Vacuum processing apparatus and operating method therefor

• US 5,314,509 A
• Filed: 08/29/1991
• Issued: 05/24/1994
• Est. Priority Date: 08/29/1990
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Itou, Atsushi, Tsubone, Tsunehiko, Kato, Shigekazu, Nishihata, Kouji
• Primary Examiner(s): Schwadron, Martin P.
• Assistant Examiner(s): Lee, Kevin L.
• Application Number:
  US07/751,951
• Time in Patent Office: 999 Days
• Field of Search: 34/15, 34/92, 34/8, 34/51, 134/902, 414/225, 414/226
• US Class Current: 34/406
• CPC Class Codes: B01J 3/006 Processes utilising sub-atmospheric pressure; Apparatus therefor
• CPC Class Codes: B41J 2/36 Print density control
• CPC Class Codes: B41J 2/365 by compensation for variation in temperature
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67736 Loading to or unloading from a conveyor
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: Y10S 134/902 Semiconductor wafer
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber
• CPC Class Codes: Y10S 414/14 Wafer cassette transporting

Abstract

This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

Claims

1. A method of operating a vacuum processing apparatus having vacuum processing chambers for which dry cleaning is effected therein after substrates to be processed are processed therein in vacuum, said method comprising the step of:

disposing first storage means for storing said substrates to be processed and second storage means for storing dummy substrates in the air atmosphere;

transferring said substrates to be processed between said first storage means and said vacuum processing chambers, and vacuum-processing said substrates to be processed; and

transferring said dummy substrates between said second storage means and said vacuum processing chamber before and after dry cleaning of said vacuum processing chambers.

2. A method of operating a vacuum processing apparatus according of claim 1, wherein a plurality of said vacuum processing chambers are disposed, and dry cleaning is effected while said dummy substrates are disposed in said vacuum processing chambers, respectively.

3. A method of operating a vacuum processing apparatus according to claim 1, wherein judgment of the timing of dry cleaning of said vacuum processing chambers is made by measuring the intensity of plasma light transmitted through said vacuum processing chambers.

4. A method of operating a vacuum processing apparatus according to claim 1, wherein judgment of the timings of dry cleaning of said vacuum processing chambers is made by counting the number of times of processing of said substrates to be processed in said vacuum processing chambers.

5. A method of operating a vacuum processing apparatus according to claim 1, wherein the first and second storage means are separate storage means separated from each other.

6. A method of operating a vacuum processing apparatus according to claim 1, wherein a same conveying system is used for said transferring said substrates and said transferring said dummy substrates.

7. A method of operating a vacuum processing apparatus according to claim 6, wherein the first and second storage means are separate storage means separated from each other.

8. A method of operating as vacuum processing apparatus according to claim 1, wherein said dry cleaning of the vacuum processing chamber si effected with the dummy substrates, transferred from the second storage means into the vacuum processing chamber, in the vacuum processing chamber.

9. A method of operating a vacuum processing chamber according to claim 8, wherein said first storage means has therein said substrates to be processed, and said second storage mean has therein said dummy substrates.

10. A method of operating a vacuum processing apparatus according to claim 1, wherein said dummy substrates are transferred to at least one of the vacuum processing chambers to be dry cleaned, and said substrates to be processed are transferred to others of the vacuum processing chambers, different from said at least one of the vacuum processing chambers, in order to process the substrates to be processed, and wherein dry cleaning of the at least one of the vacuum processing chambers is performed while processing of the substrates to be processed is performed in the others of the vacuum processing chambers.

11. A method of operating a vacuum processing apparatus having a plurality of vacuum processing chambers for which dry cleaning is effected therein after substrates to be processed are processed therein in vacuum, said method comprising the steps of:

disposing first storage means for storing said substrates to be processed and second storage means for storing dummy substrates in the air atmosphere;

transferring said substrates to be processed between said first storage means and said vacuum processing chambers, and vacuum-processing said substrates to be processed;

transferring said dummy substrates from said second storage means to said vacuum processing chambers during or after the vacuum processing of said substrates to be processed in said first storage means, and effecting dry cleaning of vacuum processing chambers in the dummy substrates therein; and

returning used dummy substrates to original storage positions in said second storage means.

12. A method of operating a vacuum processing apparatus according to claim 11, wherein said dry cleaning is effected by detecting the dry cleaning timing of each of said vacuum processing chambers.

13. A method of operating a vacuum processing apparatus according to claim 11, wherein the first and second storage means are separate storage means separated from each other.

14. A method of operating a vacuum processing apparatus according of claim 11, wherein a same conveying system is used for said transferring said substrates and said transferring said dummy substrates.

15. A method of operating a vacuum processing apparatus according to claim 14, wherein the first and second storage means are separate storage means separated from each other.

16. A method of operating a vacuum processing apparatus having at least one vacuum processing chamber for which dry cleaning is effected therein after a substrate to be processed has been processed therein in vacuum, said method comprising the steps of:

disposing first storage means for storing said substrate to be processed and second storage means for storing a dummy substrate in the air atmosphere;

transferring said substrate to be processed between said first storage means and said at least one vacuum processing chamber, and vacuum-processing said substrate to be processed; and

transferring said dump substrate between said second storage means and said at least one vacuum processing chamber before and after dry cleaning of said at least one vacuum processing chamber.

17. A method of operating a vacuum processing apparatus according to claim 16, wherein a plurality of said vacuum processing chambers are provided, and dry cleaning is effected in said vacuum processing chambers having said dummy substrate.

18. A method of operating a vacuum processing apparatus according to claim 16, wherein judgment of the timing of dry cleaning of said at least one vacuum processing chamber is made by measuring the intensity of plasma light transmitted through said at least one vacuum processing chamber.

19. A method of operating a vacuum processing apparatus according to claim 16, wherein judgment of the timing of dry cleaning of said at least one vacuum processing chamber is made by counting the number of times of processing of a substrate to be processed in said at least one vacuum processing chamber.

20. A method of operating a vacuum processing apparatus according to claim 16, wherein said dry cleaning of said at least one vacuum processing chamber is effected with said dummy substrate, transferred from said second storage means into said vacuum processing chamber, in said at least one vacuum processing chamber.

21. A method of operating a vacuum processing chamber according to claim 20, wherein said first storage means has therein said substrate to be processed, and said second storage mean has therein said dummy substrate.

22. A method for cleaning a vacuum processing chamber by means of dry etching with a dummy wafer, said method comprising the steps of:

providing a cassette for storing said dummy wafer;

transferring said dummy wafer from said cassette to said vacuum processing chamber after treating a wafer, for forming a product, in said vacuum processing chamber;

forming a plasma, for dry cleaning, in said vacuum processing chamber with said dummy wafer therein;

transferring said dummy wafer to said cassette in an air atmosphere, from said vacuum processing chamber, after said step of forming said plasma;

counting a number of operations of said step of forming said plasma when having a same dummy wafer in the vacuum processing chamber;

storing in a controller said number counted by said step of counting; and

replacing said dummy wafer by a new dummy wafer when said number stored in said controller reaches a predetermined number in said controller.

23. A method for cleaning a vacuum processing chamber by means of a dry etching with a dummy wafer, said method comprising steps of:

disposing, in an air atmosphere, a cassette storing said dummy wafer;

transferring said dummy wafer from said cassette in the air atmosphere to said vacuum processing chamber after treating a wafer, for forming a product, in said vacuum processing chamber;

forming a plasma, for dry cleaning, in said vacuum processing chamber, with said dummy wafer therein; and

transferring said dummy wafer to said cassette from said vacuum processing chamber after said step of forming said plasma.