Headphone apparatus

• US 5,327,507 A
• Filed: 04/04/1991
• Issued: 07/05/1994
• Est. Priority Date: 04/10/1990
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Suzuki, Akihisa
• Primary Examiner(s): Kuntz, Curtis
• Assistant Examiner(s): Le, Huyen D.
• Application Number:
  US07/680,253
• Time in Patent Office: 1,188 Days
• Field of Search: 381/183, 381/187, 381/159, 381/199, 381/192, 381/158, 181/129, 181/128, 181/135
• US Class Current: 381/370
• CPC Class Codes: H04R 1/1016 Earpieces of the intra-aural type

Abstract

An inner-ear type headphone apparatus includes a diaphragm, a driving portion, a backside wall, and a sealed wall plane. A diaphragm backside space is formed between the diaphragm and the driving portion. The driving portion drives the diaphragm. A back cavity communicates with a diaphragm backside space. The back cavity is formed between the driving portion and the backside wall. There is a sound-absorbing space between the backside wall and the sealed wall plane. The backside wall is provided with through-holes communicating the back cavity with the sound-absorbing space. The sound absorbing space is separated from external space by the sealed wall plane. Sound output of low frequency range is enhanced for the user of the headphone apparatus, with satisfactory frequency characteristics maintained where there is no drop in sound output of middle frequency range. Also, the amount of leakage of unpleasant sound wave of high frequency range to external space is reduced.

Claims

1. A headphone apparatus comprising:

a diaphragm,

a driving portion forming a first space between said driving portion and said diaphragm,

a first wall provided to form a second space between said driving portion and said first wall, said second space communicating with said first space via holes,

a second wall provided to form a third space between said first wall and said second wall,

wherein said first wall includes through-holes communicating said second space with third space, and said third space is separated from external space by said second wall which seals and encloses said through-holes from said external space, so that waves of high frequency emitted via said through-holes do not pass to the external space, the capacity of said third space is greater than said second space and the capacity of said third space is ten times that of said second space.