RF test equipment and wire bond interface circuit

• US 5,311,122 A
• Filed: 12/02/1991
• Issued: 05/10/1994
• Est. Priority Date: 12/02/1991
• Status: Expired due to Term

• Current Assignee: General Dynamics C4 Systems Incorporated (General Dynamics Corporation)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Mathews, Douglas J., Fullerton, Craig
• Primary Examiner(s): Karlsen, Ernest F.
• Application Number:
  US07/801,142
• Time in Patent Office: 890 Days
• Field of Search: 324/158 R, 324/158 F, 324/158 P, 324/128, 324/73.1, 437/8, 371/22.6, 371/22.5, 257/48
• US Class Current: 324/762.03
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

An RF test equipment and wire bond interface circuit (150) for facilitating the on-wafer (100) testing of integrated circuits (120) has an electrical interface (102,104,106), for providing electrical coupling to the IC (120) and a low-pass filter structure connected between the electric interface (102,104,106) and the IC (120). The low-pass filter structure comprises a first inductive element (108) connected in series with the electrical interface (102,104,106) for simulating wire bond reactances, a second inductive element (114) connected in series with the first inductive element (108) for making contact with the IC (120) and at least one capacitor (110,112) connected between ground and a point common to both the first (108) and the second (114) inductive elements, for providing shunt capacitance and defining a Tee type low-pass matched filter at the input (121) and the output (123) of the IC (120). The RF test equipment and wire bond interface (150) assure the on-wafer performance of the IC (120) will correspond to its off-wafer performance, despite the addition of wire bonds (127,129 and 133,135).

Claims

1. An RF test equipment and wire bond interface circuit, disposed on a dielectric wafer, for facilitating the on-wafer testing of integrated circuits (IC) formed on said dielectric wafer, prior to the IC'"'"'s separation from the wafer, said interface circuit comprising:

electrical interface means, disposed on the dielectric wafer, for providing electrical coupling between external test equipment and an IC under test; and

a low pass filter structure, disposed on the dielectric wafer, between the electrical interface means and the IC under test, said low pass filter structure having a reactance which simulates a wire bond reactance, thereby providing similar on-wafer and off-wafer performance of the IC.

2. The circuit of claim 1 wherein the electrical interface means, the IC under test and the low pass filter structure are disposed upon the dielectric wafer, to form an IC assembly, such that when the IC is removed from the wafer, the RF test equipment and wire bond interface circuit remains a part of the IC assembly.

3. The circuit of claim 2 wherein the dielectric wafer comprises a plurality of ICs, each connected to at least one RF test equipment and wire bond interface circuit.

4. The circuit of claim 1 wherein the electrical interface means is a 50 ohm transmission line.

5. The circuit of claim 1 wherein the low pass filter structure is a device selected from the group consisting of L-C circuits and Tee type low-pass filters.

6. An RF test equipment and wire bond interface circuit, disposed on a dielectric wafer, for facilitating the on-wafer testing of integrated circuits (ICs) formed on the dielectric wafer, prior to the IC'"'"'s separation from the wafer, said interface circuit comprising:

electrical interface means, disposed on the wafer, for providing electrical coupling between external test equipment and an IC under test; and

a low pass filter structure, disposed on the wafer between the electrical interface means and the IC under test, for providing simulated wire bond reactance, said low pass filter structure comprising;

a first inductive element connected in series with the electrical interface means for simulating said wire bond reactance,

a second inductive element connected in series with the first inductive element for making contact with the IC under test, and

at least one capacitor connected between ground and a point common to both the first and the second inductive elements for providing shunt capacitance,

such that when the external test equipment makes contact with the electrical interface means, RF testing with simulated wire bond reactance is provided, thereby assuring similar on-wafer and off-wafer performance of the IC.

7. The circuit of claim 6 wherein the electrical interface means, the IC under test and the low pass filter structure are disposed upon the dielectric dielectric wafer to form an IC assembly, such that when the IC is removed from the wafer, the RF test equipment and wire bond interface circuit remains coupled to the removed IC.

8. The circuit of claim 6 wherein the at least one capacitor is a parallel-plate capacitor, wherein plates of the parallel-plate capacitor are formed from electrical contacts on parallel surfaces of the dielectric wafer.

9. The circuit of claim 6 wherein the first inductive element has an inductive reactance simulating an inductive reactance of wire bonds as attached to the IC, when the IC is separated from the wafer and packaged at a next level of assembly.

10. An RF test equipment and wire bond interface circuit, disposed on a dielectric wafer, for facilitating the on-wafer testing of integrated circuits (IC) formed on said dielectric wafer, said RF test equipment and wire bond interface circuit comprising:

an electrical interface means, disposed on a surface of the dielectric wafer, for providing electrical coupling between external test equipment and an IC under test; and

a matching circuit, disposed on a surface of the wafer, between the electrical interface means and the IC under test, for providing impedance matching and simulated wire bond reactances, said matching circuit comprising;

a first inductive element, connected in series with the electrical interface means, for simulating said wire bond reactances,

a second inductive element, connected in series with the first inductive element, for making contact with the IC under test, and

at least one electrical wire bond contact, coupled between ground and a point common to both the first and the second inductive elements, for providing wire bond contact and shunt capacitance,

such that when the external test equipment makes contact with the electrical interface means, a low-pass filter structure which simulates wire bond reactance is provided during RF testing.

11. The circuit of claim 10 wherein the second inductive element has an inductance which when combined with the capacitance of the electrical wire bond contact, provides an impedance characteristic which is substantially equivalent to an impedance characteristics of the IC.

12. The circuit of claim 10 wherein at a next level of assembly, at least one IC including at least one RF test equipment and wire bond interface circuit is separated from the wafer.

13. The circuit of claim 12 further comprising wire bonds connected to the electrical wire bond contact to provide electrical coupling between the IC and external circuitry.

14. The circuit of claim 13 wherein the wire bonds have an inductance in series with the inductance of the second inductive element.

15. The circuit of claim 14 further comprising:

a Tee type low pass filter comprising;

the wire bond inductance in series with the second inductive elements inductance, in combination with shunt capacitance from the electrical wire bond contact, the electrical interface means and the first inductive elements distributive capacitance.

16. The circuit of claim 15 wherein the first inductive elements distributive capacitance, the electrical interface means capacitance and the electrical wire bond capacitance, when combined with the second inductive element'"'"'s inductance, provides an impedance characteristic which is substantially equivalent to an impedance characteristic of the IC.

17. An RF test equipment and wire bond interface circuit, disposed on a substrate, for facilitating the on-substrate testing of integrated circuits (IC) formed on the substrate, said circuit comprising:

an electrical interface means, disposed on a surface of the substrate, for providing electrical coupling between external test equipment and an IC under test; and

a matching circuit, disposed on a surface of the substrate between the electrical interface means and the IC under test, for providing impedance matching and simulated wire bond reactance, said matching circuit comprising;

a first inductive element, connected in series with the electrical interface means, for simulating wire bond reactances,

a second inductive element, connected in series with the first inductive element, for making contact with the IC under test, and

an electrical wire bond contact, coupled between ground and a point common to both the first and the second inductive elements, for providing shunt capacitance and wire bond contact to external circuitry,

such that when the external test equipment makes contact with the electrical interface means, a low-pass filter structure having a first transfer characteristic is provided during RF testing, further;

when the IC under test is removed from the substrate and wire bonds are attached between the electrical wire bond contact and external circuitry, a low-pass filter structure having a second transfer characteristic is provided during IC packaging, wherein said second transfer characteristic is substantially similar to the first transfer characteristic, thereby assuring similar on-wafer and off-wafer performance of the IC.