Focusing method
First Claim
1. A method of bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of detection of a deviation of the wafer surface from a reference plane of a deviation detecting sensor, comprising the steps of:
- moving the wafer surface to a position close to the reference plane;
detecting a deviation of the wafer surface from the reference plane;
correcting any inclination of the wafer surface in accordance with the detected deviation; and
moving, after said correcting step, the wafer surface along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor.
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Accused Products
Abstract
A method of bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of the detection of the deviation of the wafer surface from a reference plane of a deviation detecting sensor, includes the steps of: moving the wafer surface along an optical axis of the projection optical system, to a position close to the reference plane; detecting a deviation of the wafer surface from the reference plane; and moving the wafer surface on the basis of the detection, to be brought into coincidence with the image plane of the projection optical system.
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Citations
35 Claims
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1. A method of bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of detection of a deviation of the wafer surface from a reference plane of a deviation detecting sensor, comprising the steps of:
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moving the wafer surface to a position close to the reference plane; detecting a deviation of the wafer surface from the reference plane; correcting any inclination of the wafer surface in accordance with the detected deviation; and moving, after said correcting step, the wafer surface along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor. - View Dependent Claims (2)
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3. A method used in manufacturing semiconductor devices by bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of detection of a deviation of the wafer surface from a reference plane of a deviation detecting sensor and by projecting an image of a pattern upon the wafer through the projection optical system, comprising the steps of:
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moving the wafer surface to a position close to the reference plane; detecting a deviation of the wafer surface from the reference plane; correcting any inclination of the wafer surface in accordance with the detected deviation; and moving, after said correcting step, the wafer surface along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor. - View Dependent Claims (4)
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5. A method of bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of detection of deviations of the wafer surface, at different points thereon, from a focal plane of a deviation detecting optical sensor, comprising the steps of:
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moving the wafer surface to a position close to the focal plane of the optical sensor; detecting deviations at the different points of the wafer surface from the focal plane; correcting any inclination of the wafer surface in accordance with the detected deviations; and moving, after said correcting step, the wafer surface along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the focal plane of the optical sensor. - View Dependent Claims (6)
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7. A method used in manufacturing semiconductor devices by bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of detection of deviations of the wafer surface, at different points thereon, from a focal plane of a deviation detecting optical sensor, and by projecting an image of a pattern upon the wafer surface through the projection optical system, comprising the steps of:
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moving the wafer surface to a position close to the focal plane of the optical sensor; detecting deviations at the different points of the wafer surface from the focal plane; correcting any inclination of the wafer surface in accordance with the detected deviations; and moving, after said correcting step, the wafer surface along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the focal plane of the optical sensor. - View Dependent Claims (8)
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9. A method of bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of detection of a deviation of the wafer surface from a reference plane of a deviation detecting sensor, comprising the steps of:
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moving the wafer surface along an optical axis of the projection optical system, to a position close to the reference plane; detecting a deviation of the wafer surface from the reference plane; moving the wafer surface on the basis of the detection, to be brought into coincidence with the reference plane of the deviation detecting sensor; and moving, after said second moving step, the wafer surface along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor. - View Dependent Claims (10, 11)
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12. A method used in manufacturing semiconductor devices by detecting deviations of different surface zones of a wafer from a reference plane of a sensor and by projecting an image of a pattern sequentially onto the surface zones of the wafer through a projection optical system while sequentially bringing the surface zones of the wafer into coincidence with an image plane of the projection optical system in accordance with the detected deviations, wherein a first surface zone of the wafer is brought into coincidence with the image plane of the projection optical system and then the image of the circuit pattern is projected upon the first surface zone through the projection optical system, comprising the steps of:
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after the image projection to the first surface zone, moving a second surface zone of the wafer, adjacent to the first surface zone, to a position close to the reference plane of the sensor; detecting a deviation of the second surface zone from the reference plane; and bringing the second surface zone into coincidence with the reference plane of the sensor, on the basis of the detection; and moving, after said bringing step, the second surface zone along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the sensor. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A semiconductor device manufactured by a method wherein a surface of a wafer is brought into coincidence with an image plane of a projection optical system on the basis of detection of a deviation of the wafer surface from a reference plane of a deviation detecting sensor and wherein an image of a pattern is projected on the wafer through the projection optical system, said method comprising the steps of:
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moving the wafer surface to a position close to the reference plane; detecting a deviation of the wafer surface from the reference plane; correcting any inclination of the wafer surface in accordance with the detected deviation; and moving, after said correcting step, the wafer surface along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor.
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20. A semiconductor device manufactured by a method, wherein a surface of a wafer is brought into coincidence with an image plane of a projection optical system on the basis of detection of deviations of the wafer surface, at different points thereon, from a focal plane of a deviation detecting optical sensor and wherein an image of a pattern is projected on the wafer surface through the projection optical system, said method comprising the steps of:
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moving the wafer surface to a position close to the focal plane of the optical sensor; detecting deviations at the difference points of the wafer surface from the focal plane; correcting any inclination of the wafer surface in accordance with the detected deviations; and moving, after said correcting step, the wafer surface along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the focal plane of the optical sensor.
