Power semiconductor integrated circuit package

• US 5,347,160 A
• Filed: 09/28/1992
• Issued: 09/13/1994
• Est. Priority Date: 09/28/1992
• Status: Expired due to Fees

• Current Assignee: Sundstrand Corporation (Rtx Corporation)
• Original Assignee: Sundstrand Corporation (Rtx Corporation)
• Inventors: Sutrina, Thomas A.
• Primary Examiner(s): Jackson, Jerome
• Assistant Examiner(s): WHITEHEAD JR, CARL W
• Application Number:
  US07/951,591
• Time in Patent Office: 715 Days
• Field of Search: 257/698, 257/688, 257/699, 257/704, 257/734, 257/678, 257/690, 257/691, 257/692, 257/693, 257/734, 257/774, 257/784, 257/798
• US Class Current: 257/698
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A hermetically sealed semiconductor package (10, 100, 200) in accordance with the invention and includes at least one integrated circuit (14, 15 or 16) with each integrated circuit having first (20) and second (22) opposed faces with the first face having at least one electrode (17-19) providing at least one first circuit connection to the integrated circuit and with the second face providing a second circuit connection to the integrated circuit; a thermally conductive base (32) thermally coupled to the second face for conducting heat generated by operation of the at least one integrated circuit; an insulator (30) electrically isolating the first circuit connection from the second circuit connection; a sidewall (34) extending upward from the base; and a lid (36) extending from the sidewall, the base, sidewall and lid forming a hermetically sealed cavity (12) in which the at least one integrated circuit is disposed and the lid having at least one depression (38) projecting inward below an inner and outer surface of the lid into the cavity and electrically contacting at least one of the circuit connections at a plane below the inner surface of the lid within the cavity.

Claims

1. A hermetically sealed semiconductor package comprising:

at least one integrated circuit with each integrated circuit having first and second opposed faces with the first face having at least one electrode providing at least a first circuit connection to the integrated circuit and with the second face providing a second circuit connection to the integrated circuit;

a thermally conductive base thermally coupled to the second face for conducting heat generated by operation of the at least one integrated circuit;

an insulator electrically isolating the first circuit connection from the second circuit connection;

a side wall extending upward from the base; and

a lid extending from the side wall, the base, sidewall and lid forming a hermetically sealed cavity in which the at least one integrated circuit is disposed and the lid having at least one depression projecting inward below an inner and outer surface of the lid into the cavity, touching and electrically contacting at least one of the circuit connections at a plane below the inner surface of the lid within the cavity.

2. A package in accordance with claim 1 wherein:

each integrated circuit has a plurality of electrodes and the lid has a plurality of depressions.

3. A package in accordance with claim 2 wherein:

the plurality of electrodes comprise control and power electrodes.

4. A package in accordance with claim 1 wherein:

the integrated circuit has a plurality of electrodes; and

at least one depression is electrically connected to a plurality of the electrodes; and

an electrical conductor extends through the sidewall which is electrically insulated from the at least one depression and is electrically connected to at least one of the plurality of electrodes.

5. A package in accordance with claim 1 wherein:

the plurality of electrodes comprise control and power electrodes and an electrical conductor extends through the sidewall which is electrically connected to at least one control electrode and at least one depression is electrically connected to at least one power electrode.

6. A package in accordance with claim 1 wherein:

the first face is part of another circuit connection electrically connected to a control electrode and to a conductor extending through the lid and the first circuit connection is electrically connected to at least one power electrode of the at least one integrated circuit and to at least one depression; and

the second circuit connection is electrically connected to a power electrode of the integrated circuit and to at least one of the depressions.

7. A package in accordance with claim 1 wherein:

the first circuit connection is electrically connected to a power electrode of the at least one integrated circuit and to at least one depression, at least one first conductor extends through the sidewall which is electrically connected to at least one control electrode and at least one second conductor extends through the sidewall which is electrically connected to the second circuit connection.

8. A package in accordance with claim 1 comprising:

a plurality of integrated circuits, electrodes of the plurality of integrated circuits connected to the first circuit connection being electrically connected to at least one metallized layer disposed on an insulative layer which is disposed on the base and adjacent to the integrated circuits and at least one of the depressions touching and electrically contacting the metallized layer.

9. A package in accordance with claim 8 further comprising:

a plurality of metallized layers each disposed on the insulative layer which is disposed on the base with at least one of the metallized layers being electrically connected to a plurality of power electrodes of at least one integrated circuit and to at least one of the depressions and with at least one of the metallized layers being electrically connected to at least one control electrode of at least one integrated circuit; and

wherein

the lid is an insulative material and a plurality of the depressions are respectively electrically connected to a plurality of external circuit connections connected to an outer surface of the lid, at least one of the electrical depressions being electrically connected to electrodes electrically connected to the first face and at least one of the electrical connections being connected to the second face of the plurality of integrated circuits.

