Overpressure-protected, polysilicon, capacitive differential pressure sensor and method of making the same

• US 5,323,656 A
• Filed: 05/12/1992
• Issued: 06/28/1994
• Est. Priority Date: 05/12/1992
• Status: Expired due to Term

• Current Assignee: Invensys Systems Incorporated (Invensys PLC)
• Original Assignee: The Foxboro Company (Schneider Electric SE)
• Inventors: Chau, Kevin H.-L., Fung, Clifford D.
• Primary Examiner(s): Chilcot, Jr., Richard E.
• Assistant Examiner(s): FELBER, JOSEPH LEON
• Application Number:
  US07/881,707
• Time in Patent Office: 777 Days
• Field of Search: 361/283, 29/25.41, 73/718, 73/724, 73/754
• US Class Current: 73/718
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: Y10S 438/928 Front and rear surface processing
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate
• CPC Class Codes: Y10T 29/43 Electric condenser making

Abstract

A capacitive differential pressure sensing device with pressure overrange protection and a method of making the same are described. The device employs a doped polysilicon diaphragm overlying a cavity in a doped single crystal silicon wafer having a port extending into the cavity from the opposite side. The cavity floor serves as an overrange protector.

Claims

1. A capacitive pressure sensing device comprising,

a silicon wafer doped to a conductive state and having first and second opposed parallel surfaces,

a cavity formed as an opening in said first surface to a prescribed depth with a floor of generally predetermined area at said prescribed depth parallel to said first surface,

a layer of electrically insulating material deposited on said wafer first surface and extending across the opening of said cavity, said layer being treated to place it in a conductive state in a first area overlying at least a portion of said cavity to form a flexible electrically conductive diaphragm;

said second surface of said wafer having an opening providing a passage through said wafer into said cavity, the opening of said passage into said cavity having an area small compared to area of said cavity floor,

first and second electrical contact means for providing independent electrical contacts to said silicon wafer and to said diaphragm, said diaphragm and said cavity floor forming a capacitor whose capacitance varies with variation in differential pressure across said diaphragm.

2. A pressure sensing device in accordance with claim 1 wherein said layer of electrically insulating material is polysilicon and said treatment is doping.

3. A pressure sensing device in accordance with claim 2 wherein a thin dielectric layer is coated on said silicon wafer first surface between said first surface and said polysilicon layer.

4. A device in accordance with claim 2 wherein a second area of said polysilicon layer spaced apart from said first doped area is doped to provide said electrical contact to said wafer.

5. A device in accordance with claim 1 wherein at least one of said cavity floor and a surface of said diaphragm have an electrically insulating coating thereon.

6. A device in accordance with claim 1 wherein said electrical contact to said wafer is made to said second wafer surface.

7. A device in accordance with claim 1 wherein said opening in said second surface is closed so that said device serves as an absolute pressure sensor.

8. A device in accordance with claim 1 wherein said opening in said second surface is open to atmosphere so that said device serves as a gage pressure sensor.

9. A differential capacitive bidirectional pressure sensing device comprising,

a first sensor module having,

a single crystal silicon wafer doped to a conductive state and having first and second opposed parallel surfaces,

a cavity formed as an opening in said first surface to a prescribed depth with a floor of generally predetermined area at said prescribed depth parallel to said first surface,

a layer of electrically insulating material deposited on said wafer first surface and extending across the opening of said cavity, said layer being treated to render it in an electrically conductive state in an area overlying at least a portion of said cavity to form a flexible electrically conductive diaphragm;

said second surface of said wafer having an opening providing a passage through said wafer into said cavity, the opening of said passage into said cavity having an area small compared to the area of said cavity floor,

said cavity floor serving as an overrange pressure stop for pressure acting to move said diaphragm toward said cavity floor,

first and second electrical contact means for providing independent electrical contacts to said silicon wafer and to said diaphragm, said wafer and said diaphragm forming a capacitor whose capacitance varies with variations in differential pressure across said diaphragm;

a second sensor module formed substantially identical to said first module;

said modules being joined together by placing each module'"'"'s electrically insulating layers in facing juxtaposition and bonded together, said first module and said second module diaphragms being connected together electrically, thereby forming a pair of capacitors with a common flexible electrode to provide variations in the capacitances of said pair of capacitors in response to variations in differential pressure across said common flexible

10. A differential pressure sensing device in accordance with claim 9, wherein said layer of electrically insulating material on at least one of said modules is polysilicon and said layer is treated by doping to place it in a conductive state.

