Electronic module including a programmable memory

• US 5,331,591 A
• Filed: 02/01/1993
• Issued: 07/19/1994
• Est. Priority Date: 02/01/1993
• Status: Expired due to Term

• Current Assignee: American Telephone & Telegraph Company (AT&T, Inc.), Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften e.V. (Max-Planck-Gesellschaft zur Frderung der Wissenschaften e)
• Original Assignee: AT&T, Inc.
• Inventors: Clifton, Mark B.
• Primary Examiner(s): Fears, Terrell W.
• Application Number:
  US08/011,567
• Time in Patent Office: 533 Days
• Field of Search: 365/51, 365/189.01, 365/230.01, 365/182
• US Class Current: 365/182
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 7/023 Stackable modules

Abstract

An electronic module (10) includes a processor (12), having a set of contacts (26) coupled to a set of metallized areas (24) on a first device carrier (16), and a programmable memory device (14), having a set of contacts (40) coupled to each of a set of conductive members (46) depending from a second device carrier (33) stacked above the first carrier. Interposed between the two device carriers is an interposer layer (48), a routing layer (60) and a conduction layer (70) which collectively provide a path between a separate first metallized area (24) on the first device carrier and a conductive member (46) on the second device carrier to couple the processor to the memory. At least one clip (72) releasably secures the second device carrier to the first device carrier to allow the second device carrier to be separated so that the programmable memory device can be programmed off-line.

Claims

1. An electronic module comprising:

a first device carrier having a plurality of first metallized areas arrayed on a first surface and a plurality of first conductive members depending from a second, opposed surface, each first conductive member electrically connected to a separate first metallized area;

a processor carried on the first surface of the first device carrier and having a plurality of electrical contacts, each electrically coupled to a separate first metallized area;

a second device carrier in spaced registration above the first device carrier, the second device carrier having a plurality of second metallized areas arrayed on a first surface and a plurality of second conductive members extending below a second, opposed surface and arrayed differently than the first metallized areas, each second conductive member electrically connected to a separate second metallized area;

a programmable memory device carried on the first surface of the second device carrier and the device having a plurality of electrical contacts each coupled to a separate second metallized area;

an intermediate layer overlying the first surface of the first device carrier and having an opening sized to receive the processor, the intermediate layer having a plurality of third metallized areas on a first surface arrayed the same as the second conductive members, and a plurality of third conductive members depending from a second, opposed major surface, each aligned for electrical contact with, and attachment to, a separate one of the first metallized areas, each third conductive member electrically connected to a corresponding third metallized area;

a conduction layer interposed between the intermediate layer and the second device carrier for providing a conductive path between each third metallized area and each second conductive member; and

means for releasably securing the second device carrier and the conduction layer to the intermediate layer so that the first and second device carriers are stacked one above the other.

2. The module according to claim 1 wherein the intermediate layer comprises:

an interposer layer having an opening centrally located therein, the interposer layer having an array of metallized areas on a first surface and an array of conductive members on a second, opposed surface, arrayed the same as the first metallized areas on the first device carrier, each metallized area electrically connected to each conductive member; and

a routing layer overlying the interposer layer, the routing layer having a plurality of metallized areas on a first surface arrayed the same as the second conductive members on the second device carrier, and a plurality of conductive members on a second, opposed surface arrayed the same as the third metallized areas on the interposer layer, each metallized area on the first surface of the routing layer electrically connected to a separate conductive member on the second surface thereof.

3. The module according to claim 2 wherein each conductive member on the routing layer and on the interposer layer comprises a conductive epoxy bump.

4. The module according to claim 1 wherein each first conductive member comprises a high-temperature solder bump.

5. The module according to claim 1 wherein each second conductive member comprises a low-temperature solder bump.

6. The module according to claim 1 wherein the conduction layer comprises a slab of anisotropically conductive, elastomeric polymer interface material.

7. The module according to claim 1 wherein the retaining means comprises at least one clip.

8. The module according to claim 1 further including a plurality of pins, protruding through the intermediate layer and the engaging device carriers, the conduction layer, and the second device carrier to maintain them in alignment with each other.

9. The module according to claim 1 wherein the processor and the programmable memory are each comprised of an unpackaged semiconductor die.