High density interconnection assembly

• US 5,317,477 A
• Filed: 06/30/1992
• Issued: 05/31/1994
• Est. Priority Date: 06/30/1992
• Status: Expired due to Fees

• Current Assignee: International Business Corporation (Kleangas Energy Technologies, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Gillett, John B.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Phillips, Michael W.
• Application Number:
  US07/906,971
• Time in Patent Office: 700 Days
• Field of Search: 364/708.1, 361/679, 361/683, 361/684, 361/686, 361/735, 361/784, 361/785, 361/788, 361/803, 361/829, 395/325, 395/800
• US Class Current: 361/679.39
• CPC Class Codes: G06F 1/184 Mounting of motherboards
• CPC Class Codes: G06F 1/185 Mounting of expansion boards
• CPC Class Codes: G06F 1/186 Securing of expansion boards in correspondence to slots provided at the computer enclosure
• CPC Class Codes: G06F 1/188 Mounting of power supply units
• CPC Class Codes: G06F 13/409 Mechanical coupling back panels H05K7/1438

Abstract

A high density computer interconnection assembly is provided by a plurality of flat packages slidably mounted along a rack in a frame in one given plane. The packages include edge connected processors and switch modules with associated power supply. One or two interconnection wiring circuit boards extend perpendicular to the one given plane and adjacent and along the edge of the edge connected modules to couple thereto whereby the interconnection circuit board couples said switch modules to said processor modules along one broad surface of said interconnection circuit board. Memory cards are coupled to the opposite broad surface of the interconnection circuit board.

Claims

1. A computer assembly with shortened path lengths between computer elements comprising:

a rack frame,

a plurality of flat packages slidably mounted to the frame along one given plane, said packages comprising a planar power supply module coupled to a planar edge connected module with said power supply module providing power to said edge connected module, said edge connected module includes a plurality of multicircuit semiconductor chips mounted on a carrier and having connection means along one or more edges of said edge connected module, said edge connected modules being processor modules and switch modules,

a planar interconnection wiring circuit board extending perpendicular to said one given plane mounted juxtapositioned to the connector edge of said edge connected modules and coupled thereto on one broad surface to thereby provide coupling between said switch modules and processor modules, and

a memory card coupled to the opposite broad surface of said circuit board whereby coupling between said switch modules and said memory card is across the thickness of the planar interconnection wiring circuit board.

2. The computer assembly of claim 1 wherein said switch modules are located near one end of the assembly and processor modules are located near the other end.

3. The computer assembly of claim 2 wherein said memory cards extend in a plane perpendicular to said one given plane and perpendicular to the plane of the planar circuit board.

4. The computer assembly of claim 2 including a second planar interconnection wiring circuit board extending perpendicular to said one given plane and parallel to said planar circuit board for coupling said edge connected modules to said switch edge connected modules, and second memory cards coupled to the opposite broad surface of said second interconnection wiring circuit board whereby coupling between said switch modules and memory is across the thickness of the planar interconnection wiring circuit board.

5. The computer assembly of claim 4 wherein said processor modules coupled to said second interconnection wiring board and to said second memory cards are at an end opposite to those processor modules coupled to the first mentioned interconnection wiring board and said first memory card.

6. The computer assembly of claim 2 wherein said switch module is nearest to said memory card and said switch module has coupling means at opposite ends thereof for connection to said interconnection wiring circuit board and said interconnection wiring circuit board includes connection means nearest said memory card for coupling said memory card to a second switch module.

7. The computer assembly of claim 6 including said second switch module coupled to said interconnection wiring circuit board, a second planar interconnection wiring circuit board extending parallel to said interconnection wiring circuit board coupled to different set of said processor modules and to said switch module and said second switch module, a second memory card coupled to both said switch modules and said second switch module via said second interconnection wiring circuit board.

8. The computer assembly of claim 1 wherein said memory cards extend in a plane perpendicular to said one given plane and perpendicular to the plane of the planar circuit board.