Copper paste for internal conductor of multilayer ceramic electronic component
First Claim
1. Copper paste for an internal conductor of a multilayer ceramic electronic component, comprising copper powder having a mean particle size of 0.5 to 2 μ
- m and particle size range of 0.3 to 4 μ
m, an organic vehicle and a solvent, said copper powder being 40 to 60 percent by weight of said copper paste and said organic vehicle and solvent being 60 to 40 percent by weight of said copper paste.
1 Assignment
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Accused Products
Abstract
Copper paste containing copper powder having a mean particle size of 0.5 to 2 μm and a particle size range of 0.3 to 4 μm an organic vehicle and a solvent, the paste including 40 to 60 percent by weight copper powder is applied onto ceramic green sheets in a thickness of 1 to 3 μm, for forming internal conductors of a multilayer ceramic electronic component, such as a multilayer ceramic capacitor. The ceramic green sheets provided with such copper paste films are stacked and fired so that occurrence of voids in the laminate and deformation of the laminate are suppressed in the resulting multilayer ceramic electronic component.
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Citations
5 Claims
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1. Copper paste for an internal conductor of a multilayer ceramic electronic component, comprising copper powder having a mean particle size of 0.5 to 2 μ
- m and particle size range of 0.3 to 4 μ
m, an organic vehicle and a solvent, said copper powder being 40 to 60 percent by weight of said copper paste and said organic vehicle and solvent being 60 to 40 percent by weight of said copper paste. - View Dependent Claims (2, 3, 4, 5)
- m and particle size range of 0.3 to 4 μ
Specification
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- Resources
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Current AssigneeMurata Manufacturing Co Limited
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Original AssigneeMurata Manufacturing Co Limited
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InventorsOhshita, Kazuhito, Tani, Hiroji
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Primary Examiner(s)Skaling, Linda
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Assistant Examiner(s)KOPEC, MARK T
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Application NumberUS08/002,620Time in Patent Office505 DaysField of Search252/512, 252/518, 106/1.18, 106/1.23US Class Current252/512CPC Class CodesC22C 1/0425 Copper-based alloysH01B 1/22 the conductive material com...H01G 4/0085 Fried electrodesH05K 1/092 Dispersed materials, e.g. c...
