Integrated circuit package for an image sensor

• US 5,337,217 A
• Filed: 02/25/1993
• Issued: 08/09/1994
• Est. Priority Date: 02/25/1993
• Status: Expired due to Fees

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Tarn, Terry
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): LEDYNH, BOT L
• Application Number:
  US08/023,024
• Time in Patent Office: 530 Days
• Field of Search: 361/728, 361/730, 361/748, 361/752, 361/760, 361/761, 361/767, 361/784, 361/796, 361/807, 174/52.1, 174/52.2, 174/52.3, 174/52.4, 174/52.5, 257/678, 257/680, 257/681, 257/703, 257/704
• US Class Current: 361/784
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An integrated circuit package for a charge-coupled image sensor. The package comprises first and second ceramic bodies being fused together to form a unitary structure; a CCD image sensor mounted on the first ceramic body; and, electrical circuitry mounted on the second ceramic body.

Claims

1. An integrated circuit package comprising:

(a) first and second ceramic bodies being fused together to form a T-shaped unitary structure;

(b) a CCD image sensor mounted on the first ceramic body; and

(c) electrical circuitry mounted on the second ceramic body wherein the first ceramic body and the second ceramic body have an arrangement that accommodates the CCD image sensor having an ever increasing diminution in size and the electrical circuitry having a concomitant increase in size.

2. An integrated circuit package according to claim 1, wherein the first ceramic body comprises a parallelepiped.

3. An integrated circuit package according to claim 2, wherein the parallelepiped comprises a length from 5 mm to 8 mm.

4. An integrated circuit package according to claim 2, wherein the parallelepiped comprises a thickness of approximately 1 mm.

5. An integrated circuit package according to claim 1, wherein the second ceramic body comprises a parallelepiped.

6. An integrated circuit package according to claim 5, wherein the second ceramic body comprises a length of from 10 to 20 mm in order to accommodate the electrical components of the CCD.

7. An integrated circuit package according to claim 5, wherein the second ceramic body comprises a width of from 5 to 8 mm.

8. An integrated circuit package according to claim 1, wherein the second ceramic body is perpendicular to the first supporting ceramic body.