Apparatus for efficient transfer of electronic devices

• US 5,310,039 A
• Filed: 08/19/1992
• Issued: 05/10/1994
• Est. Priority Date: 08/19/1992
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Childress, Robert S., Heydarpour, Amin, Sagar, Jagdish, Butera, Richard R.
• Primary Examiner(s): DAYOAN, DARRELL G
• Application Number:
  US07/932,656
• Time in Patent Office: 629 Days
• Field of Search: 198/345.1, 198/346.2, 198/468.6, 198/468.2, 414/222, 414/225
• US Class Current: 198/346.2
• CPC Class Codes: G01R 31/2851 Testing of integrated circuits [IC] G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801
• CPC Class Codes: G01R 31/2893 Handling, conveying or loading, e.g. belts, boats, vacuum fingers G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H01L21/67

Abstract

An apparatus for the fast and efficient transfer of integrated circuits between three locations: an input location, a test site location, and an output location. The apparatus includes a front and a rear work press assembly for transferring integrated circuits between the locations and for applying pressure during testing. The work press assemblies is constructed of a variable length shaft coupled to an arm extension which is coupled to a work press. The work press assemblies can each move between three horizontal positions, a first horizontal position associated with the input location, a second horizontal position associated with the test site location, and a third horizontal position associated with the output location. The work press assemblies move independently of one another. While one work press assembly is applying pressure to an integrated circuit during testing at the test site location, the other work press assembly is transferring a tested integrated to the output location and then move back past the test site location to the input location to pick up an untested integrated circuit. The work press assemblies each move horizontally in a separate but parallel planes to one another so that they may pass each other without colliding.

Claims

1. An apparatus for the fast and efficient transfer of integrated circuits between three locations, a first input location, a second test site location, and a third output location, wherein each of said three locations reside in a first XY-plane comprising:

a first work press assembly for transferring integrated circuits between said three locations and for applying pressure while the integrated circuits are being tested at said test site location, said first work assembly comprising;

a variable length shaft;

an arm rigidly coupled perpendicularly to said variable length shaft;

a work press coupled to said arm;

said first work press assembly capable of moving between three horizontal positions, a first position associated with said input location, a second position associated with said test site location, and a third position associated with said output location, said shaft of said first work press assembly located in a second plane whenever said work press assembly is in one of said three positions, said second plane substantially parallel to said first plane; and

a second work press assembly for transferring integrated circuit between said locations and for applying pressure to integrated circuits while circuits are being tested at said test site location, said second work press assembly comprising;

a variable length shaft;

an arm rigidly coupled perpendicular to said variable length shaft;

a work press coupled to said arm;

said second work press assembly capable of moving between three horizontal positions, a first position associated with said input location, a second position associated with said test site location, and a third position associated with said output location, said variable length shaft of said second work press assembly located in a third plane whenever said second work press assembly is in one of said three positions, wherein said third plane is parallel to said first plane;

said first work press assembly capable of moving from said third position associated with said output location to said first position associated with said input location while said second work press assembly is at said second position associated with said test site location, and said second work press assembly capable of moving from said third position associated with said output location to said first position associated with said input location while said first work press assembly is located at said second position associated with said test site location.

2. The apparatus of claim 1 wherein said variable length shafts of said first and second work press assemblies have at least a first and a second vertical length wherein said first length is shorter than said second length.

3. The apparatus of claim 1 wherein said variable length shafts are achieved with pneomatic cylinders.

4. The apparatus of claim 1 wherein said horizontal positions of said first and second work press assemblies are achieved with pneumatic cylinders.

5. The apparatus of claim 2 wherein said variable length shaft of said first work press assembly has said first vertical length and said variable length shaft of said second work press assembly has said second vertical length.

6. The apparatus of claim 2 wherein said variable length shaft of said second work press assembly has said first vertical length and said variable length shaft of said first work press assembly has said second vertical length.

