Vacuum processing apparatus and operating method therefor

• US 5,349,762 A
• Filed: 07/26/1993
• Issued: 09/27/1994
• Est. Priority Date: 08/29/1990
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Itou, Atsushi, Tsubone, Tsunehiko, Kato, Shigekazu, Nishihata, Kouji
• Primary Examiner(s): Bennett, Henry A.
• Application Number:
  US08/096,256
• Time in Patent Office: 428 Days
• Field of Search: 34/23, 34/218, 34/219, 34/107, 34/15, 34/92, 141/85, 141/383, 414/217, 414/292
• US Class Current: 34/406
• CPC Class Codes: B01J 3/006 Processes utilising sub-atmospheric pressure; Apparatus therefor
• CPC Class Codes: B41J 2/36 Print density control
• CPC Class Codes: B41J 2/365 by compensation for variation in temperature
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67736 Loading to or unloading from a conveyor
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: Y10S 134/902 Semiconductor wafer
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber
• CPC Class Codes: Y10S 414/14 Wafer cassette transporting

Abstract

This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple. Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

Claims

1. A vacuum processing apparatus having vacuum processing chambers for which dry cleaning is effected therein after substrates to be processed are processed therein in vacuum, said apparatus comprising:

first storage means for storing said substrates to be treated and second storage means for storing dummy substrates, said first and second storage means being disposed in the air atmosphere, said second storage means not being disposed in a vacuum;

conveyor means for transferring both (1) said substrates to be processed between said first storage means and said vacuum processing chambers, and (2) said dummy substrates between said second storage means and said vacuum processing chambers; and

control means for controlling said conveyor means so as to transfer said dummy substrates from said vacuum processing chambers to said second storage means respectively before and after said dry cleaning of said vacuum processing chambers.

2. A vacuum processing apparatus according to claim 1, wherein said conveyor means comprises first conveyor means disposed in the air and second conveyor means disposed in vacuum.

3. A vacuum processing apparatus according to claim 1, wherein the apparatus includes a plurality of said vacuum processing chambers.

4. A vacuum processing apparatus according to claim 1, wherein said control means includes means for judging the timing of dry cleaning of said vacuum processing chambers.

5. A vacuum processing apparatus according to claim 4, wherein judgement of the timing of dry cleaning is made by means for counting the number of times of processing of said substrates to be processed in said vacuum processing chambers.

6. A vacuum processing apparatus according to claim 1, wherein said control means includes means to distinguish between the first storage means and the second storage means, so as to determine that the second storage means contains dummy substrates, and to selectively control the conveyor means to transfer said dummy substrates from said second storage means to said vacuum processing chambers and from said vacuum processing chambers to said second storage means respectively before and after said dry cleaning of said vacuum processing chambers, whereby said dummy substrates stored in said second storage chamber are positioned in the vacuum processing chambers during said dry cleaning of said vacuum processing chambers.

7. A vacuum processing apparatus according to claim 1, further including control means for said dry cleaning, said control means for the dry cleaning causing the dry cleaning to be performed while the dummy substrates, transferred from the second storage means by the conveyor means, are in the vacuum processing chambers.

8. A vacuum processing apparatus according to claim 1, wherein said first storage means and said second storage means are separate storage means separated from each other.

9. A vacuum processing apparatus according to claim 1, further comprising dummy substrates provided in said second storage means.

10. A vacuum processing apparatus according to claim 1, wherein said conveyor means is a same conveying system for conveying both the substrates and the dummy substrates between respective first and second storage means and the vacuum processing chambers.

11. A vacuum processing apparatus according to claim 10, wherein said first storage means and said second storage means are separate storage means separated from each other.

12. A vacuum processing apparatus according to claim 1, wherein each of the first and second storage means includes cassette tables respectively for holding cassettes of the substrates and cassettes of the dummy substrates, and wherein the apparatus further comprises cassettes respectively for holding substrates and dummy substrates on the cassette tables.

