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Method of forming a semiconductor structure having an air region

  • US 5,324,683 A
  • Filed: 06/02/1993
  • Issued: 06/28/1994
  • Est. Priority Date: 06/02/1993
  • Status: Expired due to Fees
First Claim
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1. A method for forming a semiconductor device having an air region, the method comprising the steps of:

  • providing a base layer of material;

    forming a first conductive element overlying the base layer, the first conductive element having a sidewall;

    forming a second conductive element overlying the base layer, the second conductive element having a sidewall and being physically separated from the first conductive element by an opening;

    forming a first sidewall spacer having a top portion, the first sidewall spacer being laterally adjacent the sidewall of the first conductive element;

    forming a second sidewall spacer having a top portion, the second sidewall spacer being laterally adjacent the sidewall of the second conductive element;

    forming a plug layer within the opening between the first conductive element and the second conductive element, the plug layer exposing the top portion of the first sidewall spacer and the top portion of the second sidewall spacer; and

    removing both the first and second sidewall spacers to form the air region between the first conductive element and the second conductive element.

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