Composite printed circuit board and manufacturing method thereof
First Claim
1. A composite printed circuit board comprising:
- a metal substrate printed circuit section having,a first layer of a thermally conductive metal for providing high thermal conductivity,a second layer made of a thermally conductive and electrically insulative material disposed adjacently to said first layer, said second layer having an upper surface upon which electrically conductive wiring may be disposed; and
an insulator substrate printed circuit board section forming an integral mounting surface with said metal substrate printed circuit section, said insulator substrate printed circuit section further comprising,a first layer of insulative material, anda second layer of a metallic foil disposed adjacently to at least one side of said first layer of insulative material for forming a conductive wiring layout.
1 Assignment
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Accused Products
Abstract
A composite printed circuit board includes a metal substrate printed circuit section and an insulation substrate printed circuit board section. The metal substrate printed circuit section includes a first layer of a thermally conductive metal for providing high thermal conductivity, and a second layer made of a thermally conductive and electrically insulative material disposed adjacently to said first layer. The second layer has an upper surface upon which electrically conductive wiring may be disposed. The insulator substrate printed circuit board section forms an integral surface with the metal substrate printed circuit section. The insulator substrate printed circuit section further includes a first layer of insulative material, and a second layer of a metallic foil disposed adjacently to at least one side of said first layer of insulative material for forming a conductive wiring layout.
29 Citations
18 Claims
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1. A composite printed circuit board comprising:
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a metal substrate printed circuit section having, a first layer of a thermally conductive metal for providing high thermal conductivity, a second layer made of a thermally conductive and electrically insulative material disposed adjacently to said first layer, said second layer having an upper surface upon which electrically conductive wiring may be disposed; and an insulator substrate printed circuit board section forming an integral mounting surface with said metal substrate printed circuit section, said insulator substrate printed circuit section further comprising, a first layer of insulative material, and a second layer of a metallic foil disposed adjacently to at least one side of said first layer of insulative material for forming a conductive wiring layout. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for manufacturing a composite circuit board comprising the steps of:
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forming a metal substrate printed circuit section having a metal base layer and an insulator upper layer disposed on said metal base layer, said insulator upper layer having a top surface upon which electrically conductive wiring may be disposed; connecting an insulator substrate circuit section with said metal substrate printed circuit section to form an integral mounting surface, said insulator substrate printed circuit section having a first layer of insulative material and a second layer of a metallic foil for forming a conductive wiring layout. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification