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High power ceramic microelectronic package

  • US 5,311,399 A
  • Filed: 06/24/1992
  • Issued: 05/10/1994
  • Est. Priority Date: 06/24/1992
  • Status: Expired due to Fees
First Claim
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1. A microelectronic package comprising a ceramic substrate having an edge, a first surface bonded to a metal heat sink and a second surface opposite said first surface and having at least one metallized island bonded to a lead frame, wherein said island has a controlled length uniform pullback of metallization from the edge of said substrate, wherein the metallization pullback length is within the range sufficient to reduce residual tensile stress in said substrate compared to a substrate having no controlled length metallization pullback at the substrate surface bonded to a lead frame.

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