7. An apparatus for the fast and efficient transfer of integrated circuits between four locations, a first load slide location, a turn table location, a test site location, and a second load slide location, wherein each of said four locations reside in a first XY plane comprising:

a first work press assembly for transferring integrated circuits between said locations and for applying pressure to an integrated circuit while the integrated circuit is being tested at said test site location, said first work press assembly comprising;

a variable length shaft;

an arm rigidly coupled perpendicularly to said variable length shaft;

a work press coupled to said arm;

said first work press assembly capable of moving between three horizontal positions, a first position associated with said turn table location, a second position associated with said test site location, and a third position associated with said second load slide location, said shaft of said first work press assembly located in a second plane whenever said work place assembly is in one of said three horizontal positions, said second plane substantially parallel to said first plane;

a second work press assembly for transferring integrated circuits between said locations and for applying pressure to an integrated circuit while said integrated circuit is being tested at said test site location, said second work press assembly comprising;

a variable length shaft;

an arm rigidly coupled perpendicularly to said variable length shaft;

a work press coupled to said arm;

said second work press assembly capable of moving between three horizontal positions, a first position associated with said turn table location, a second position associated with said test site location, and a third position associated with said second load slide location, said variable length shaft of said second work press assembly located in a third plane whenever said second assembly is one of said three horizontal positions, wherein said third plane is substantially parallel to said first plane;

said first work press assembly capable of moving from said third position associated with said second load slide location to said first position associated with said turntable location while said second work press assembly is at said position associated with said test site location, said second work press assembly capable of moving from said third position associated with said second load slide location to said position associated with said turn table location while said first work press assembly is located at said position associated with said test site location; and

a pick and place assembly for transferring said integrated circuit from said first load slide location to said turn table location, said pick and place comprising a shaft and a suction cup coupled to said shaft, said first pick and place assembly capable of moving to two horizontal positions, a first position associated with said first load slide location and a second position associated with said turn table location, said shaft of said pick and place assembly located in a fourth plane whenever said pick and place assembly is in one of said two positions, wherein said fourth plane is substantially parallel to said first plane.

8. The apparatus of claim 7 wherein said variable length shafts of said first and second work press assemblies have a first, a second, and a third vertical length.

9. The apparatus of claim 8 wherein said variable length shafts of said first and second work press assembly, each comprises a first and a second pneumatic cylinder coupled together wherein when both of said cylinders are closed, said shaft has said first length, and wherein when said first cylinder is open and said second cylinder is closed, said shaft has said second length, and wherein when said first cylinder is closed and said second cylinder is open said shaft has said third length.

10. The apparatus of claim 9 wherein said first pneumatic cylinder is an approximately 1.5 inch stroke cylinder, and said second pneumatic cylinder is an approximately 6 inch stroke cylinder.

11. The apparatus of claim 8 wherein when said first work press assembly moves from said third horizontal position associated with said second load slide location to said first horizontal position associated with said turn table location, said variable shaft of said first work press assembly has said first vertical length, and said second work press assembly has said third vertical length.

12. The apparatus of claim 8 wherein when said second work press assembly moves from said third horizontal position associated with said second load slide location to said first horizontal position associated with said turn table location, said variable shaft of said second work press assembly has said first vertical length, and said first work press assembly has said third vertical length.

13. The apparatus of claim 7 wherein said first work press assembly is moved to and from said horizontal positions by a first and a second pneumatic cylinder, and said second work press assembly is moved to and from said horizontal positions by a third and a fourth pneumatic cylinder.

14. The apparatus of claim 8 wherein three electronic sensors are provided for said first work press assembly and three electronic sensors are provided for said second work press assembly for detecting the vertical lengths of said variable length shafts of said first and second work press assemblies, and wherein three electronic sensors are provided for said first work press assembly and three electronic sensors are provided for said second work press assembly for detecting said horizontal positions of said first and said second work press assemblies, respectively.

15. The apparatus of claim 7 wherein said first and second work press assembly and said pick and place assembly are moved under control of a computer.