Semiconductor device having linearly arranged semiconductor chips

• US 5,321,303 A
• Filed: 04/17/1992
• Issued: 06/14/1994
• Est. Priority Date: 12/20/1985
• Status: Expired due to Term

• Current Assignee: Seiko Instruments Incorporated (Seiko Group)
• Original Assignee: Seiko Instruments Incorporated (Seiko Group)
• Inventors: Machida, Satoshi, Kawahara, Yukito, Mukainakano, Hiroshi
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Monin, D.
• Application Number:
  US07/870,808
• Time in Patent Office: 788 Days
• Field of Search: 357/17, 357/19, 357/56, 357/30, 357/55, 257/620, 257/623, 257/452
• US Class Current: 257/620
• CPC Class Codes: B28D 5/022 by cutting with discs or wheels
• CPC Class Codes: H01L 21/3043 Making grooves, e.g. cutting

Abstract

A method for manufacturing a semiconductor device using inclined stage of a dicing saw in order to cut the semiconductor substrate obliquely with respect to the depthwise direction. When a plurality of semiconductor chips diced obliquely are connected, a degree of connecting accuracy is increased, and it is possible to realize a contact-type image sensor of high resolving power and high accuracy.

Claims

1. A semiconductor device comprising:

a plurality of semiconductor chips formed by cutting a wafer using a dicing saw, each chip having opposed obverse and reverse major surfaces bounded by a par of opposed first sides and a pair of opposed second sides respectively, the second sides of the obverse surface being longer than the second sides of the reverse surface, the obverse surface of each chip being for receiving incident radiation, the plurality of semiconductor chips being disposed in a linear arrangement with the obverse surfaces thereof being coplanar with one another and adjacent chips being in contact with each other at the first sides of the obverse surfaces, the adjacent first sides of the reverse surfaces of adjacent chips being spaced apart by a distance of at least 10 μ

m so as to form tapered gaps between the adjacent chips, and a circuit formed on the obverse surface of each semiconductor chip.

2. A semiconductor device according to claim 1;

wherein the reverse surfaces of the linearly arranged semiconductor chips are coplanar with one another.

3. A semiconductor device according to claim 1;

wherein each said semiconductor chip has another pair of opposing sides each of which slopes inwardly in a direction from the long side to the short side of the chip.

4. A semiconductor device according to claim 1;

wherein each of the opposed first sides of each semiconductor chip slopes inwardly in a direction from the obverse surface to the reverse surface.

5. A semiconductor device according to claim 1;

wherein the confronting first sides of each two adjacent semiconductor chips contact one another at a tip of the tapered gap.

6. A semiconductor device according to claim 1;

wherein the circuit on each semiconductor chip includes a light-receiving element.

7. A semiconductor device according to claim 1;

wherein the circuit on each semiconductor chip includes a light-emitting element.

8. A semiconductor device according to claim 1;

wherein the second sides of the obverse surface have a length at least 10 μ

m longer than that of the second sides of the reverse surface.

9. A semiconductor device according to claim 1;

wherein the tapered gaps between the linearly arranged semiconductor chips are all the same.

10. A semiconductor device comprising:

a plurality of semiconductor chips formed by cutting a wafer using a dicing saw, each semiconductor chip having a larger obverse rectangular shaped surface for receiving incident radiation and having a circuit formed thereon and a smaller reverse rectangular shaped surface, the obverse and reverse surfaces being bounded by a pair of opposed first sides and a pair of opposed second sides respectively, each semiconductor chip having a pair of opposing trapezoid shaped side surfaces having a long side defined by a respective second side of the obverse surface and a short side defined by a respective second side of the reverse surface, the plurality of semiconductor chips being arranged in a line so that the first sides of the obverse surfaces of adjacent chips are in direct contact with each other and the first sides of the reverse surfaces of adjacent chips are separated from each other by a distance so as to form a tapered gap between adjacent chips for accommodating dust particles and chippings resulting from the dice saw cutting of the wafer and to enable uniform spacing between the plurality of chips.

11. A semiconductor device according to claim 10;

wherein the circuit includes a light-receiving element.

12. A semiconductor device according to claim 10;

wherein the circuit includes a light-emitting element.

13. A semiconductor device according to claim 10;

wherein the distance between the reverse surfaces of adjacent chips is at least 10 μ

m.

14. A semiconductor device according to claim 10;

wherein the chips are coplanar with one another.

15. A semiconductor device according to claim 10;

wherein the long side defined by the second side of the obverse surface is at least 10 μ

m longer than the short side defined by the second side of the reverse surface.