Cardiac mapping and ablation systems
First Claim
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1. An electrode assembly for use in an intraventricular multi-electrode cardiac mapping probe comprising:
- at least one elongated spline having a distal end and a proximal end and carrying a plurality of spaced apart electrodes thereon, means for attaching said spline to a distal end of a catheter which has a proximal end and a distal end, said spline comprising a plurality of alternating electrically conductive layers and electrically non-conductive layers, a plurality of electrical conductors located within said spline, one of said conductors being electrically connected to each of said electrodes and connecting each of said electrodes to a different one of said conductive layer, each of said conductors being electrically insulated except at its ends, and a plurality of electrical conductors each electrically connected to one of said conductive layers for electrically connecting each of said electrically conductive layers to an electrical signal processing device.
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Abstract
An electrode assembly for use in interventricular cardiac mapping includes one or more elongated splines each of which carries a plurality of spaced apart electrodes thereon. The body of each spline is formed of a plurality of alternating electrically conductive layers and the electrically non-conductive layers. A separate electrically conductive pathway is provided to connect each of the electrodes to a different one of the conductive layers. Each of the layers is electrically connected to an electrical signal processing device so that signals provided by each of the electrodes can be processed.
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Citations
5 Claims
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1. An electrode assembly for use in an intraventricular multi-electrode cardiac mapping probe comprising:
at least one elongated spline having a distal end and a proximal end and carrying a plurality of spaced apart electrodes thereon, means for attaching said spline to a distal end of a catheter which has a proximal end and a distal end, said spline comprising a plurality of alternating electrically conductive layers and electrically non-conductive layers, a plurality of electrical conductors located within said spline, one of said conductors being electrically connected to each of said electrodes and connecting each of said electrodes to a different one of said conductive layer, each of said conductors being electrically insulated except at its ends, and a plurality of electrical conductors each electrically connected to one of said conductive layers for electrically connecting each of said electrically conductive layers to an electrical signal processing device. - View Dependent Claims (2, 3, 4)
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5. An electrode assembly for use in an intraventricular multi-electrode cardiac mapping probe comprising:
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at least one elongated rectangularly cross sectioned spline having an upper surface and proximal and distal ends and carrying a plurality of spaced apart electrodes on the upper surface thereof, means for attaching the proximal end of said spline to a distal end of a catheter which has a proximal end and a distal end, means for attaching the distal end of said spline to an end cap, said spline comprising a plurality of alternating electrically conductive layers and electrically non-conductive layers, said conductive layers having a thickness of about 0.0005 to 0.002 inch, said spline being of a substantially greater width than thickness whereby said spline can be flexed in one vertical plane passing through its longitudinal axis but will resist flexing in any other plane passing through said axis, an electrically conductive pin electrically connected to each of said electrodes, the pin connected to each electrode being of a different length than that connected to each of the other electrodes, each of said pins extending into the spline and having an end attached and electrically connected to one of said conductive layers, each of said pins being electrically insulated except at each of its ends, and a plurality of electrical conductors electrically connected to said electrically conductive layers for connecting each of said conductive layers to an electrical signal processing device.
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Specification