Directed effusive beam atomic layer epitaxy system and method

• US 5,316,793 A
• Filed: 07/27/1992
• Issued: 05/31/1994
• Est. Priority Date: 07/27/1992
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Wallace, Robert M., Gnade, Bruce E.
• Primary Examiner(s): BELL, JANYCE A
• Application Number:
  US07/919,685
• Time in Patent Office: 673 Days
• Field of Search: 427/248.1, 427/294, 427/255.1, 427/255.2, 118/715, 118/50, 118/710
• US Class Current: 427/248.1
• CPC Class Codes: C23C 16/45517 Confinement of gases to vicinity of substrate
• CPC Class Codes: C23C 16/45544 characterized by the apparatus
• CPC Class Codes: C30B 25/14 Feed and outlet means for the gases; Modifying the flow of the reactive gases

Abstract

A system and method for epitaxial growth of high purity materials on an atomic or molecular layer by layer basis wherein a substrate is placed in an evacuated chamber which is evacuated to a pressure of less than about 10^-9 Torr and predetermined amounts of predetermined precursor gases are injected into the chamber from a location in the chamber closely adjacent the substrate to form the atomic or molecular layer at the surface of the substrate while maintaining the pressure at less than about 10^-9 Torr in the chamber in regions thereof distant from the substrate. The precursor gases are provided from a plurality of tanks containing the precursor gases therein under predetermined pressure and predetermined ones of the tanks are opened to the chamber for predetermined time periods while maintaining the pressure in the tanks. A dose limiting structure is provided for directing predetermined amounts of the precursor gases principally at the substrate with a dose limiting directional structure.

Claims

1. A method of forming an atomic or molecular layer on a substrate comprising the steps of:

(a) placing a substrate in an evacuated chamber;

(b) evacuating said chamber to a pressure of less than about 10^-9 Torr; and

(c) injecting precursor gases into said chamber, sufficient to react with available sites on said substrate to form a layer on said substrate, into said chamber from a location in said chamber adjacent said substrate to form said atomic or molecular layer at the surface of said substrate while maintaining said pressure in said chamber in regions thereof distant from said substrate.

2. The method of claim 1, wherein step (c) comprises the steps of providing a plurality of tanks containing precursor gases therein under pressures above the pressure in said evacuated chamber and opening one or more of said tanks to said chamber for time periods while maintaining said pressures in said tanks.

3. The method of claim 1 wherein said step of injecting includes the step of directing said precursor gases principally at said substrate.

4. The method of claim 2 wherein said step of injecting includes the step of directing said precursor gases principally at said substrate.

5. The method of claim 1 further including the step of removing remaining precursor gases subsequent to said step of injecting.

6. The method of claim 2 further including the step of removing remaining precursor gases subsequent to said step of injecting.

7. The method of claim 3 further including the step of removing remaining precursor gases subsequent to said step of injecting.

8. The method of claim 4 further including the step of removing remaining precursor gases subsequent to said step of injecting.

9. The method of claim 5 further including then repeating the steps of claim 1.

10. The method of claim 6 further including then repeating the steps of claim 2.

11. The method of claim 7 further including then repeating the steps of claim 3.

12. The method of claim 8 further including then repeating the steps of claim 4.

13. A system for forming an atomic or molecular layer on a substrate comprising:

(a) an evacuated chamber;

(b) an evacuating device coupled to said chamber for evacuating said chamber to a pressure of less than about 10^-9 Torr;

(c) a reservoir for injecting one or more predetermined precursor gases into said chamber from a location in said chamber closely adjacent said substrate to form said atomic or molecular layer at the surface of said substrate while maintaining said pressure in said chamber in regions thereof distant from said substrate;

(d) an orifice coupled to said reservoir for limiting conductance of gases from said reservoir; and

(e) a capillary doser coupled to said orifice and extending into said chamber adjacent said substrate for directing said precursor gases principally at said substrate.

14. The system of claim 13, wherein said reservoir comprises a plurality of tanks containing precursor gases therein under pressures above the pressure in said evacuated chamber and a controlled valve on each of said tanks, each said controlled valve opening an associated one of said tanks to said chamber for a time period sufficient to form said atomic layer while maintaining said pressures in said tanks.

15. The system of claim 13 further including means to remove remaining precursor gases from said orifice and said doser.

16. The system of claim 14 further including means to remove remaining precursor gases from said orifice and said dose.