Integral cooling system for electric components
First Claim
1. An integral cooling system which cools a plurality of electronic components, said system comprising:
- a one-piece cooling liquid manifold mounted over said plurality of electronic components;
a main liquid inflow duct formed unitarily within said manifold for supplying cooling liquid;
a main liquid outflow duct formed unitarily within said manifold for removing cooling liquid;
a plurality of component cooling chambers formed unitarily within said manifold, for application of cooling liquid separately to an area immediately adjacent each of said plurality of electronic components;
a plurality of liquid supplying ducts formed unitarily within said manifold to supply cooling liquid from said main liquid inflow duct to each said chamber;
a plurality of liquid removing ducts formed unitarily within said manifold to remove cooling liquid from each said chamber to said main liquid outflow duct,each said chamber being enclosed except for said liquid supplying duct and said liquid removing duct; and
a thermally-conductive slug disposed between each of said electronic components and a respective one of said component cooling chambers to prevent direct application of a flow of said cooling liquid to each of said electronic components, and to encourage uniform cooling across each of said electronic components, said slug being in direct contact with the cooling liquid in each said component cooling chamber.
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Accused Products
Abstract
An integral cooling system for cooling a plurality of electronic components, including: a cooling fluid manifold for mounting over the plurality of electronic components; a main fluid inflow duct within the manifold for supplying pumped cooling fluid; a main fluid outflow duct within the manifold for removing pumped cooling fluid; for each respective electronic component of the plurality of electronic components: a component cooling chamber within the manifold, for application of cooling fluid to an area immediately adjacent the electronic component; a fluid supplying duct within the manifold to supply cooling fluid from the main fluid inflow duct to the chamber; and, a fluid removing duct within the manifold to remove cooling fluid from the chamber to the main fluid outflow duct. In preferred embodiments, there is a thermally-conductive slug or piston disposed between the respective electronic component and component cooling chamber to prevent direct application of a flow of the pumped cooling fluid to the respective electronic component, and to encourage uniform cooling across the respective electronic component.
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Citations
19 Claims
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1. An integral cooling system which cools a plurality of electronic components, said system comprising:
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a one-piece cooling liquid manifold mounted over said plurality of electronic components; a main liquid inflow duct formed unitarily within said manifold for supplying cooling liquid; a main liquid outflow duct formed unitarily within said manifold for removing cooling liquid; a plurality of component cooling chambers formed unitarily within said manifold, for application of cooling liquid separately to an area immediately adjacent each of said plurality of electronic components; a plurality of liquid supplying ducts formed unitarily within said manifold to supply cooling liquid from said main liquid inflow duct to each said chamber; a plurality of liquid removing ducts formed unitarily within said manifold to remove cooling liquid from each said chamber to said main liquid outflow duct, each said chamber being enclosed except for said liquid supplying duct and said liquid removing duct; and a thermally-conductive slug disposed between each of said electronic components and a respective one of said component cooling chambers to prevent direct application of a flow of said cooling liquid to each of said electronic components, and to encourage uniform cooling across each of said electronic components, said slug being in direct contact with the cooling liquid in each said component cooling chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An integral cooling system which cools a plurality of electronic components, said system comprising:
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a one-piece cooling liquid manifold mounted over said plurality of electronic components; a main liquid inflow duct formed unitarily within said manifold for supplying cooling liquid; a main liquid outflow duct formed unitarily within said manifold for removing cooling liquid; a plurality of component cooling chambers formed unitarily within said manifold, for application of cooling liquid separately to an area immediately adjacent each of said plurality of electronic components; a plurality of liquid supplying ducts formed unitarily within said manifold to supply cooling liquid from said main liquid duct to each said chamber; a plurality of liquid removing ducts formed unitarily within said manifold to remove cooling liquid from each said chamber to said main liquid outflow duct, each said chamber being enclosed except for said liquid supplying duct and said liquid removing duct; and a piston within each said cooling chamber, each said piston being biased to maintain contact between each said piston and each of said electronic components, to prevent direct application of a flow of said cooling liquid to each of said electronic components, and to encourage uniform cooling across each of said electronic components. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification