Semiconductor package

• US 5,326,932 A
• Filed: 10/22/1992
• Issued: 07/05/1994
• Est. Priority Date: 01/14/1992
• Status: Expired due to Term

• Current Assignee: Goldstar Electron Co., Ltd. (SK Hynix Inc.)
• Original Assignee: Goldstar Electron Co., Ltd. (SK Hynix Inc.)
• Inventors: You, Jin Sung
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): LEDYNH, BOT L
• Application Number:
  US07/964,718
• Time in Patent Office: 621 Days
• Field of Search: 174/52.2, 174/52.4, 174/258, 174/259, 174/260, 361/392, 361/394, 361/395, 361/397, 361/399, 361/400, 257/678, 257/687, 257/690, 257/693, 257/701, 257/704
• US Class Current: 174/557
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

A semiconductor package comprising a semiconductor chip received in and attached to a cavity of a base made of a ceramic or aluminum, by means of an adhesive, a lid fixedly attached to the upper surface of the semiconductor chip, the lid having a plurality of solder bumps being in contact with bonding pads of the semiconductor chip and a plurality of metal contacts formed on the solder bumps of the lid. The lid comprises an insulating polyimide film or a rectangular plate made of a nonconductive ceramic material. The semiconductor package eliminates the use of a lead frame and metal wires, thereby enabling the manufacture thereof to be simplified. It also achieves a simplification, a lightness, a thinness, a compactness in construction. With the simplified construction, a reduction in manufacture cost and an improvement in productivity are achieved. In manufacturing semiconductor devices, the semiconductor package also provides an improvement in the degree of dense integration.

Claims

1. A semiconductor package comprising:

a semiconductor chip provided on its upper surface at opposite side edges thereof with a plurality of bonding pads;

a base provided with a cavity in which the semiconductor chip is seated;

a lid fixedly attached to an upper surface of the semiconductor chip received in the cavity for electrically insulating the semiconductor package;

a plurality of solder bumps formed in said lid and being disposed on and in direct contact with the bonding pads, respectively;

a plurality of metal contacts formed on and in direct contact with the solder bumps of the lid, respectively; and

said semiconductor chip being fixedly attached to the cavity of the base by an adhesive material.

2. A semiconductor package in accordance with claim 1, wherein the adhesive is made of a polyimide material or an epoxy material.

3. A semiconductor package in accordance with claim 1, wherein the base is made of a ceramic or an aluminum.

4. A semiconductor package in accordance with claim 1, wherein the lid comprises a polyimide film.

5. A semiconductor package in accordance with claim 1, wherein the lid is made of a ceramic.