13. A vacuum processing apparatus comprising:

a vacuum processing chamber for processing a substrate to be processed in vacuum;

means for effecting a dry cleaning in an inner portion of said vacuum processing chamber after said substrate to be processed is processed;

storage means for storing said substrate to be processed and a dummy substrate, said storage means being maintained, at all times during said processing of said substrate to be processed and during said dry cleaning of said dummy substrate, under an air atmosphere;

transfer means for transferring said substrate to be processed and said dummy substrate between said storage means and said vacuum processing chamber; and

control means for controlling said transfer means to as to transfer selectively said substrate to be processed and said dummy substrate from said storage means to said vacuum processing chamber, such that said substrate to be processed is transferred at a time for said processing to be performed and said dummy substrate is transferred at a time required to perform said dry cleaning.

14. A vacuum processing apparatus having vacuum processing chambers for which dry cleaning is effected therein after substrates to be processed are processed therein in vacuum, said apparatus comprising:

first storage means for storing said substrates to be treated and second storage means for storing dummy substrates, said first and second storage means being disposed in the air atmosphere during duration of processing, in a vacuum, the substrates in said vacuum processing chamber;

conveyor means for transferring both (1) said substrates to be processed between said first storage means and said vacuum processing chambers, and (2) said dummy substrates between said second storage means and said vacuum processing chambers; and

control means for controlling said conveyor means so as to transfer said dummy substrates from said second storage means to said vacuum processing chambers and from said vacuum processing chambers to said second storage means respectively before and after said dry cleaning of said vacuum processing chambers.

15. A vacuum processing apparatus having vacuum processing chambers for which dry cleaning is effected therein after substrates to be processed are processed therein in vacuum, said apparatus comprising:

first storage means for storing said substrates to be treated and second storage means for storing dummy substrates, said first and second storage means being disposed in the air atmosphere;

conveyor means for transferring both (1) said substrates to be processed between said first storage means and said vacuum processing chambers, and (2) said dummy substrates between said second storage means and said vacuum processing chambers, said conveyor means having (a) a first buffer means for receiving said substrates to be processed from said first storage means in the air atmosphere and supplying, in vacuum, received substrates to said vacuum processing chamber, and for receiving, in vacuum, processed substrates from said vacuum processing chamber and supplying received processed substrates to said first storage means in the air atmosphere, and (b) a second buffer means for receiving said dummy substrates for cleaning from said second storage means in the air atmosphere and supplying, in vacuum, received dummy substrates to said vacuum processing chamber, and for receiving, in vacuum, used dummy substrates from said vacuum processing chamber and supplying used dummy substrates to said second storage means in the air atmosphere; and

control means for controlling said conveyor means so as to transfer said dummy substrates from said second storage means to said vacuum processing chambers and from said vacuum processing chambers to said second storage means respectively before and after said dry cleaning of said vacuum processing chambers.

16. A vacuum processing apparatus comprising:

a vacuum processing chamber for processing a substrate to be processed in vacuum;

means for effecting a dry cleaning in an inner portion of said vacuum processing chamber after said substrate to be processed is processed;

storage means for storing said substrate to be processed and a dummy substrate, said storage means being maintained, at all times during said processing of said substrate to be processed and during said dry cleaning of said dummy substrate, under an air atmosphere;

transfer means for transferring said substrate to be processed and said dummy substrate between said storage means and said vacuum processing chamber, wherein said transfer means is for transferring, under the air atmosphere, said substrates to be processed and said dummy substrates between said storage means and said vacuum processing chamber; and

control means for controlling said transfer means to as to transfer selectively said substrate to be processed and said dummy substrate from said storage means to said vacuum processing chamber, such that said substrate to be processed is transferred at a time for said processing to be performed and said dummy substrate is transferred at a time required to perform said dry cleaning.

