Method and apparatus for making printed circuit boards

• US 5,334,279 A
• Filed: 08/27/1993
• Issued: 08/02/1994
• Est. Priority Date: 04/08/1993
• Status: Expired due to Term

• Current Assignee: George D. Gregoire
• Original Assignee: George D. Gregoire
• Inventors: Gregoire, George D.
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/113,392
• Time in Patent Office: 340 Days
• Field of Search: 156/630, 156/631, 156/634, 156/645, 156/654, 156/655, 156/659.1, 156/901, 156/660, 156/902, 156/905, 156/150, 156/151, 156/233, 156/298, 156/242, 156/245, 156/656 , 156/289, 156/500, 29/846, 29/848, 29/849, 428/156, 428/163, 428/167, 428/209, 428/901, 430/313, 430/318, 430/323, 264/232, 264/233, 264/255, 264/265, 264/266, 264/272.15, 264/272.17, 264/278, 264/511
• US Class Current: 216/20
• CPC Class Codes: B29C 33/3878 used as masters for making successive impressions
• CPC Class Codes: B29C 33/42 characterised by the shape of the moulding surface, e.g. ribs or grooves
• CPC Class Codes: B29C 33/56 Coatings , e.g. enameled or galvanised; Releasing, lubricating or separating agents in-mould coating B29C37/0028; using or applying separating agents B29C37/0067
• CPC Class Codes: B29L 2031/3425 Printed circuits
• CPC Class Codes: B44C 1/22 Removing surface-material, e.g. by engraving, by etching for multi-layer articles B44C3/005
• CPC Class Codes: H01K 3/22 Exhausting, degassing, filling, or cleaning vessels
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/09581 Applying an insulating coating on the walls of holes
• CPC Class Codes: H05K 2201/09827 Tapered, e.g. tapered hole, via or groove bevelled, chamferred or tapered edge H05K2201/09154
• CPC Class Codes: H05K 2201/09863 Concave hole or via
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/0113 Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/025 : by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: H05K 3/061 : Etching masks
• CPC Class Codes: H05K 3/107 : by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence
• CPC Class Codes: H05K 3/205 : using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: H05K 3/384 : by plating
• CPC Class Codes: H05K 3/385 : by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base
• CPC Class Codes: Y10T 428/24479 : including variation in thickness
• CPC Class Codes: Y10T 428/24537 : Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/2457 : Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/24917 : including metal layer

Abstract

A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.

Claims

1. In a method of making a printed circuit board including a planar substrate having thereon a desired electrical circuit pattern with metallized solder lands thereof disposed out of the plane of the substrate, the steps of making a three dimensional female predecessor tool, comprising:

using a photo tool having emulsion areas thereon corresponding to the desired electrical circuit pattern and the metallized out of plane solder lands thereof;

dimensioning a metallic plate to conform to the planar surface area of the printed circuit board;

coating at least one surface of said metallic plate with a light sensitive material;

placing said photo tool on the coated surface of said metallic plate so the emulsion areas thereon are properly aligned on the surface to facilitate formation of the desired electrical circuit pattern and the metallized out of plane solder lands thereof;

exposing said photo tool disposed on said plate to high intensity light to form a desired pattern in said light sensitive material to facilitate formation of the desired metallized out of plane solder lands of the printed circuit board;

removing the unwanted areas of said light sensitive material to expose portions of the metallic plate to be etched with said desired pattern; and

etching said desired pattern in the exposed surface of said metallic plate to form in the resulting three dimensional predecessor tool out of plane portions corresponding substantially to the solder lands of the printed circuit board.

2. A three dimensional female predecessor tool made according to the method of claim 1.

5. A method of making a three dimensional female predecessor tool according to claim 1, wherein said light sensitive material is photoresist.

6. A method of making a three dimensional female predecessor tool according to claim 1, wherein said high intensity light is ultraviolet light.

3. In a method of making a printed circuit board including a planar substrate having thereon a desired electrical circuit with metallized solder lands thereof disposed out of the plane of the substrate, the steps of making a three dimensional male tool, comprising:

coating a three dimensional female predecessor master tool having out of plane portions corresponding substantially to the out of plane solder lands of the printed circuit board, with a weak adhesion material;

depositing a thin layer of metallic material on the out of plane portions of the coated female predecessor master tool;

forming a backing on the deposited metallic material to help rigidify it;

separating said thin layer of metallic material from said female predecessor master tool to form the resulting three dimensional male mold tool, said male mold tool having metallized out of plane portions complementary shaped relative to the out of plane solder lands of the printed circuit board.

4. A three dimensional male mold tool made according to the method of claim 3.

7. A method of making a metallized plastic member, comprising:

coating a mold member with a thin layer of weak adhesion material;

electroplating to said mold member a thin layer of metallic material;

coating one surface of said thin layer of metallic material with a strong adhesion promoting substance;

engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween;

filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration;

whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member.

8. A method of making a metallized plastic member according to claim 7, wherein said mold member is configured in the shape of a substrate with a plurality of grooves disposed in the surface thereof.

9. A method of making a metallized plastic member according to claim 8, wherein said substrate is a blank printed circuit board substrate.

10. A method of making a metallized plastic member according to claim 7, wherein said step of electroplating includes coating said mold member with a weak adhesion metallic material.

11. A molded plastic member having an adhesive bonded metallized surface made according to the method of claim 7.

12. A method of making a metallized plastic member comprising:

coating a mold member with a thin layer of weak adhesion material;

electroplating to the coated mold member a thin layer of metallic material;

coating one surface of said thin layer of metallic material with a strong adhesion promoting substance;

engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween;

filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration;

whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member; and

wherein said step of coating with a thin layer of weak adhesion material includes bathing said mold member in a weak adhesion solution of water and copper sulfate.

13. A method of making a metallized plastic member comprising:

coating a mold member with a thin layer of weak adhesion material;

electroplating to the coated mold member a thin layer of metallic material;

coating one surface of said thin layer of metallic material with a strong adhesion promoting substance;

engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween;

filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration;

whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member; and

wherein said step of coating with a thin layer of weak adhesion material includes spraying said mold member with a thin coating of graphite.

14. A method of making a metallized plastic member comprising:

coating a mold member with a thin layer of weak adhesion material;

electroplating to the coated mold member a thin layer of metallic material;

coating one surface of said thin layer of metallic material with a strong adhesion promoting substance;

engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween;

filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration;

whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member; and

wherein said step of coating with a thin layer of metallic material includes vacuum metallizing said mold member with a thin coat of metallic material.