PROM and ROM memory cells
First Claim
1. An antifuse PROM memory device formed on a substrate, comprising:
- a first insulation layer on the substrate;
a silicon layer on the first insulation layer, the silicon layer including regions having a first conductivity type and a region having a second conductivity type opposite to the first type so that at least one P-N junction diode is formed substantially in parallel with the first insulation layer;
a second insulation layer on the silicon layer, the second insulation layer including a contact hole which exposes a portion of the region having the second conductivity type in the silicon layer;
antifuse means in the contact hole and vertically in contact with the portion of the region exposed in the silicon layer for allowing programming of the device such that the antifuse means is directly connected to the P-N junction diode in the forward direction of the P-N junction diode; and
a conductive layer on the antifuse means.
1 Assignment
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Accused Products
Abstract
An antifuse memory cell having a P+ polysilicon doping in a region directly under an intrinsic silicon programming layer. The P+ polysilicon region is surrounded by an N- polysilicon doped region, and the two regions are sandwiched between layers of silicon dioxide insulation. The interface between the two regions is a P-N junction, in fact, a diode. The diode does not suffer from a diffusion current that increases with increasing levels of N- doping, therefore the N- polysilicon can be heavily doped to yield a very conductive bit line interconnect for a memory matrix. The interconnect line widths can be very narrow, and further microminiaturization is aided thereby. The top metalization is aluminum and serves as a word line interconnect in the memory matrix.
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Citations
24 Claims
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1. An antifuse PROM memory device formed on a substrate, comprising:
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a first insulation layer on the substrate; a silicon layer on the first insulation layer, the silicon layer including regions having a first conductivity type and a region having a second conductivity type opposite to the first type so that at least one P-N junction diode is formed substantially in parallel with the first insulation layer; a second insulation layer on the silicon layer, the second insulation layer including a contact hole which exposes a portion of the region having the second conductivity type in the silicon layer; antifuse means in the contact hole and vertically in contact with the portion of the region exposed in the silicon layer for allowing programming of the device such that the antifuse means is directly connected to the P-N junction diode in the forward direction of the P-N junction diode; and a conductive layer on the antifuse means. - View Dependent Claims (16, 17)
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2. A semiconductor device formed on a substrate, comprising:
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a first insulation layer on the substrate; a first silicon layer on the first insulation layer; a second insulation layer on the first silicon layer, the second insulation layer including a plurality of openings; a second silicon layer on the second insulation layer and in the openings and in contact with the first silicon layer, the second layer having an conductivity type same as that of the first silicon layer and an impurity concentration substantially lower than that of the first silicon layer; a third insulation layer on the second silicon layer, the third insulation layer including a contact hole between the openings; a metal layer in the contact hole and in contact with the second silicon layer to form a Schottky barrier diode; and a wiring layer covering the contact hole. - View Dependent Claims (3, 4, 18, 19)
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5. A semiconductor device formed on a substrate, comprising:
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a first insulation layer on the substrate; a first silicon layer on the first insulation layer, the first silicon layer having a first conductivity type; a second insulation layer on the first silicon layer, the second insulation layer including a plurality of openings; a second silicon layer on the second insulation layer and in the openings in contact with the first silicon layer, the second silicon layer including regions having the first conductivity type and an impurity concentration substantially lower than that of the first silicon layer and a region having a second conductivity type opposite to the first type so that at least one P-N junction diode is formed substantially in parallel with the second insulation layer; a third insulation layer on the second silicon layer, the third insulation layer including a contact hole which exposes a portion of the region having the second conductivity type in the second silicon layer, the contact hole positioned between the openings; and a wiring layer covering the contact hole. - View Dependent Claims (6, 7, 20, 21)
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8. A masked read only memory (ROM) on a substrate, comprising:
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a first insulation layer on the substrate; a first conductive layer having a first conductivity type on the first insulation layer; a second insulation layer on the first conductive layer, the second insulation layer including a plurality of apertures; a second conductive layer including regions having the first conductivity type on the second insulation layer and regions having a second conductivity type opposite to the first type in the apertures so that at least one P-N junction diode is formed substantially in parallel with the second insulating layer; a third insulation layer on the second conductive layer, the third insulation layer including a contact hole over an aperture, the contact hole exposing a region having the second conductivity type in the second silicon layer, the absence or presence of a contact hole over an aperture representing data; and a third conductive layer in the contact hole and in contact with the region having the second conductivity type in the second conductive layer. - View Dependent Claims (9)
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10. A semiconductor device on a substrate, comprising:
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a first insulation layer on the substrate; a first conductive layer on the first insulation layer; a second insulation layer on the first conductive layer, the second insulation layer including a plurality of apertures; a second conductive layer on the second insulation layer and in contact with the first conductive layer in the first apertures, the second conductive layer having a conductivity type same as that of the first conductive layer; a third insulation layer on the second conductive layer, the third insulation layer including a contact hole between the apertures, the contact hole exposing the second conductive layer; a refractory metal silicide layer disposed within the contact hole to form a Schottky diode; and a third conductive layer covering the contact hole and in electrical communication with the Schottky diode.
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11. A semiconductor ROM memory device formed on a substrate, comprising:
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a first insulation layer on the substrate; a first conductive layer on the first insulation layer; a second insulation layer on the first conductive layer, the second insulation layer including a plurality of apertures; a second conductive layer on the second insulation and in contact with the first conductive layer in the apertures, the second conductive layer having a conductivity type same as that of the first conductive layer; a third insulation layer on the second conductive layer, the third insulation layer including a contact hole positioned directly over an aperture; a refractory metal silicide layer disposed in the contact hole and in contact with the second conductive layer to form a Schottky diode; and a third conductive layer in contact with the metal silicide layer in the contact hole, the presence or absence of a contact hole representing data. - View Dependent Claims (22)
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12. A semiconductor ROM memory device formed on a substrate, comprising:
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a first insulation layer on the substrate; a first conductive layer on the first insulation layer, the first conductive layer having a first conductivity type; a second insulation layer on the first conductive layer, the second insulation layer including a plurality of apertures; a second conductive layer including regions having the first conductivity type in contact with the first conductive layer in the apertures and regions having a second conductivity type opposite to the first type on the second insulation layer so that at least one P-N junction is formed substantially in parallel with the second insulation layer; a third insulation layer on the second conductive layer, the third insulation layer including a contact hole positioned directly over an aperture, the contact hole exposing a region in the second conductive layer, the presence or absence of a contact hole representing data; and a third conductive layer covering the contact hole and in contact with the region exposed. - View Dependent Claims (13, 23)
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14. A semiconductor memory device formed on a substrate, comprising:
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a first insulation layer on the substrate; a first silicon layer on the first insulation layer, the first silicon layer having a first conductivity type; a second insulation layer on the first silicon layer, the second insulation layer including a plurality of openings; a second silicon layer on the second insulation layer and in the openings in contact with the first silicon layer, the second silicon layer including regions having the first conductivity type and an impurity concentration substantially lower than that of the first silicon layer and a region having a second conductivity type opposite to that of the first type so that at least one P-N junction diode is formed substantially in parallel with the second insulation layer; a third insulation layer on the second silicon layer, the third insulation layer including a contact hole which exposes a portion of the region having the second conductivity type in the second silicon layer, the contact hole positioned between the openings; a metal film in the contact hole; a third silicon layer on the metal film; and a wiring layer covering the contact hole. - View Dependent Claims (15, 24)
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Specification