11. A differential pressure sensing device in accordance with claim 10 comprising a thin dielectric layer coated on said silicon wafer first surface between said first surface and said polysilicon layer.

12. A differential capacitive bidirectional Pressure sensing device comprising,

a first sensor module having,

a single crystal silicon wafer doped to a conductive state and having first and second opposed parallel surfaces,

a cavity formed as an opening in said first surface to a prescribed depth with a floor of generally predetermined area at said prescribed depth parallel to said first surface,

a layer of polysilicon deposited on said wafer first surface and extending across the opening of said cavity, said polysilicon being doped to a conductive state in an area overlying at least a portion of said cavity to form a flexible electrically conductive diaphragm;

said second surface of said wafer being formed with an opening providing a passage through said wafer into said cavity, the opening of said passage into said cavity having an area small compared to the area of said cavity floor,

said cavity floor serving as an overrange pressure stop for pressure acting to move said diaphragm toward said cavity floor,

a second sensor module comprising,

a second single crystal silicon wafer doped to a conductive state and having first and second opposed parallel surfaces,

a cavity formed as an opening in said second wafer first surface to a prescribed depth with a floor of generally predetermined area at said prescribed depth parallel to said first surface,

said second surface of said second wafer being formed with an opening providing a passage through said wafer into said cavity, the opening of said passage into said cavity having an area small compared to the area of said cavity floor, said cavity floor serving as an overrange pressure stop for pressure acting to move said diaphragm toward said second wafer cavity floor,

said first and second modules being joined together by placing said first module'"'"'s polysilicon layer in contact with and bonded to, said second module'"'"'s silicon wafer first surface,

electrical contact means for providing independent electrical contacts to said first and second silicon wafers and to said diaphragm, thereby forming a pair of capacitors with a common flexible electrode to Provide variations in the capacitances of said pair of capacitors in response to variations in differential pressure across said diaphragm.

13. A differential pressure sensing device in accordance with claim 12 wherein a first thin dielectric layer is coated on said first wafer first surface between said first wafer first surface and said polysilicon layer and a second thin dielectric layer is coated on said second wafer first surface between said second wafer first surface and said polysilicon layer.

14. A differential pressure sensing device in accordance with claim 13 wherein said polysilicon layer is bonded to said second module'"'"'s silicon wafer'"'"'s first surface through a dielectric bonding material.

15. A bidirectional differential pressure sensing device comprising,

a single crystal silicon wafer doped to a conductive state and having first and second opposed parallel surfaces;

a cavity formed as an opening in said first surface to a prescribed depth, said cavity being formed as a two step recess, the first recess being of larger diameter than the second recess, the second recess having a generally predetermined area, and extending from the floor of said first recess toward said second wafer surface,

a layer of electrically insulating material deposited on said first recess floor and extending across the opening of said second recess, said electrically insulating layer being treated to become conductive in an area overlying a portion of said second recess to form an electrically conductive flexible diaphragm,

said wafer second surface having an opening providing a passage through said wafer into said second recess, the opening of said passage into said second recess being of area small compared to the area of said floor,

a glass sheet placed on said wafer first surface and bonded to it, said glass sheet overlying said cavity opening, said glass sheet having a conductive area overlying a portion of said cavity, said portion being generally aligned with the area of said second recess floor,

first, second and third electrical contacts for providing independent electrical contact to said silicon wafer, to said electrically conductive area of said electrically insulating layer and to said glass plate conductive area, and

means for allowing fluid pressure into the volume between said diaphragm and said glass plate.

16. A pressure sensing device in accordance with claim 15 where said layer of electrically insulating material is polysilicon and said treatment is doping.

17. A pressure sensing device in accordance with claim 16 wherein a thin layer of dielectric material is coated on said silicon wafer first surface between said first surface and said polysilicon layer.