High density interconnection assembly
First Claim
1. A computer assembly with shortened path lengths between computer elements comprising:
- a rack frame,a plurality of flat packages slidably mounted to the frame along one given plane, said packages comprising a planar power supply module coupled to a planar edge connected module with said power supply module providing power to said edge connected module, said edge connected module includes a plurality of multicircuit semiconductor chips mounted on a carrier and having connection means along one or more edges of said edge connected module, said edge connected modules being processor modules and switch modules,a planar interconnection wiring circuit board extending perpendicular to said one given plane mounted juxtapositioned to the connector edge of said edge connected modules and coupled thereto on one broad surface to thereby provide coupling between said switch modules and processor modules, anda memory card coupled to the opposite broad surface of said circuit board whereby coupling between said switch modules and said memory card is across the thickness of the planar interconnection wiring circuit board.
1 Assignment
0 Petitions
Accused Products
Abstract
A high density computer interconnection assembly is provided by a plurality of flat packages slidably mounted along a rack in a frame in one given plane. The packages include edge connected processors and switch modules with associated power supply. One or two interconnection wiring circuit boards extend perpendicular to the one given plane and adjacent and along the edge of the edge connected modules to couple thereto whereby the interconnection circuit board couples said switch modules to said processor modules along one broad surface of said interconnection circuit board. Memory cards are coupled to the opposite broad surface of the interconnection circuit board.
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Citations
8 Claims
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1. A computer assembly with shortened path lengths between computer elements comprising:
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a rack frame, a plurality of flat packages slidably mounted to the frame along one given plane, said packages comprising a planar power supply module coupled to a planar edge connected module with said power supply module providing power to said edge connected module, said edge connected module includes a plurality of multicircuit semiconductor chips mounted on a carrier and having connection means along one or more edges of said edge connected module, said edge connected modules being processor modules and switch modules, a planar interconnection wiring circuit board extending perpendicular to said one given plane mounted juxtapositioned to the connector edge of said edge connected modules and coupled thereto on one broad surface to thereby provide coupling between said switch modules and processor modules, and a memory card coupled to the opposite broad surface of said circuit board whereby coupling between said switch modules and said memory card is across the thickness of the planar interconnection wiring circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification