Housing for motor vehicle electronic system

• US 5,311,398 A
• Filed: 10/28/1992
• Issued: 05/10/1994
• Est. Priority Date: 01/26/1991
• Status: Expired due to Term

• Current Assignee: Alfred Teves GmbH (Continental AG), Telefunken Electronic GmbH (Continental AG)
• Original Assignee: Alfred Teves GmbH (Continental AG), Telefunken Electronic GmbH (Continental AG)
• Inventors: Schirmer, Klaus, Loreck, Heinz, Burgdorf, Jochen
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/941,093
• Time in Patent Office: 559 Days
• Field of Search: 123/1 R, 123/198 RE, 307/10.1, 439/65, 439/485, 439/606, 439/620, 439/637, 174/252, 174/260, 174/16.1, 174/52.2, 252/706, 252/703, 252/712, 252/713, 165/80.3, 165/185, 361/380, 361/382, 361/386-388, 361/395, 361/398, 361/399, 361/413, 361/689, 361/704, 361/705, 361/707, 361/711, 361/719, 361/720, 361/736, 361/749, 361/785
• US Class Current: 361/704
• CPC Class Codes: B60R 16/0239 Electronic boxes
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10446 Mounted on an edge
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence

Abstract

A housing for installation in motor vehicles to accommodate SMD electronic components disposed on one side of a multi-layer circuit board or film. A metal plate serves as the carrier for the circuit board or film, with the planar expanse of the metal plate being the same as or greater than that of the board or film, with the board or film being disposed on, attached to and electrically insulated from the metal plate. When the area of the metal plate is greater than that of the board or film, power components are disposed on the surface of the metal plate in a region not covered by the board or film, whereas when the area of the metal plate is substantially the same as that of the board or film, power components are disposed on the board or film, with the metal plate serving as a heat sink for the power components. A connector is mounted on the metal plate in a region covered by the board or film such that the connection pins of the connector are brought into the board or film, with the coupling side of the connector being on the planar side of the metal plate which is opposite the side carrying the board or film. Finally, a mechanical cover arrangement is attached to the metal plate to form a flat housing, with the mechanical cover arrangement covering the surface side of the metal plate carrying the board or film.

Claims

1. A housing for installation in motor vehicles to accommodate electronic components, comprising:

a multi-layer circuit board or a multi-layer film which, on one side, is equipped with SMD electronic components;

a metal plate as the carrier for the multi-layer circuit board or the multi-layer film, with the planar expanse of said metal plate being greater than the planar expanse of said multi-layer circuit board or said multi-layer film, wherein the multi-layer circuit board or the multi-layer film is disposed on, attached to and insulated from the metal plate;

power components, disposed on the surface of the metal plate in a region not covered by the multi-layer circuit board or multi-layer film, with said metal plate serving as a heat sink for said power components;

a connector mounted on the metal plate in a further region covered by the multi-layer circuit board or the multi-layer film, such that connection pins of the connector are brought into the multi-layer circuit board or multi-layer film, and the coupling side of the connector lies on the planar side of the metal plate which is opposite the side carrying the multi-layer circuit board or multi-layer film; and

mechanical cover means attached to the metal plate to form a flat housing, said mechanical cover means covering only the side of the metal plate carrying the multi-layer circuit board or multi-layer film.

2. A housing according to claim 1, wherein the connector is disposed in the immediate vicinity of the power components.

3. A housing according to claim 1, wherein the power components are glued to the metal plate such that the power components and the metal plate are electrically insulated and in good thermal contact.

4. A housing according to claim 1, wherein the metal plate is rectangular with a length (l) and a width (b) and the shape of the multi-layer circuit board or the multi-layer film is selected so that its length is almost the same as that of the metal plate and its width is less than that of the metal plate by such an amount that the rectangular area resulting therefrom on the metal plate is sufficient to accommodate the power components.

5. A housing according to claim 4, wherein the connector covers the entire length of the metal plate and, in order to install the housing, the connector is provided on both of its narrow end faces with flange members that project beyond the metal plate and are provided with bores.

6. A housing according to claim 1, wherein the metal plate has a passage for the connecting pins.

7. A housing according to claim 1, wherein the coupling direction of the connector is perpendicular to the metal plate.

8. A housing according to claim 1, wherein the coupling direction of the connector is parallel to the planar expanse of the metal plate.

9. A housing according to claim 1, wherein the connector is mechanically mounted on the metal plate by a fastening means to produce a tight seal.

10. A housing according to claim 1, wherein the mechanical cover means covering the electronic components is an inexpensive hood-shaped cover.

11. A housing according to claim 1, wherein the electronic components are encased by the mechanical cover means in order to cover them and protect them against moisture and corrosion.

12. A housing according to claim 11, wherein a partial or complete encasement is provided as the casing.

13. A housing according to claim 1, wherein the mechanical cover means is an encapsulation.

14. A housing for installation in motor vehicles to accommodate electronic components, comprising:

a multi-layer film which, on one side, is equipped with SMD electronic components;

a metal plate as the carrier for the multi-layer film, with the planar expanse of said metal plate having a similar shape and size to the planar expanse of said multi-layer film, wherein the multi-layer film is disposed on, attached to and insulated from the metal plate;

a connector, mounted to the metal plate such that connection pins of the connector are brought through a passage in said metal plate into the multi-layer film, and a region of the multi-layer film carrying these connection pins divides the surface of the film into a first region and a second region, with the coupling side of the connector lying on the planar side of the metal plate opposite the side carrying the multi-layer film;

power components disposed in the first region of the multi-layer film; and

mechanical cover means attached to the metal plate to form a flat housing, with said mechanical cover means covering only the side of the metal plate carrying the multi-layer film.

15. A housing according to claim 14, wherein the power components are disposed in the immediate vicinity of the connector.

16. A housing according to claim 14, wherein the power components are soldered to the multi-layer film and are in good thermal contact with the metal plate.

17. A housing according to claim 14, wherein the metal plate and the multi-layer film are rectangular and have a length (l) and a width (b).