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21. A semiconductor device manufactured by a method wherein deviations of different surface zones of a wafer from a reference plane of a sensor are detected, wherein an image of a pattern is projected onto the surface zones of the wafer sequentially through a projection optical system while sequentially bringing the surface zones of the wafer into coincidence with an image plane of the projection optical system in accordance with the detected deviations, and wherein a first surface zone of the wafer is brought into coincidence with the image plane of the projection optical system and then the image of the circuit pattern is projected upon the first surface zone through the projection optical system, said method comprising the steps of:
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after the image projection to the first surface zone, moving a second surface zone of the wafer, adjacent to the first surface zone, to a position close to the reference plane of the sensor; detecting a deviation of the second surface zone from the reference plane; bringing the second surface zone into coincidence with the reference plane of the sensor, on the basis of the detection; and moving, after said bringing step, the second surface zone along an optical axis of the projection optical system in accordance with an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the sensor.
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22. A method of bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of detection of the deviation of the wafer surface from a reference plane of a deviation detecting sensor, comprising:
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a first moving step for moving the wafer surface to a position close to the reference plane; a detecting step for detecting the deviation of the wafer surface from the reference plane; and a second moving step for moving the wafer surface along an optical axis of the projection optical system on the basis of the detected deviation by an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor. - View Dependent Claims (23)
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24. A method used in manufacturing semiconductor devices by bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of detection of the deviation of the wafer surface from a reference plane of a deviation detecting sensor and by projecting an image of a pattern upon the wafer through the projection optical system, comprising:
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a first step of moving the wafer surface to a position close to the reference plane and detecting the deviation of the wafer surface from the reference plane; and a second step of moving the wafer surface along an optical axis of the projection optical system in accordance with the detected deviation by an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor. - View Dependent Claims (25)
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26. A method of bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of the detection of deviations of the wafer surface, at different points thereon, from a reference plane of a deviation detecting optical sensor, comprising:
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a first moving step for moving the wafer surface to a position close to the reference plane of the optical sensor; a detecting step for detecting deviations at the different points of the wafer surface from the reference plane; and a second moving step for moving the wafer surface along an optical axis of the projection optical system in accordance with the detected deviation by an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor. - View Dependent Claims (27, 28)
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29. A method used in manufacturing semiconductor devices by bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of detection of deviations of the wafer surface, at different points thereon, from a reference plane of a deviation detecting optical sensor, and by projecting an image of a pattern upon the wafer surface through the projection optical system, comprising:
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a first moving step for moving the wafer surface to a position close to the reference plane of the optical sensor; a detecting step for detecting deviations at the different points of the wafer surface from the reference plane; and a second moving step for moving the wafer surface along an optical axis of the projection optical system in accordance with the detected deviation by an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor. - View Dependent Claims (30)
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31. A method used in manufacturing semiconductor devices by detecting deviations of different surface zones of a wafer from a reference plane of a sensor and by projecting an image of a pattern sequentially onto the surface zones of the wafer through a projection optical system while sequentially bringing the surface zones of the wafer into coincidence with an image plane of the projection optical system in accordance with the detected deviations, wherein a first surface zone of the wafer is brought into coincidence with the image plane of the projection optical system and then the image of the circuit pattern is projected upon the first surface zone through the projection optical system, said method comprising the steps of:
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after the image projection to the first surface zone, moving a second surface zone of the wafer, adjacent to the first surface zone, to a position close to the reference plane of the sensor; detecting a deviation of the second surface zone from the reference plane; and moving the second surface zone along an optical axis of the projection optical system in accordance with the detected deviation by an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor. - View Dependent Claims (32, 33)
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34. A semiconductor device manufactured by a method wherein a surface of a wafer is brought into coincidence with an image plane of a projection optical system on the basis of the detection of the deviation of the wafer surface from a reference plane of a deviation detecting sensor and wherein an image of a pattern is projected on the wafer through the projection optical system, said method comprising the steps of:
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moving the wafer surface to a position close to the reference plane and detecting the deviation of the wafer surface from the reference plane; and moving the wafer surface along an optical axis of the projection optical system in accordance with the detected deviation by an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detection sensor.
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35. A semiconductor device manufactured by a method, wherein a surface of a wafer is brought into coincidence with an image plane of a projection optical system on the basis of the detection of deviations of the wafer surface, at different points thereon, from a reference plane of a deviation detecting optical sensor and wherein an image of a pattern is projected on the wafer surface through the projection optical system, said method comprising the steps of:
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moving the wafer surface to a position close to the reference plane and detecting the deviation of the wafer surface from the reference plane; and moving the wafer surface along an optical axis of the projection optical system in accordance with the detected deviation by an amount which is predetermined on the basis of the deviation of the image plane with respect to the reference plane of the deviation detecting sensor.
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Specification