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Chemical vapor deposition method, and chemical vapor deposition treatment system and chemical vapor deposition apparatus therefor

  • US 5,338,363 A
  • Filed: 11/24/1992
  • Issued: 08/16/1994
  • Est. Priority Date: 12/13/1991
  • Status: Expired due to Fees
First Claim
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1. A chemical vapor deposition treatment system for forming a film having a prescribed composition on a major surface of a substrate to be treated, said chemical vapor deposition treatment system comprising:

  • (a) substrate support means for supporting said substrate while heating the same;

    (b) a reaction housing receiving said substrate and said substrate support means, said reaction housing defining a reaction space facing said major surface, and being provided with an exhaust passage communicating with said reaction space;

    (c) reaction gas introduction means facing said major surface of said substrate and having a reaction gas introduction hole being opened toward said major surface of said substrate;

    (d) inert gas introduction means being provided around said reaction gas introduction means and having an inert gas injection hole being opened toward said exhaust passage;

    (e) reaction gas supply means being coupled to said reaction gas introduction means for supplying a reaction gas into said reaction space from said reaction gas introduction hole;

    (f) inert gas supply means being coupled to said inert gas introduction means for injecting an inert gas toward said exhaust passage through said inert gas injection hole; and

    (g) exhaust means being coupled to said exhaust passage for discharging an exhaust gas resulting from said reaction gas and said inert gas through said exhaust passage, wherein;

    said inert gas injection hole is opened toward said exhaust passage in a boundary between said reaction space and said exhaust passage; and

    said reaction housing comprises;

    (b-1) a tapered wall surface having a circle enclosing a periphery of said reaction space as a lower edge and gradually spreading from said gas introduction hole along a direction away from said major surface, and said exhaust passage is provided along said tapered wall surface.

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