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Immersion cooling coolant and electronic device using this coolant

  • US 5,349,499 A
  • Filed: 04/28/1993
  • Issued: 09/20/1994
  • Est. Priority Date: 05/11/1990
  • Status: Expired due to Term
First Claim
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1. A boiling cooling-type electronic device for using at a temperature in a range of room temperature to 80°

  • C., comprising an electronic element having a heat generating portion immersed in a liquid coolant, the liquid coolant comprising a low boiling point fluorocarbon having a boiling point of 30°

    C. to 100°

    C. and a high boiling point fluorocarbon having a boiling point of 150°

    C. to 260°

    C. and higher than that of the low boiling point fluorocarbon by at least 100°

    C., an amount of the high boiling point fluorocarbon being from 1.5% by volume to 20% by volume, based on the volume of the low boiling point fluorocarbon.

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