17. A vacuum processing apparatus having vacuum processing chambers for which dry cleaning is effected therein after substrates to be processed are processed therein in vacuum, said apparatus comprising:

first storage means for storing said substrates to be treated and second storage means for storing dummy substrates, said first and second storage means being disposed in the air atmosphere;

conveyor means for transferring both (1) said substrates to be processed between said first storage means and said vacuum processing chambers, and (2) said dummy substrates between said second storage means and said vacuum processing chambers; and

control means for controlling said conveyor means so as to transfer said dummy substrates from said second storage means to said vacuum processing chambers and from said vacuum processing chambers to said second storage means respectively before and after said dry cleaning of said vacuum processing chambers, said control means including means for judging the timing of dry cleaning of said vacuum processing chambers, judgment of the timing of dry cleaning being made with a sensor for measuring intensity of plasma light transmitted through said vacuum processing chambers.

18. A vacuum processing apparatus, comprising:

at least one cassette holder, for storing at least one wafer to be processed;

another cassette holder for storing at least one dummy wafer;

wafer locking structure for holding wafers in a gas atmosphere during a first time period and in a vacuum during a second time period;

evacuating structure for evacuating said wafer locking structure;

gas introduction structure for introducing a gas into the wafer locking structure;

first transfer structure for transferring the at least one wafer to be processed and the at least one dummy wafer between (1) the at least one cassette holder or the another cassette holder and (2) the wafer locking structure, the first transfer structure being under a gas atmosphere;

at least one wafer treating chamber for treating the at least one wafer to be processed in a vacuum; and

second transfer structure, adapted to transfer said at least one wafer to be processed and said at least one dummy wafer between said wafer locking structure and said at least one wafer treating chamber, said second transfer structure being adapted to provide said transfer of said at least one wafer to be processed and said at least one dummy wafer between the wafer locking structure and the at least one wafer treating chamber while the at least one wafer to be processed and said at least one dummy wafer, being transferred by the second transfer structure, are maintained in a vacuum.

19. A vacuum processing apparatus according to claim 18, wherein each of the gas atmospheres is an air atmosphere.

20. A vacuum processing apparatus according to claim 19, wherein the second transfer structure is adapted to be provided in a vacuum.

21. A vacuum processing apparatus according to claim 20, wherein said first and second transfer structures are separate structures.

22. A vacuum processing apparatus according to claim 18, wherein said at least one cassette holder is for storing at least one wafer to be treated in said at least one wafer treating chamber.

23. A vacuum processing apparatus according to claim 18, wherein said at least one cassette holder is for storing at least one wafer which has already been treated in said at least one wafer treating chamber.

24. A vacuum processing apparatus according to claim 18, wherein said at least one cassette holder is disposed in an air atmosphere.

25. A method of operating processing apparatus having at least one wafer treating chamber for treating at least one wafer to be processed in a vacuum, comprising the steps of:

disposing at least one cassette holder, for storing the at least one wafer, in a gas atmosphere;

disposing another cassette holder, for storing at least one dummy wafer, in a gas atmosphere, the at least one cassette holder and the another cassette holder being cassette holders of the processing apparatus; and

transferring said at least one wafer and said at least one dummy wafer between said cassette holders and the at least one wafer treating chamber, by way of a wafer locking structure, wherein said wafer locking structure has a gas therein when the at least one wafer and the at least one dummy wafer are transferred between said cassette holders and said wafer locking structure, and wherein said wafer locking structure has a vacuum therein when said at least one wafer and said at least one dummy wafer are transferred between the at least one wafer treating chamber and said wafer locking structure.

26. A method according to claim 29, including the further step of evacuating said wafer locking structure prior to transferring the at least one wafer and said at least one dummy wafer between the wafer locking structure and the at least one wafer treating chamber.

27. A method according to claim 26, including the further step of introducing said gas into the wafer locking structure when transferring the at least one wafer and the at least one dummy wafer between the wafer locking structure and said cassette holders.

28. A method according to claim 29, including the further step of introducing said gas into the wafer locking structure when transferring the at least one wafer and the at least one dummy wafer between the wafer locking structure and said cassette holders.