Bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element
First Claim
1. A bonded type piezoelectric apparatus, comprising:
- a piezoelectric ceramic material having at least one planar surface;
an active layer of metal selected from the group consisting of Zr, Nb, Mo, Hf, Ta and W provided directly on said at least one planar surface;
a securing member to which said piezoelectric ceramic material is bonded via a bonding layer provided between said active layer and said securing member; and
a solder layer having a high fusibility with said bonding layer provided between said active layer and said bonding layer.
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Accused Products
Abstract
The features of the present invention are 1) to apply metallization on the bonding surface of a piezoelectric ceramic with a metal likely to react with the piezoelectric ceramic material, 2) when the piezoelectric ceramic material is soldered on the bonding surface, to apply metallization with a metal likely to react with the solder material, 3) to provide between the metallizing layers formed in 1) and 2) a metallizing layer including metal which prevents reaction between the metals and their diffusion, 4) to use a mounting member for the piezoelectric ceramic which has substantially the same thermal expansion coefficient as the piezoelectric ceramic in non-polarization condition and 5) to solder in the non-polarization condition and thereafter to polarize. As the result, a bonded type piezoelectric apparatus with a high reliability or with a broad application temperature range near from the absolute zero temperature to the Curie point of the piezoelectric element, and a method of manufacturing the same are provided.
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Citations
13 Claims
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1. A bonded type piezoelectric apparatus, comprising:
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a piezoelectric ceramic material having at least one planar surface; an active layer of metal selected from the group consisting of Zr, Nb, Mo, Hf, Ta and W provided directly on said at least one planar surface; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer provided between said active layer and said securing member; and a solder layer having a high fusibility with said bonding layer provided between said active layer and said bonding layer. - View Dependent Claims (2)
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3. A bonded type piezoelectric apparatus, comprising:
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a piezoelectric ceramic material having at least one planar surface; an active layer of metal selected from the group consisting of Zr, Nb, Mo, Hf, Ta and W provided directly on said at least one planar surface; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer provided between said active layer and said securing member; a solder layer having a high fusibility with said bonding layer provided between said active layer and said bonding layer; and a barrier layer provided between said active layer and said solder layer, said barrier layer preventing diffusion of the metals in said active layer and said solder layer. - View Dependent Claims (4)
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5. A bonded type piezoelectric apparatus, comprising:
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a piezoelectric ceramic material having at least one planar surface; an active layer of a metal having a high fusibility with said piezoelectric ceramic material provided directly on said at least one planar surface; a solder layer provided on said active layer; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer made of a metallic solder material provided between said solder layer and said securing member, wherein said securing member is made of a material having a thermal expansion coefficient substantially the same as that of said piezoelectric ceramic material when said piezoelectric ceramic material is in a non-polarization condition; wherein said solder layer is made of a metal having a high fusibility with said bonding layer and wherein said securing member is a metal mounting plate or an insulating ceramic securing member. - View Dependent Claims (6, 7)
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8. A bonded type piezoelectric apparatus, comprising:
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a piezoelectric ceramic material having at least one planar surface; an active layer of a metal having a high fusibility with said piezoelectric ceramic material provided directly on said at least one planar surface; a solder layer provided on said active layer; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer made of a metallic solder material provided between said solder layer and said securing member; wherein said solder layer is made of a material selected from the group consisting of gold and silver having a high fusibility with said bonding layer and wherein said securing member is a metal mounting plate or an insulating ceramic securing member.
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9. A bonded type piezoelectric apparatus, comprising:
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a piezoelectric ceramic material having at least one planar surface; an active layer of a metal having a high fusibility with said piezoelectric ceramic material provided directly on said at least one planar surface; a solder layer provided on said active layer; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer made of a metallic solder material provided between said solder layer and said securing member, wherein said solder layer is made of a metal having a high fusibility with said bonding layer and wherein said securing member is a metal mounting plate or an insulating ceramic securing member; and further comprising a barrier layer provided between said active layer and said solder layer, said barrier layer preventing diffusion of the metals in said active layer and said solder layer. - View Dependent Claims (10, 11)
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12. A bonded type piezoelectric apparatus comprising:
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a piezoelectric ceramic material having at least one planar surface; a metallizing layer provided directly on said one major planar surface; and a metal mounting plate to which said piezoelectric ceramic material is bonded via a bonding layer;
wherein said metal mounting plate is made of a material having a thermal expansion coefficient substantially the same as that of said piezoelectric ceramic material when said piezoelectric ceramic material is in a non-polarization condition. - View Dependent Claims (13)
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Specification