Immersion cooling coolant and electronic device using this coolant

• US 5,349,499 A
• Filed: 04/28/1993
• Issued: 09/20/1994
• Est. Priority Date: 05/11/1990
• Status: Expired due to Term

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Yokouchi, Kishio, Yamada, Mitsutaka, Niwa, Koichi, Kamehara, Nobuo
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US08/053,452
• Time in Patent Office: 510 Days
• Field of Search: 252/67, 174/15.1, 174/176 F, 174/252, 165/104.19, 165/104.21, 165/104.29, 165/104.33, 165/80.4, 361/385, 361/699, 361/700, 257/714, 257/715, 62/259.2, 62/114
• US Class Current: 361/700
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/203 by immersion

Abstract

A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30° C. to 100° C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100° C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.

Claims

1. A boiling cooling-type electronic device for using at a temperature in a range of room temperature to 80°

C., comprising an electronic element having a heat generating portion immersed in a liquid coolant, the liquid coolant comprising a low boiling point fluorocarbon having a boiling point of 30°

C. to 100°

C. and a high boiling point fluorocarbon having a boiling point of 150°

C. to 260°

C. and higher than that of the low boiling point fluorocarbon by at least 100°

C., an amount of the high boiling point fluorocarbon being from 1.5% by volume to 20% by volume, based on the volume of the low boiling point fluorocarbon.

2. A device according to claim 1, wherein said low boiling point fluorocarbon has a boiling point of 30°

to 56°

C. and said high boiling point fluorocarbon has a boiling point of 215°

to 253°

C.

3. A device according to claim 1, wherein said high boiling point fluorocarbon is contained in an amount of less than 9% by volume, based on the volume of the low boiling point fluorocarbon.

4. A device according to claim 1, wherein said high boiling point fluorocarbon is selected from the group consisting of tris(p-fluoropentyl)amine, p-fluoroanthracene and tris(p-fluorophenanthrene).

5. A device according to claim 1, wherein said high boiling point fluorocarbon is tris(p-fluoropentyl)amine.

6. A device according to claim 1, wherein said high boiling point fluorocarbon is p-fluoroanthracene.

7. A device according to claim 1, wherein the high boiling point fluorocarbon is tris(p-fluorophenanthrene).

8. A device according to claim 1, wherein said low boiling point fluorocarbon is selected from the group consisting of C₅ F₁₂ and C₆ F₁₄.

9. A device according to claim 1, wherein said low and high boiling point fluorocarbons are selected from compounds represented by the formula C_n F_2n+2 and C_n F_2n, where n is a positive integer.