IC socket and its contact pin

• US 5,336,096 A
• Filed: 08/18/1992
• Issued: 08/09/1994
• Est. Priority Date: 03/22/1991
• Status: Expired due to Fees

• Current Assignee: Enplas Corporation
• Original Assignee: Enplas Corporation
• Inventors: Harada, Hiroaki, Ozawa, Kazuhisa
• Primary Examiner(s): Bradley, P. Austin
• Application Number:
  US07/931,925
• Time in Patent Office: 721 Days
• Field of Search: 439/70-73, 439/81-83, 439/330, 439/331, 439/525, 439/526
• US Class Current: 439/72
• CPC Class Codes: H01R 13/2442 with a single cantilevered beam
• CPC Class Codes: H05K 7/1069 with spring contact pieces

Abstract

A contact pin having a thin wall construction that makes good electrical connection with an IC socket without insulation due to oxide film forming on the surface of the lead and which does not easily break due to plastic deformation. An IC socket has a feature to prevent an IC device position from deviating and deforming its leads which can automatically position the IC device for secure contact with contact pins of an IC frame having leads by limited positioning of the IC device on a stage.

Claims

1. An IC socket, comprising in combination:

a socket body having multiple contact pins aligned for electrical connection with leads of an IC device,

actuation fitting projections,

spring means;

an intermediate plate placed to be vertically movable to move up by means of said spring means,

stage means on said intermediate plate for mounting an IC device,

a slope for guiding the leads of the IC device,

a rest for positioning the IC device,

a floating plate for restricting the intermediate plate from moving up,

a cover being linked with the socket body, having a pad with projections capable of fitting with projections of the intermediate plate; and

,

characterized by;

said cover projections constructed to press the projections of the intermediate plate to lower the intermediate plate down to restrict the sides of the contact pins as the cover is closed,

said IC device mounted on the stage of the intermediate plate on the rest;

said cover pad pressing the contact pins into electrical connection with the leads.

2. An IC socket comprising;

a socket body having multiple contact pins aligned for electrical connection with electrical leads of an IC device;

actuation fitting projection means;

spring biasing means;

a vertically movable intermediate plate means positioned for vertical movement by said spring biasing means, said intermediate plate means having an angled slope for guiding the leads of an IC device into position and a rest for positioning said IC device;

stage means on said intermediate plate for receiving and mounting said IC devices;

a restricting floating plate means restricting upward movement of said intermediate plate;

a cover hingedly linked to said socket body;

said cover having projections constructed to fit with projections on said intermediate plate;

said projections on said cover constructed to press and lower said intermediate plate down thereby restricting the side of said contact pins as said cover is moved to a closed position; and

Ic device on said stage of said intermediate plate being positioned on said rest;

said pad on said cover pressing said leads of said Ic device into contact with said contact pin when said cover is closed.

3. An IC socket, characterized by:

multiple ring-like contact pins aligned on a socket body to contact leads of an IC device;

pressing means for pressing a body having leads of said IC device to press a respective contact pin to a respective lead of said IC device body, said pressing means comprising a cover having a pad linked to said socket body to press said IC device when closed; and

,

a shaft having guide walls to be placed between each respective contact pin, said shaft being inserted in said rings of each respective contact pin, said shaft being fixed on said socket body so that said contact pins are isolated from each other.