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Semiconductor device having linearly arranged semiconductor chips

  • US 5,321,303 A
  • Filed: 04/17/1992
  • Issued: 06/14/1994
  • Est. Priority Date: 12/20/1985
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a plurality of semiconductor chips formed by cutting a wafer using a dicing saw, each chip having opposed obverse and reverse major surfaces bounded by a par of opposed first sides and a pair of opposed second sides respectively, the second sides of the obverse surface being longer than the second sides of the reverse surface, the obverse surface of each chip being for receiving incident radiation, the plurality of semiconductor chips being disposed in a linear arrangement with the obverse surfaces thereof being coplanar with one another and adjacent chips being in contact with each other at the first sides of the obverse surfaces, the adjacent first sides of the reverse surfaces of adjacent chips being spaced apart by a distance of at least 10 μ

    m so as to form tapered gaps between the adjacent chips, and a circuit formed on the obverse surface of each semiconductor chip.

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