Chemical vapor deposition method, and chemical vapor deposition treatment system and chemical vapor deposition apparatus therefor
First Claim
1. A chemical vapor deposition treatment system for forming a film having a prescribed composition on a major surface of a substrate to be treated, said chemical vapor deposition treatment system comprising:
- (a) substrate support means for supporting said substrate while heating the same;
(b) a reaction housing receiving said substrate and said substrate support means, said reaction housing defining a reaction space facing said major surface, and being provided with an exhaust passage communicating with said reaction space;
(c) reaction gas introduction means facing said major surface of said substrate and having a reaction gas introduction hole being opened toward said major surface of said substrate;
(d) inert gas introduction means being provided around said reaction gas introduction means and having an inert gas injection hole being opened toward said exhaust passage;
(e) reaction gas supply means being coupled to said reaction gas introduction means for supplying a reaction gas into said reaction space from said reaction gas introduction hole;
(f) inert gas supply means being coupled to said inert gas introduction means for injecting an inert gas toward said exhaust passage through said inert gas injection hole; and
(g) exhaust means being coupled to said exhaust passage for discharging an exhaust gas resulting from said reaction gas and said inert gas through said exhaust passage, wherein;
said inert gas injection hole is opened toward said exhaust passage in a boundary between said reaction space and said exhaust passage; and
said reaction housing comprises;
(b-1) a tapered wall surface having a circle enclosing a periphery of said reaction space as a lower edge and gradually spreading from said gas introduction hole along a direction away from said major surface, and said exhaust passage is provided along said tapered wall surface.
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Accused Products
Abstract
In order to prevent deposition of a reaction byproduct on the peripheries of reaction gas introduction holes, an annular inert gas injection member having a number of inert gas injection holes is provided around the reaction gas introduction holes. An inert gas is injected from inert gas injection holes toward an exhaust passage. This inert gas promotes a flow of an exhaust gas from a reaction space and forcibly flows toward the exhaust passage. Thus, a reaction byproduct contained in the exhaust gas is not remarkably deposited in the vicinity of the peripheries of the reaction gas introduction holes but quickly discharged into the exhaust passage. Thus, the reaction byproduct is hardly deposited around the reaction gas introduction holes.
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Citations
21 Claims
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1. A chemical vapor deposition treatment system for forming a film having a prescribed composition on a major surface of a substrate to be treated, said chemical vapor deposition treatment system comprising:
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(a) substrate support means for supporting said substrate while heating the same; (b) a reaction housing receiving said substrate and said substrate support means, said reaction housing defining a reaction space facing said major surface, and being provided with an exhaust passage communicating with said reaction space; (c) reaction gas introduction means facing said major surface of said substrate and having a reaction gas introduction hole being opened toward said major surface of said substrate; (d) inert gas introduction means being provided around said reaction gas introduction means and having an inert gas injection hole being opened toward said exhaust passage; (e) reaction gas supply means being coupled to said reaction gas introduction means for supplying a reaction gas into said reaction space from said reaction gas introduction hole; (f) inert gas supply means being coupled to said inert gas introduction means for injecting an inert gas toward said exhaust passage through said inert gas injection hole; and (g) exhaust means being coupled to said exhaust passage for discharging an exhaust gas resulting from said reaction gas and said inert gas through said exhaust passage, wherein; said inert gas injection hole is opened toward said exhaust passage in a boundary between said reaction space and said exhaust passage; and said reaction housing comprises; (b-1) a tapered wall surface having a circle enclosing a periphery of said reaction space as a lower edge and gradually spreading from said gas introduction hole along a direction away from said major surface, and said exhaust passage is provided along said tapered wall surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A chemical vapor deposition apparatus for forming a film having a prescribed composition on a major surface of a substrate to be treated, said chemical vapor deposition apparatus comprising:
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(a) substrate support means for supporting said substrate while heating the same; (b) a reaction housing receiving said substrate and said substrate support means, said reaction housing defining a reaction space facing said major surface, and being provided with an exhaust passage communicating with said reaction space; (c) reaction gas introduction means facing said major surface of said substrate and having a reaction gas introduction hole being opened toward said major surface of said substrate; and (d) inert gas introduction means being provided around said reaction gas introduction means and having an inert gas injection hole being opened toward said exhaust passage; wherein; said reaction housing comprises; (b-1) a tapered wall surface having a circle enclosing a periphery of said reaction space as a lower edge and gradually spreading from said gas introduction hole along a direction away from said major surface, and said exhaust passage is provided along said tapered wall surface.
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13. A chemical vapor deposition treatment system for forming a film having a prescribed composition on a major surface of a substrate to be treated, said chemical vapor deposition treatment system comprising:
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(a) substrate support means for supporting said substrate while heating the same; (b) a reaction housing receiving said substrate and said substrate support means, said reaction housing defining a reaction space facing said major surface, and being provided with an exhaust passage communicating with said reaction space; (c) reaction gas introduction means facing said major surface of said substrate and having a reaction gas introduction hole being opened toward said major surface of said substrate; (d) rectification means being provided in said reaction housing and having a wall surface for converting a flow of an exhaust gas resulting from said reaction gas from said reaction space to said exhaust passage to a laminar flow; (e) reaction gas supply means being coupled to said reaction gas introduction hole for supplying a reaction gas into said reaction space from said reaction gas introduction hole; and (f) exhaust means being coupled to said exhaust passage for discharging said exhaust gas through said exhaust passage. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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21. A chemical vapor deposition apparatus for forming a film having a prescribed composition on a major surface of a substrate to be treated, said chemical vapor deposition apparatus comprising:
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(a) substrate support means for supporting said substrate while heating the same; (b) a reaction housing receiving said substrate and said substrate support means, said reaction housing defining a reaction space facing said major surface, and being provided with an exhaust passage communicating with said reaction space; (c) gas introduction means facing said major surface of said substrate and having a reaction gas introduction hole being opened toward said surface of said substrate; and (d) rectification means being provided in said reaction housing for converting a flow of an exhaust gas result from said reaction gas from said reaction space to said exhaust passage to a laminar flow.
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Specification