Method of bonding a semiconductor substrate to a support substrate and structure therefore
First Claim
1. A method of bonding a semiconductor substrate to a support substrate, comprising the steps of:
- providing the support substrate, wherein the support substrate has a first principal surface and at least one contact structure on the first principal surface;
providing the semiconductor substrate, wherein the semiconductor substrate has a first major surface, a second major surface, and at least one bonding pad on the first major surface, the at least one bonding pad corresponding to the at least one contact structure;
covering the at least one bonding pad and a portion of the first major surface with a first layer of photoresist;
forming an opening in the first layer of photoresist, wherein the opening has a mouth and exposes the at least one bonding pad;
narrowing the mouth of the opening;
coating the first layer of photoresist with a second layer of photoresist, wherein coating the first layer of photoresist fills the narrowed mouth of the opening;
re-opening the opening, wherein the reopened opening has an hourglass shape;
filling the hourglass shaped opening with an electrically conductive material;
removing the first and the second layers of photoresist, wherein an hourglass shaped bump is formed on the at least one bonding pad; and
bonding the electrically conductive material filling the hourglass shaped opening to the at least one contact structure.
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Accused Products
Abstract
A method and means of bonding a semiconductor die (10) to a support substrate (35) using a thermosonic bonding apparatus (50). The semiconductor die (10) has bonding pads (14, 15, 17) on a first major surface (12), and the support substrate (35) has contact pads (46, 47, 44) on a principal surface (43). Hourglass shaped gold bumps (30) are formed on bonding pads (14, 15, 17). A second major surface (13) of semiconductor die (10) is secured to a thermosonic tool/end-effector (52), and the support substrate (35) is secured to a substrate chuck (48). The hourglass shaped gold bumps (30) are mated with the contact pads ( 46, 47, 44 ) on the support substrate (35). A bond is thermosonically formed between the gold bumps (30) and the contact pads (46, 47, 44).
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Citations
15 Claims
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1. A method of bonding a semiconductor substrate to a support substrate, comprising the steps of:
- providing the support substrate, wherein the support substrate has a first principal surface and at least one contact structure on the first principal surface;
providing the semiconductor substrate, wherein the semiconductor substrate has a first major surface, a second major surface, and at least one bonding pad on the first major surface, the at least one bonding pad corresponding to the at least one contact structure;
covering the at least one bonding pad and a portion of the first major surface with a first layer of photoresist;forming an opening in the first layer of photoresist, wherein the opening has a mouth and exposes the at least one bonding pad;
narrowing the mouth of the opening;coating the first layer of photoresist with a second layer of photoresist, wherein coating the first layer of photoresist fills the narrowed mouth of the opening; re-opening the opening, wherein the reopened opening has an hourglass shape; filling the hourglass shaped opening with an electrically conductive material; removing the first and the second layers of photoresist, wherein an hourglass shaped bump is formed on the at least one bonding pad; and bonding the electrically conductive material filling the hourglass shaped opening to the at least one contact structure. - View Dependent Claims (2, 3, 4, 5, 6, 7)
- providing the support substrate, wherein the support substrate has a first principal surface and at least one contact structure on the first principal surface;
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8. A method of attaching a first substrate to a second substrate, comprising the steps of:
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providing the first substrate, wherein the first substrate has a first major surface, a second major surface, and an electrically conductive layer on at least a portion of the first major surface; photolithographically forming at least one hourglass shaped metallic bump on a portion of the electrically conductive layer; providing the second substrate, wherein the second substrate includes at least one contact structure having a principal surface, and comprises a base plate having a metallic pedestal mounted thereon and a dielectric material surrounding a portion of the metallic pedestal; and thermosonically bonding the hourglass shaped metallic bump to the at least one contact structure. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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Specification