Multi-layer type semiconductor device with semiconductor element layers stacked in opposite direction and manufacturing method thereof

• US 5,324,980 A
• Filed: 08/07/1992
• Issued: 06/28/1994
• Est. Priority Date: 09/22/1989
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Kusunoki, Shigeru
• Primary Examiner(s): Crane, Sara W.
• Application Number:
  US07/925,672
• Time in Patent Office: 690 Days
• Field of Search: 257/74, 257/57, 257/59, 257/66, 257/72, 257/686, 257/723, 257/84
• US Class Current: 257/74
• CPC Class Codes: H01L 21/76256 using silicon etch back techniques, e.g. BESOI, ELTRAN
• CPC Class Codes: H01L 2221/6835 used as a support during build up manufacturing of active devices
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 27/0688 Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: Y10S 438/928 Front and rear surface processing

Abstract

A multi-layer type semiconductor device is disclosed, in which a plurality of semiconductor layers are formed in vertically opposite directions. The multi-layer type semiconductor device is obtained by forming a first semiconductor layer, an insulating layer and a second semiconductor layer in the mentioned order on a main surface of a first substrate, forming a semiconductor device by using the second semiconductor layer as a base, with an exposed surface thereof directed upward, forming an insulating film on the semiconductor device, attaching a second substrate to the insulating film, thinning the first substrate to expose the first semiconductor layer, and forming a further semiconductor device by using the first semiconductor layer as a base, with an exposed surface of the first semiconductor layer directed upward. A single- chip type image forming system or sensing system may be provided by employing, as the semiconductor devices, a sensing device such as a photosensor, a pressure sensor or the like, a processing circuit for processing a signal received from the sensor, and a display device for displaying results of the processing. A large number of pads may be provided by arranging the pads on opposite surfaces of a chip.

Claims

1. A multi-layer type semiconductor device, comprising:

a substrate having a main surface;

a first semiconductor element layer formed on said main surface of said substrate and including a first semiconductor element having an active layer portion, a gate portion and a gate insulating film portion vertically therebetween;

an insulating layer formed on the active layer portion of said first semiconductor layer; and

a second semiconductor element layer formed on said insulating layer and including a second semiconductor element having an active layer portion adjacent said insulating layer, a gate portion and a gate insulating film portion therebetween;

the first and second elements being oriented in vertical alignment to each other and back-to-back on said first and second semiconductor element layers.

2. A multi-layer semiconductor device, comprising:

a substrate having a main surface;

a first semiconductor element layer formed on said main surface of said substrate and including a first semiconductor element having an active layer portion, a gate portion and a gate insulating film portion vertically therebetween, and a first field oxide layer for interelement isolation;

an insulating layer formed on the active layer portion of said first semiconductor layer; and

a second semiconductor element layer formed on said insulating layer and including a second semiconductor element having an active layer portion adjacent said insulating layer, a gate portion and a gate insulating film portion therebetween, and a second field oxide layer for element isolation;

the first and second elements being oriented in vertical alignment to each other and back-to-back on said first and second semiconductor element elements.

3. The device of claim 2, wherein said first and second field oxide layers contact opposite surfaces of said insulating layer.

4. The device of claim 3, including a conductor filling said through-hole and contacting opposite surfaces of said first and second semiconductor element layers.

5. A multi-layer type semiconductor device, comprising:

a substrate having a main surface;

a first semiconductor element layer formed on said main surface of said substrate and including a first semiconductor element having an active layer portion, a gate portion and a gate insulating film portion vertically therebetween;

an insulating layer formed on the active layer portion of said first semiconductor layer; and

a second semiconductor element layer formed on said insulating layer and including a second semiconductor element having an active layer portion adjacent said insulating layer, a gate portion and a gate insulating film portion therebetween;

the first and second elements being located in regions surrounded by field oxide layers for element isolation formed in contact with said insulating layer and being oriented back-to-back on said first and second semiconductor element layers, each of said regions including one or more of the semiconductor elements.

6. A multi-layer type semiconductor device, comprising:

a substrate having a main surface;

a first semiconductor element layer formed on said main surface of said substrate and including a first semiconductor element having an active layer portion, a gate portion and a gate insulating film portion vertically therebetween;

an insulating layer formed on the active layer portion of said first semiconductor layer; and

a second semiconductor element layer formed on said insulating layer and including a second semiconductor element having an active layer portion adjacent said insulating layer, a gate portion and a gate insulating film portion therebetween, a field oxide layer for element isolation and an interlayer insulation film;

said second semiconductor element being isolated by said field oxide layer for element isolation and said interlayer insulation film;

the first and second elements being oriented back-to-back on said first and second semiconductor element layers.

7. The device of claim 6, wherein a through-hole is formed only through said field oxide layer and said interlayer insulation film.

8. A multi-layer type semiconductor device, comprising:

a substrate having a main surface;

a first semiconductor element layer formed on said main surface of said substrate and including a first semiconductor element having an active layer portion, a gate portion and a gate insulating film portion vertically therebetween;

an insulating layer formed on the active layer portion of said first semiconductor layer; and

a second semiconductor element layer formed on said insulating layer and including a second semiconductor element having an active layer portion adjacent said insulating layer, a gate portion and a gate insulating film portion therebetween;

the first and second elements being oriented back-to-back on said first and second semiconductor element layers;

the thickness of each of the semiconductor element layers being less than 1 μ

m.