10. A package in accordance with claim 2 comprising:

a plurality of integrated circuits, electrodes of the plurality of integrated circuits connected to the first circuit connection being electrically connected to at least one metallized layer disposed on an insulative layer which is disposed on the base and adjacent to the integrated circuits and at least one of the depressions touching and electrically contacting the metallized layer.

11. A package in accordance with claim 10 further comprising:

a plurality of metallized layers each disposed on the insulative layer which is disposed on the base with at least one of the metallized layers being electrically connected to a plurality of power electrodes of at least one integrated circuit and to at least one of the depressions and with at least one of the metallized layers being electrically connected to at least one control electrode of at least one integrated circuit; and

wherein

the lid is an insulative material and a plurality of the depressions are respectively electrically connected to a plurality of external circuit connections connected to an outer surface of the lid, at least one of the electrical depressions being electrically connected to electrodes electrically connected to the first face and at least one of the electrical connections being connected to the second face of the plurality of integrated circuits.

12. A package in accordance with claim 3 comprising:

a plurality of integrated circuits, electrodes of the plurality of integrated circuits connected to the first circuit connection being electrically connected to at least one metallized layer disposed on an insulative layer which is disposed on the base and adjacent to the integrated circuits and at least one of the depressions touching and electrically contacting the metallized layer.

13. A package in accordance with claim 12 further comprising:

a plurality of metallized layers each disposed on the insulative layer which is disposed on the base with at least one of the metallized layers being electrically connected to a plurality of power electrodes of at least one integrated circuit and to at least one of the depressions and with at least one of the metallized layers being electrically connected to at least one control electrode of at least one integrated circuit; and

wherein

the lid is an insulative material and a plurality of the depressions are respectively electrically connected to a plurality of external circuit connections connected to an outer surface of the lid, at least one of the electrical depressions being electrically connected to electrodes electrically connected to the first face and at least one of the electrical connections being connected to the second face of the plurality of integrated circuits.

14. A package in accordance with claim 4 comprising:

a plurality of integrated circuits, electrodes of the plurality of integrated circuits connected to the first circuit connection being electrically connected to at least one metallized layer disposed on an insulative layer which is disposed on the base and adjacent to the integrated circuits and at least one of the depressions touching and electrically contacting the metallized layer.

15. A package in accordance with claim 14 further comprising:

a plurality of metallized layers each disposed on the insulative layer which is disposed on the base with at least one of the metallized layers being electrically connected to a plurality of power electrodes of at least one integrated circuit and to at least one of the depressions and with at least one of the metallized layers being electrically connected to at least one control electrode of at least one integrated circuit; and

wherein

the lid is an insulative material and a plurality of the depressions are respectively electrically connected to a plurality of external circuit connections connected to an outer surface of the lid, at least one of the electrical depressions being electrically connected to electrodes electrically connected to the first face and at least one of the electrical connections being connected to the second face of the plurality of integrated circuits.

16. A package in accordance with claim 5 comprising:

a plurality of integrated circuits, electrodes of the plurality of integrated circuits connected to the first circuit connection being electrically connected to at least one metallized layer disposed on an insulative layer which is disposed on the base and adjacent to the integrated circuits and at least one of the depressions touching and electrically contacting the metallized layer.

17. A package in accordance with claim 16 further comprising:

a plurality of metallized layers each disposed on the insulative layer which is disposed on the base with at least one of the metallized layers being electrically connected to a plurality of power electrodes of at least one integrated circuit and to at least one of the depressions and with at least one of the metallized layers being electrically connected to at least one control electrode of at least one integrated circuit; and

wherein

the lid is an insulative material and a plurality of the depressions are respectively electrically connected to a plurality of external circuit connections connected to an outer surface of the lid, at least one of the electrical depressions being electrically connected to electrodes electrically connected to the first face and at least one of the electrical connections being connected to the second face of the plurality of integrated circuits.

18. A package in accordance with claim 6 comprising:

a plurality of integrated circuits, electrodes of the plurality of integrated circuits connected to the first circuit connection being electrically connected to at least one metallized layer disposed on an insulative layer which is disposed on the base and adjacent to the integrated circuits and at least one of the depressions touching and electrically contacting the metallized layer.

