquid from directly contacting said each of said electronic components.

16. A system as claimed in claim 14:

wherein said piston has at least one of a predetermined thickness and predetermined material conductivity property to provide a predetermined power dissipation capability.

17. A system as claimed in claim 14:

wherein each said piston is provided with channels in a star-shaped pattern to encourage a predetermined flow of said cooling liquid across each said piston.

18. A system as claimed in claim 14:

wherein each said piston is provided with channels in a grooved pattern to encourage a predetermined flow of said cooling liquid across each said piston.

19. A system as claimed in claim 14, wherein said piston is movable in and out of said chamber.