Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip

• US 5,347,428 A
• Filed: 12/03/1992
• Issued: 09/13/1994
• Est. Priority Date: 12/03/1992
• Status: Expired due to Term

• Current Assignee: Talon Research LLC
• Original Assignee: Irvine Sensors Corp.
• Inventors: Carson, John C., Shanken, Stuart N., Indin, Ronald J.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Whang, Young
• Application Number:
  US07/985,837
• Time in Patent Office: 649 Days
• Field of Search: 361/395, 361/393, 361/400, 361/401, 361/388, 361/417, 361/729, 361/735, 361/760, 361/761, 361/707, 361/728, 361/807, 174/52.4, 174/260, 257/678, 257/686, 257/723
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06555 Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H05K 7/023 Stackable modules

Abstract

A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

Claims

1. A computer module comprising:

an integrated circuit microprocessor chip containing computer circuitry;

a stack of glued together integrated circuit memory chips, each containing memory circuitry dedicated to the computer module;

terminals formed on the microprocessor chip, including memory-interface terminals connected to the computer circuitry contained in the microprocessor chip;

the stack of memory chips having a planar access surface to which an array of spaced electrical leads extend from the memory circuitry;

means for electrically connecting each memory-interface terminal on the microprocessor chip to at least one of the leads at the access surface of the stack of memory chips; and

means for structurally integrating the stack of memory chips and the microprocessor chip to constitute a computer module.

2. The computer module of claim 1 which includes:

a plurality of solder bumps which provide both structural connection of the stack of memory chips to the microprocessor chip and also electrical connection between microprocessor memory-interface terminals and the electrical leads at the access surface of the stack of memory chips.

3. The computer module of claim 2 which includes:

separate electrical leads on the microprocessor chip surface which extend from the terminals electrically connected to the solder bumps to separate memory-interface terminals formed on the microprocessor chip.

4. The computer module of claim 2 which includes:

a substrate, one side of which is connected by the solder bumps to the access surface of the stack of memory chips, and the other side of which is glued to the microprocessor chip.

5. The computer module of claim 4 which includes:

terminals formed near the edge of the flat substrate on the side which is connected to the stack of memory chips;

spaced electrical leads connected to and extending from said terminals to those solder bumps which provide electrical connection to the electrical leads at the access surface of the stack of memory chips; and

a plurality of wire bonds each connected between one of the terminals on the substrate and one of the memory-interface terminals on the microprocessor chip.

6. The computer module of claim 2 in which:

the terminals formed on the microprocessor chip include terminals which are aligned with and electrically connected to the solder bumps.

7. The computer module of claim 6 in which:

the terminals formed on the microprocessor chip which are aligned with and electrically connected to the solder bumps are the sole memory-interface terminals of the microprocessor chip.

8. The computer module of claim 1 in which:

the memory chips in the stack lie in planes perpendicular to the microprocessor chip.

9. The computer module of claim 1 in which:

the memory chips in the stack lie in planes parallel to the microprocessor chip.

10. The computer module of claim 9 which includes:

a top layer in the stack of memory chips which provides an exposed surface having a plurality of terminals, each electrically connected to at least one of the array of spaced electrical leads at the access surface of the stack.

11. The computer module of claim 10 which includes:

wire bonds each connecting one of the terminals on the top layer of the stack to one of the memory-interface terminals formed on the microprocessor chip.

12. The computer module of claim 9 which includes:

a layer in the stack of memory chips which is adjacent to the microprocessor chip, and which has terminals on its surface, each electrically connected to at least one of the array of spaced electrical leads at the access surface of the stack.

13. The computer module of claim 12 which includes:

solder bumps electrically connecting individual terminals on the adjacent layer of the stack to individual memory-interface terminals on the microprocessor chip.

14. The computer module of claim 13 in which:

the terminals on the microprocessor chip are aligned with the terminals on the adjacent layer of the stack and are directly soldered thereto.

15. The computer module of claim 14 in which the terminals on the microprocessor chip soldered to the terminals on the adjacent layer of the stack are the sole memory-interface terminals of the microprocessor chip.

16. The computer module of claim 14 which includes:

separate electrical leads on the microprocessor chip surface which extend from the terminals electrically connected to the solder bumps to separate memory-interface terminals formed on the microprocessor chip.

17. The computer module of claim 1 which includes:

a substrate formed of dielectric material having a plurality of vias extending therethrough;

means for securing the stack of memory chips to one surface of the substrate;

means for securing the microprocessor chip to the opposite surface of the substrate; and

electrical connections extending through the vias to separately connect memory-interface terminals on the microprocessor chip to at least one of the electrical leads at the access surface of the stack of memory chips.

18. The computer module of claim 1 in which:

the integrated circuitry in the microprocessor chip is designed to perform its necessary functions at the lower power and higher speed in the integrated computer module.

19. The computer module of claim 18 in which:

the integrated circuitry in the memory stack is designed to perform its necessary functions at the lower power and higher speed in the integrated computer module.

20. The computer module of claim 1 in which:

the integrated circuitry in the memory stack is designed to perform its necessary functions at the lower power and higher speed in the integrated computer module.

21. A method of fabricating a computer module, comprising;

providing an integrated circuit microprocessor chip containing computer circuitry and having a plurality of terminals connected to its computer circuitry, including memory-interface terminals;

providing a glued together stack of integrated circuit memory chips having electrical leads extending to an access surface of the stack;

structurally integrating the stack and the microprocessor chip to constitute a computer module; and

electrically connecting the memory-interface terminals of the microprocessor chip to the electrical leads at the access surface of the stack.

22. The method of claim 21 in which:

the stack is secured to the microprocessor chip by a plurality of solder bumps which provide both electrical and mechanical interconnection.

23. The method of claim 22 in which:

metallic conductors are placed on the access surface of the stack in such a way as to form T-connections with the electrical leads;

solder bumps are formed on the metallic conductors located on the access surface of the stack;

the electrical memory-interface terminals on the microprocessor chip are so located as to align with the solder bumps; and

the stack and microprocessor chip are interconnected by means of the solder bumps.

24. The method of claim 21 which includes the step of:

redesigning the integrated circuitry in the microprocessor chip to perform its necessary functions at the lower power and higher speed in the integrated computer module.

25. The method of claim 24 which includes the steps of:

redesigning the integrated circuitry in the memory stack to perform its necessary functions at the lower power and higher speed in the integrated computer module.

26. The method of claim 21 which includes the step of:

redesigning the integrated circuitry in the memory stack to perform its necessary functions at the lower power and higher speed in the integrated computer module.