Metal-coated polyimide
First Claim
1. An electroless deposition-catalyzing film-forming solution comprising:
- (A) 0.1 to 15 weight percent of a polyamic acid of the structural formula ##STR4## where n is greater than 10;
where R1 is a carbon-carbon bond, --C(O)--, a C1 -C12 alkyl group, a C1 -C12 alkylene group, a polyakylene oxide, or ##STR5## where R2 is a carbon-carbon bond, --C(O)--, --SO2 --, --CH2 --, --CH(CH3)--, --C(CH3)2 --, --C(CF3)2 --, or --O--;
where R3 is a C1 -C12 alkyl group, a C1 -C12 alkylene group, a polyakylene oxide, --phenyl--, --phenyl--R4 --phenyl-- or --phenyl--O--phenyl--R4 --phenyl--O--phenyl--; and
where R4 is a carbon-carbon bond, --C(O)--, --SO2 --, --CH2 --, --CH (CH3)--, --C(CH3)2 --, --C(CF3)-- or --O--;
(B) 0.1 to 15 parts per hundred parts of polyamic acid of a noble metal selected from the group consisting of palladium, platinum, rhodium, iridium, ruthenium, silver and gold;
(C) 60 to 95 weight percent of an aprotic solvent selected from the group consisting of acetone, dimethylacetamide, dimethylformamide, dimethylsulfoxide, ethylene dichloride, methyl ethyl ketone, methyl isobutyl ketone, tetrahydrofuran, N-methyl-2-pyrrolidone, toluene, xylene, mixtures thereof and mixtures thereof with water; and
(D) 0 to 10 weight percent of an anionic or non-ionic surfactant.
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Accused Products
Abstract
Electroless deposition-catalyzing film-forming solutions comprising polyamic acid and noble metal, e.g. palladium complexed with ammonia, in an aprotic solvent, e.g. N-methyl-2-pyrrolidone with a surfactant. Such solutions are used to provide articles having a coating or patterned image of a electrolessly-depositable element such as copper, nickel and the like on high heat resistant substrates, e.g. metals, ceramics, glass, silicon, high heat polymers and thermoset polymers. In the methods of this invention a polyamic acid/noble metal solution is applied as a coating or patterned image to provide a coherent polyamic acid film which can be imidized, e.g. by heat treatment at 250° C. or higher, providing a tough, adhesive polyimide film that can catalyze electroless deposition.
45 Citations
8 Claims
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1. An electroless deposition-catalyzing film-forming solution comprising:
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(A) 0.1 to 15 weight percent of a polyamic acid of the structural formula ##STR4## where n is greater than 10;
where R1 is a carbon-carbon bond, --C(O)--, a C1 -C12 alkyl group, a C1 -C12 alkylene group, a polyakylene oxide, or ##STR5## where R2 is a carbon-carbon bond, --C(O)--, --SO2 --, --CH2 --, --CH(CH3)--, --C(CH3)2 --, --C(CF3)2 --, or --O--;
where R3 is a C1 -C12 alkyl group, a C1 -C12 alkylene group, a polyakylene oxide, --phenyl--, --phenyl--R4 --phenyl-- or --phenyl--O--phenyl--R4 --phenyl--O--phenyl--; and
where R4 is a carbon-carbon bond, --C(O)--, --SO2 --, --CH2 --, --CH (CH3)--, --C(CH3)2 --, --C(CF3)-- or --O--;(B) 0.1 to 15 parts per hundred parts of polyamic acid of a noble metal selected from the group consisting of palladium, platinum, rhodium, iridium, ruthenium, silver and gold; (C) 60 to 95 weight percent of an aprotic solvent selected from the group consisting of acetone, dimethylacetamide, dimethylformamide, dimethylsulfoxide, ethylene dichloride, methyl ethyl ketone, methyl isobutyl ketone, tetrahydrofuran, N-methyl-2-pyrrolidone, toluene, xylene, mixtures thereof and mixtures thereof with water; and (D) 0 to 10 weight percent of an anionic or non-ionic surfactant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification
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- Resources
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Current AssigneeLaird Technologies Incorporated (DuPont de Nemours, Inc.)
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Original AssigneeMonsanto Company (Bayer AG)
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InventorsTokas, Edward F., Chen, Ken S., Shaltout, Raafat M.
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Primary Examiner(s)KLEMANSKI, HELENE G
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Application NumberUS08/087,228Time in Patent Office445 DaysField of Search106/1.05, 106/1.11US Class Current106/1.11CPC Class CodesC23C 18/30 Activating or accelerating ...H05K 1/0346 containing NH05K 1/0373 containing additives, e.g. ...H05K 3/181 by electroless plating adhe...
