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Process for producing ceramic circuit structures having conductive vias

  • US 5,337,475 A
  • Filed: 12/17/1992
  • Issued: 08/16/1994
  • Est. Priority Date: 03/20/1991
  • Status: Expired due to Fees
First Claim
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1. A process for producing a ceramic circuit structure comprising the steps of:

  • (a) forming at least one self-supporting layer of dielectric glass-ceramic composition having a low sintering temperature, below 1000°

    C.;

    (b) forming at least one via in at least one of said layers;

    (c) filing said via with a via-fill composition comprising a mixture of a major amount by volume of contacting spheres of a glass-ceramic material similar in composition to the glass-ceramic composition of said self-supporting layer, said spheres having a substantially uniform average diameter which is less than about 10% of the diameter of said via, said spheres having a diameter which is between about 0.5 μ

    m and 6 μ

    m, and a minor amount by volume of particles of a low-resistive metal which have a maximum size less than about 1/3 the diameter of said glass-ceramic spheres and which fill the spaces between said contacting spheres and which have a melting temperature above the sintering temperature of said glass-ceramic composition; and

    (d) heating the structure resulting after step (c) to a temperature above the glass transition temperature of the glass-ceramic composition of said at least one layer and of said spheres but below about 1000°

    C., to cosinter said glass-ceramic spheres, said metal particles and said at least one glass-ceramic layer to form a ceramic circuit structure in which each via is filled with a conductive via body comprising a major amount by volume of said glass-ceramic composition which is integrated with and hermetically sealed to said at least one glass-ceramic layer and comprises a continuous skeletal network of said sintered metal particles contained with a glass-ceramic matrix formed from said glass-ceramic spheres, each said via body providing a conductive path.

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