Heat sink assembly

• US 5,343,362 A
• Filed: 01/07/1994
• Issued: 08/30/1994
• Est. Priority Date: 01/07/1994
• Status: Expired due to Term

• Current Assignee: Artesyn North America Incorporated (Artesyn Embedded Technologies, Inc.)
• Original Assignee: Zytec Corporation (Artesyn Embedded Technologies, Inc.)
• Inventors: Solberg, Terry B.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/178,928
• Time in Patent Office: 235 Days
• Field of Search: 174/16.3, 165/80.3, 165/185, 257/706-707, 257/712-713, 257/718-719, 257/726-727, 361/690, 361/704, 361/707-711, 361/715-722, 361/807, 361/809-811, 361/829
• US Class Current: 361/710
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink assembly 10 having a component clip 24 for mounting an electronic component 12. The heat sink body 16 includes a planar mounting surface 26 providing flexible positioning for the component 12. The heat sink body 16 is affixed to the circuit board 14 by a mounting rail 20 providing flexible positioning of the heat sink body 16 on the circuit board 14.

Claims

1. A heat sink assembly for mounting an electronic component comprising:

a heat sink body, having a planar component mounting surface, and having a rail mounting groove, and having a component, clip mounting channel proximate said planar component mounting surface;

a mounting rail positioned within said rail mounting groove, said mounting rail defining a mounting axis;

a component clip having a spring arm and having an anchor arm, said anchor arm position in said component clip mounting channel, said spring arm coupled to said anchor arm by a bend;

whereby a component placed under said spring arm deflects said bend into contact with a portion of said clip mounting channel causing said bend to act a fulcrum and thereby elastically deflecting said component clip producing a clamping force to hold the component against said planar surface.

2. The heat sink assembly of claim 1 wherein planar surface does not intersect with said mounting axis.

3. The heat sink assembly of claim 1 wherein said component clip further comprises a thrust surface for contacting the electronic component.

4. The heat sink assembly of claim 1 wherein said component clip further comprises a thrust surface for contacting the electronic component, includes a crease for abutting the electronic component, whereby said clamping force is essentially independent of the portion of said crease on the electronic component.

5. The heat sink assembly of claim 1 wherein said anchor arm further comprise an anchor bend formed at the terminal end of said anchor arm.

6. The heat sink assembly of claim 2 wherein said anchor arm further comprises an anchor bend formed at the terminal end of said anchor arm.

7. The heat sink assembly of claim 6 wherein said component clap mounting channel includes a ridge parallel to said mounting axis and contacting a portion of said anchor bend;

whereby said anchor bend is elastically deformed by placement of the electronic component under said component clip.

8. A heat sink assembly for mounting an electronic component comprising:

a heat sink body, having a planar component mounting surface, and having a rail mounting groove, and having a component clip mounting channel proximate said planar component mounting surface;

a mounting rail positioned within said rail mounting groove, said mounting rail defining a mounting axis;

a component clip having a spring arm and having an anchor arm, said anchor arm positioned in said component clip mounting channel;

said anchor arm further comprise an anchor bend formed at the terminal end of said anchor arm, said spring arm coupled to said anchor arm by a bend;

said component clip mounting channel including a ridge parallel to said mounting axis contacting a portion of said anchor bend;

whereby an electronic component placed under said spring arm deflects said bend into contact with a portion of said clap mounting channel causing said bend to act a fulcrum and thereby elastically deflecting said component clip producing a clamping force to hold the electronic component against said planar surface.