Aqueous emulsions containing organosilicon compounds for the impregnation of inorganic materials

• US 5,314,533 A
• Filed: 06/23/1992
• Issued: 05/24/1994
• Est. Priority Date: 07/05/1991
• Status: Expired due to Term

• Current Assignee: Evonik Degussa GmbH
• Original Assignee: Degussa AG (Rag-Stiftung)
• Inventors: Goebel, Thomas, Alff, Harald, Michel, Rudolf, Karl, Josef
• Primary Examiner(s): BRUNSMAN, DAVID M
• Application Number:
  US07/902,882
• Time in Patent Office: 700 Days
• Field of Search: 106/287.11, 106/287.12, 106/287.14, 106/287.15, 106/287.16, 106/287.13
• US Class Current: 106/287.13
• CPC Class Codes: C04B 2103/40 Surface-active agents, dispersants
• CPC Class Codes: C04B 2111/00112 Mixtures characterised by specific pH values
• CPC Class Codes: C04B 41/4539 as a emulsion, dispersion or suspension
• CPC Class Codes: C04B 41/4905 containing silicon
• CPC Class Codes: C04B 41/4922 applied to the substrate as monomers, i.e. as organosilanes RnSiX4-n, e.g. alkyltrialkoxysilane, dialkyldialkoxysilane
• CPC Class Codes: C04B 41/4977 characterised by the number of silicon atoms
• CPC Class Codes: C07F 7/1804 Compounds having Si-O-C linkages Si-O-acyl linkages C07F7/1896
• CPC Class Codes: C09K 3/18 for application to surfaces to minimize adherence of ice, mist or water thereto rendering particulate materials free flowing, in general, e.g. making them hydrophobic B01J2/30; Thawing or antifreeze materials for application to surfaces used in liquids for heat-transfer, heat-exchange or heat-storage or for the production of heat or cold other than by combustion, e.g. radiator liquids, C09K5/00

Abstract

Aqueous emulsions are disclosed containing organosilicon compounds for the impregnation of inorganic materials, in particular building materials, containing alkoxysilanes and silane surfactants. The emulsions comprise 1-80% by weight of one alkoxy silane, ##STR1## X═H,cl,Br, I, NH₂, SCN, CN, N₃, NHR, NR, NR₃, --S_x --, aryl or alkenyl

a═0 or 1

b═1 or 2

and, 1-30% of an organosilicon compound ##STR2##

Claims

1. An aqueous organosilicon emulsion suitable for the impregnation of inorganic materials, comprising:

(a) from 1 to 80% by weight of at least one alkoxysilane corresponding to the formula ##STR26## in which R₁ =C₁ -C₃ -alkyl,

R₃ =C₁ -C₂₀ - alkyl, straight chain or branched, or phenyl,

x=H, Cl, Br, I, NH₂, SCN, CN, N₃, NHR, NR₂, ⊕

NR₃, --S_x --, aryl or alkenyl,

a=0 or 1,

b=1 or 2 and

x and c stand for an integer from 1 to 6,

(b) from 1 to 30% by weight of an organosilicon compound corresponding to the formula ##STR27## in which R₂ and R₃, which may be identical or different, denote C₁ -C₂₀ -alkyl, straight chain or branched, or phenyl,

R₄ stands for C₁ -C₃ -alkoxy, ##STR28## wherein s=3-50 and t=3-25, R₅ denotes H, C₁ -C₂₀ -alkyl, C₂ -C₃₆ -alkenyl,

C₅ -C₈ -cycloaklyl or C₇ -C₃₆ -aralkyl

when p=0 and r=0, OR₅ stands for;

space="preserve" listing-type="equation">--(OCH.sub.2 --CH.sub.2).sub.s --(CH.sub.2 --CHO).sub.t (CH.sub.2 --CH.sub.2 O).sub.5 H;

m=0, 1 or 2 and

n=0, 1 or 2 on condition that when p=0, then (m+n)=1 or 2 and when P≠

0then (m+n)= 0, 1 or 2;

p=0, 1, 2, or 3 and

r=an integer with a value from 0 to 50, and

(c) water for the balance up to 100% by weight.

2. The aqueous organosilicon emulsion according to claim 1 which additionally contains an anionic surfactant.

3. The aqueous organosilicon emulsion according to claim 1 which additionally contains a buffer.

4. The aqueous organosilicon emulsion according to claim 1 wherein R₃ in Formula I is C₁ to C₁₀ alkyl.

5. The aqueous organosilicon emulsion according to claim 1 wherein R₂ and R₃ in Formula II are C₁ to C₁₀ alkyl.