Method and apparatus for wire bonding semiconductor dice to a leadframe

• US 5,322,207 A
• Filed: 05/03/1993
• Issued: 06/21/1994
• Est. Priority Date: 05/03/1993
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Semiconductor, Inc. (Micron Technology, Inc.)
• Inventors: Ball, Mike, Fogal, Rich, Huang, Chender
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US08/056,656
• Time in Patent Office: 414 Days
• Field of Search: 228/179, 228/4.5, 228/6.2, 228/47.1, 269/903, 269/87.3, 269/40, 269/43
• US Class Current: 228/180.5
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/78251 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/7865 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/78703 Mechanical holding means
• CPC Class Codes: H01L 2224/78744 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

A method and apparatus for wire bonding bond pads formed on semiconductor dice to the lead fingers of a semiconductor leadframe are provided. Using an automated wire bonding apparatus two (or more) adjacent dice attached to the leadframe are wire bonded using a single indexing step for the leadframe. The wire bonding apparatus includes a heat block for heating the two adjacent dice, and a clamp for clamping the two adjacent dice to the heat block for wire bonding. A bonding tool of the wire bonding apparatus is moved to successively wire bond the two adjacent dice. The method of the invention is suitable for DIP, ZIP, SOJ, TSOP, PLCC, SOIC, PQFP, or IDF semiconductor packages.

Claims

1. In semiconductor manufacture a method of wire bonding semiconductor dice attached to a leadframe strip comprising:

providing a wire bonding apparatus having a heat block for heating the dice and leadframe strip, a clamp having multiple bond site windows spaced apart to match the spacing of the dice on the leadframe strip and a bonding tool for wire bonding;

indexing the semiconductor leadframe strip to a precise location within the wire bonding apparatus;

clamping multiple semiconductor dice attached to the leadframe strip between the heat block and clamp of the wire bonding apparatus;

wire bonding bond pads on a first die to lead fingers of the leadframe strip using the bonding tool of the wire bonding apparatus placed through a first bond site window; and

moving the bonding tool to successively wire bond each die clamped between the clamp and heat block with a single index of the leadframe.

2. The method as recited in claim 1 and wherein two dice are clamped and successively wire bonded.

3. The method as recited in claim 1 and further comprising retaining multiple dice in contact with the heat block using multiple vacuum ports formed in the heat block.

4. The method as recited in claim 1 and wherein the semiconductor dice and leadframe are suitable for forming DIP, ZIP, SOJ, TSOP, PLCC, SOIC, PQFP, or IDF type semiconductor packages.

5. In semiconductor manufacture, a method of wire bonding bond pads on semiconductor dice with lead fingers of a semiconductor leadframe comprising;

attaching multiple semiconductor dice to mounting paddles of the leadframe;

providing a wire bonding apparatus having a heat block for heating the dice and a clamp for clamping the dice for wire bonding by a bond tool, with the heat block and clamp adapted to simultaneously clamp and heat multiple dice;

indexing the leadframe to a precise location for clamping multiple semiconductor dice between the clamp and heat block for wire bonding; and

moving the bonding tool to successively wire bond each die clamped between the clamp and heat block with a single index of the leadframe.

6. The method as recited in claim 5 and wherein the heat block and clamp are adapted to wire bond two semiconductor dice with a single index of the leadframe.

7. The method as recited in claim 5 and wherein the semiconductor dice are either DIP, ZIP, SOJ, TSOP, PLCC, SOIC, PQFP, or IDF type dice.

8. The method as recited in claim 5 and wherein the heat block includes multiple die paddle contact areas for contacting multiple die paddles and heating multiple dice.

9. The method as recited in claim 8 and wherein the heat block includes multiple vacuum ports for maintaining the die paddles in contact with the die paddle contact areas.

10. The method as recited in claim 5 and wherein the leadframe is moved from left to right during indexing and the bond tool wire bonds a die furthest to the right first and then moves to the left to wire bond an adjacent die.

11. A method for wire bonding bond pads formed on a semiconductor die to lead fingers of a semiconductor leadframe, comprising;

attaching multiple semiconductor dice to mounting paddles of the leadframe;

providing a wire bonding apparatus having a clamp for clamping two semiconductor dice contained on the leadframe to a heat block for heating the dice and leadframe;

indexing the leadframe to position two adjacent dice for clamping between the clamp and the heat block;

clamping the two adjacent dice between the clamp and the heat block;

wire bonding a first clamped die using a bonding tool placed through a first bond site window of the clamp;

moving the bonding tool to a second clamped die;

wire bonding the second clamped die using the bonding tool placed through a second bond site window of the clamp; and

indexing the leadframe to position a next two adjacent dice for clamping between the clamp and heat block and for wire bonding by the bond tool.

12. The method as recited in claim 11 and wherein the heat block includes two die paddle contact areas for contacting the die paddles and two vacuum ports for maintaining the die paddles in contact with the heat block.

13. The method as recited in claim 12 and wherein the dice are selected from the group consisting of DIP, ZIP, SOJ, TSOP, PLCC, SOIC, PQFP, or IDF type dice.

14. The method as recited in claim 13 and wherein the spacing of the bond site windows matches a spacing of the semiconductor dice on the leadframe.

15. The method as recited in claim 14 and wherein the leadframe is moved to the right and a die furthest to the right is wire bonded first.