Rapid temperature cycling for accelerated stress testing

• US 5,318,361 A
• Filed: 06/01/1993
• Issued: 06/07/1994
• Est. Priority Date: 06/01/1993
• Status: Expired due to Fees

• Current Assignee: Telcordia Technologies Incorporated (Telefonaktiebolaget LM Ericsson)
• Original Assignee: Bell Communications Research, Inc. (Telefonaktiebolaget LM Ericsson)
• Inventors: Dugan, Michael P., DeRosa, Francis, Chase, Eugene W., Unger, Burton A.
• Primary Examiner(s): GUTIERREZ, DIEGO F
• Application Number:
  US08/071,425
• Time in Patent Office: 371 Days
• Field of Search: 374/57, 73/865.6, 62/3.3, 62/125
• US Class Current: 374/57
• CPC Class Codes: G01N 17/002 Test chambers
• CPC Class Codes: G01N 3/60 Investigating resistance of materials, e.g. refractory materials, to rapid heat changes thermal testing of structures or apparatus G01M99/002

Abstract

An environmental testing chamber (10) and thermal cycling method in which, in addition to stressing the device (20) under test with electrical bias (32), elevated temperature (12), pressure (16), and humidity (18) while the device is being monitored (32), a thermoelectric heat pump (26) quickly cycles the temperature of the device by pumping heat from the heat sink (22) mounting the device to another larger heat sink (24).

Claims

1. A thermal testing apparatus comprising

a thermally controlled test chamber;

a first body located within said chamber and to which may be thermally sunk a device under test;

a second body located within said chamber;

a heat pump selectively pumping heat between said first and said second body; and

temperature maintaining means for maintaining an ambient temperature within said test chamber to a first temperature, and wherein said heat pump cools said first body to a temperature below said first temperature.

2. A thermal testing apparatus as recited in claim 1, wherein said first and second body are in combination effectively thermally isolated within said chamber.

3. A thermal testing apparatus as recited in claim 1, wherein said first body is effectively thermally isolated from an ambient within said chamber.

4. A thermal testing apparatus as recited in claim 1, wherein said heat pump is a thermoelectric device.

5. A thermal testing apparatus as recited in claim 1, wherein said first body is a first heat sink of a first thermal mass on which said device is detachably mounted and said second body is a second heat sink of a second thermal mass larger than said first thermal mass.

6. A thermal testing apparatus comprsing

a thermally controlled test chamber;

a first body located within said chamber and to which may be thermally sunk a device under test;

a second body located within said chamber;

a heat pump selectively pumping heat between said first and said second body;

a heater maintaining an elevated ambient temperature within said test chamber;

a pressure source maintaining an elevated pressure within said chamber; and

a humidity source maintaining a humidity level within said chamber.

7. A thermal testing apparatus as recited in claim 6, further comprising an electrical tester testing said device while said heat pump, heater, pressure source, and humidity source are being operated.

8. A thermal testing apparatus as recited in claim 6 wherein said heat pump is a thermoelectric device.

9. A method of testing a device comprising the steps of

placing a device under test on a first body inside an enrironmentally controlled chamber;

pumping heat from said first body to a second body within said chamber, whereby a temperature of said device is lowered; and

elevating a temperature within said chamber to an ambient temperature, and wherein said pumping step operates periodically to reduce a temperature of said device from approximately said ambient temperature to a lower temperature.

10. A method as recited in claim 9, further comprising:

maintaining a given humidity level within said chamber; and

pressurizing said chamber to an elevated pressure.

11. A method as recited in claim 9 wherein said device is an electrical or opto-electronic device and further including electrically stressing said device during said pumping step.

12. A method as recited in claim 9, wherein said pumping step uses a thermoelectric cooler.