19. A package in accordance with claim 18 further comprising:

a plurality of metallized layers each disposed on the insulative layer which is disposed on the base with at least one of the metallized layers being electrically connected to a plurality of power electrodes of at least one integrated circuit and to at least one of the depressions and with at least one of the metallized layers being electrically connected to at least one control electrode of at least one integrated circuit; and

wherein

the lid is an insulative material and a plurality of the depressions are respectively electrically connected to a plurality of external circuit connections connected to an outer surface of the lid, at least one of the electrical depressions being electrically connected to electrodes electrically connected to the first face and at least one of the electrical connections being connected to the second face of the plurality of integrated circuits.

20. A package in accordance with claim 7 comprising:

a plurality of integrated circuits, electrodes of the plurality of integrated circuits connected to the first circuit connection being electrically connected to at least one metallized layer disposed on an insulative layer which is disposed on the base and adjacent to the integrated circuits and at least one of the depressions touching and electrically contacting the metallized layer.

21. A package in accordance with claim 20 further comprising:

a plurality of metallized layers each disposed on the insulative layer which is disposed on the base with at least one of the metallized layers being electrically connected to a plurality of power electrodes of at least one integrated circuit and to at least one of the depressions and with at least one of the metallized layers being electrically connected to at least one control electrode of at least one integrated circuit; and

wherein

the lid is an insulative material and a plurality of the depressions are respectively electrically connected to a plurality of external circuit connections connected to an outer surface of the lid, at least one of the electrical depressions being electrically connected to electrodes electrically connected to the first face and at least one of the electrical connections being connected to the second face of the plurality of integrated circuits.

22. A package in accordance with claim 1 wherein:

a plurality of electrodes are electrically coupled to the lid by the at least one depression with the lid being electrically conductive.

23. A package in accordance with claim 1 further comprising:

at least one electrical conductor extending through the sidewall, which is electrically isolated from the base and the lid, that is electrically connected to the at least one control electrode of the at least one integrated circuit; and

at least one power conductor, electrically coupled to the second face of the at least one integrated circuit, extending to an outside surface of the package which is electrically isolated from the base and the lid.

24. A package in accordance with claim 1 further comprising:

at least one additional depression which is electrically coupled to at least one control electrode of the at least one integrated circuit with the at least one additional depression being electrically isolated from the at least one depression; and

wherein

a plurality of power electrodes of the at least one integrated circuit are electrically coupled in common to an electrically conductive portion of the lid.

25. A package in accordance with claim 24 further comprising:

a control conductive layer disposed within the cavity which is electrically isolated from the base and the sidewall; and

a wire bond connecting the at least one control electrode to the control conductive layer; and

wherein

the at least one additional depression touches and is electrically connected to the control conductive layer.

26. A package in accordance with claim 3 further comprising:

at least one additional depression which is electrically coupled to at least one control electrode of the at least one integrated circuit with the at least one additional depression being electrically isolated from the at least one depression; and

wherein

a plurality of power electrodes of the at least one integrated circuit are electrically coupled in common to an electrically conductive portion of the lid.

27. A package in accordance with claim 26 further comprising:

a control conductive layer disposed within the cavity which is electrically isolated from the base and the sidewall; and

a wire bond connecting the at least one control electrode to the control conductive layer; and

wherein

the at least one additional depression touches and is electrically connected to the control conductive layer.

28. A package in accordance with claim 23 further comprising:

a metallic electrically conductive sheet in surface contact with the second face and an electrical conductor electrically connected to the conductive sheet extending to an outside surface of package.

29. A package in accordance with claim 21 wherein:

each depression is tapered to decrease in diameter from a direction of extension of the lid into the cavity and includes strain relief structure within the tapper.

30. A package in accordance with claim 22 wherein:

each depression is tapered to decrease in diameter from a direction of extension of the lid into the cavity and includes strain relief structure within the tapper.

31. A package in accordance with claim 23 wherein:

each depression is tapered to decrease in diameter from a direction of extension of the lid into the cavity and includes strain relief structure within the tapper.

32. A package in accordance with claim 24 wherein:

each depression is tapered to decrease in diameter from a direction of extension of the lid into the cavity and includes strain relief structure within the tapper.

33. A package in accordance with claim 25 wherein:

each depression is tapered to decrease in diameter from a direction of extension of the lid into the cavity and includes strain relief structure within the tapper.

34. A package in accordance with claim 26 wherein:

each depression is tapered to decrease in diameter from a direction of extension of the lid into the cavity and includes strain relief structure within the tapper.

35. A package in accordance with claim 27 wherein:

each depression is tapered to decrease in diameter from a direction of extension of the lid into the cavity and includes strain relief structure within the tapper.

36. A package in accordance with claim 28 wherein:

each depression is tapered to decrease in diameter from a direction of extension of the lid into the cavity and includes strain relief structure within the tapper.