Method for making a semiconductor laser
First Claim
1. A method for manufacturing a vertical cavity, surface-emitting laser (to be referred to as a VCSEL), the method comprising the steps of providing a gallium arsenide substrate having approximately a (100) growth surface, epitaxially growing a distributed Bragg reflector (to be referred to as a DBR) on the growth surface, and performing at least one additional step toward completion of the VCSEL, CHARACTERIZED IN THATthe growth surface is tilted by at least 1°
- , and not more than about 7°
, from the orientation of a (100) surface toward the orientation of a (111)A surface;
the DBR comprises at least ten layers of alternating composition;
the DBR layers of alternating composition comprise, in alternation, Alx Ga1-x As and Aly Ga1-y As, wherein one of x and y is greater than 0.35, and the other of x and y is less than or equal to 0.35; and
during the step of epitaxially growing the DBR, the substrate temperature is less than 600°
C.
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Abstract
Disclosed is a method for manufacturing a vertical cavity, surface-emitting laser. The method includes growing a distributed Bragg reflector having at least 10 layers of alternating composition on a gallium arsenide substrate. The growth surface of the substrate is tilted by an angle of 1°-7° from the orientation of a (100) surface toward the orientation of a (111)A surface. This results in improved reflectivity of the DBR.
43 Citations
7 Claims
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1. A method for manufacturing a vertical cavity, surface-emitting laser (to be referred to as a VCSEL), the method comprising the steps of providing a gallium arsenide substrate having approximately a (100) growth surface, epitaxially growing a distributed Bragg reflector (to be referred to as a DBR) on the growth surface, and performing at least one additional step toward completion of the VCSEL, CHARACTERIZED IN THAT
the growth surface is tilted by at least 1° - , and not more than about 7°
, from the orientation of a (100) surface toward the orientation of a (111)A surface;the DBR comprises at least ten layers of alternating composition; the DBR layers of alternating composition comprise, in alternation, Alx Ga1-x As and Aly Ga1-y As, wherein one of x and y is greater than 0.35, and the other of x and y is less than or equal to 0.35; and during the step of epitaxially growing the DBR, the substrate temperature is less than 600°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7)
- , and not more than about 7°
Specification