Ionized cluster beam deposition of sapphire

• US 5,350,607 A
• Filed: 10/02/1992
• Issued: 09/27/1994
• Est. Priority Date: 10/02/1992
• Status: Expired due to Fees

• Current Assignee: UTMC Microelectronic Systems, Inc. (Cobham PLC)
• Original Assignee: United Technologies Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Tyson, Scott M., Kwor, Richard Y., Levenson, Leonard L.
• Primary Examiner(s): Bell, Mark L.
• Assistant Examiner(s): Sample, David
• Application Number:
  US07/955,607
• Time in Patent Office: 725 Days
• Field of Search: 427/561, 427/562, 427/564, 427/566, 427/576, 427/255.3, 427/248.1, 427/529
• US Class Current: 427/566
• CPC Class Codes: C23C 14/08 Oxides C23C14/10 takes precedence
• CPC Class Codes: C23C 14/221 Ion beam deposition C23C14/46, C23C14/48 take precedence
• CPC Class Codes: C30B 23/02 Epitaxial-layer growth
• CPC Class Codes: C30B 29/20 Aluminium oxides

Abstract

Sapphire, a highly stable oxide of aluminum having the chemical formula of Al₂ O₃, is placed in a crucible. The crucible is heated to vaporize the sapphire therein. The sapphire vapor is ejected through a nozzle in the crucible and into a region having a vacuum pressure of approximately 10^-5 Torr or less. As the vapor leaves the crucible through the nozzle, atom aggregates or clusters are formed through a supercooled phenomenon due to adiabatic expansion. The vacuum region has disposed therein a substrate comprised of one of various materials, including metals, oxides or silicon. The sapphire vapor is accelerated towards the substrate where it deposits on a surface of the substrate in a uniformly distributed thin layer.

Claims

1. A method of depositing a layer of sapphire on a surface of a substrate, comprising the steps of:

depositing sapphire in a crucible having a nozzle;

positioning said crucible in a vacuum chamber having a first pressure level;

positioning said substrate in said vacuum chamber;

heating said crucible to a first temperature to cause said sapphire to be vaporized at a second pressure level within said crucible, said second pressure level being greater in magnitude than said first pressure level, such that said vapor is ejected through said nozzle, thereby forming clusters of sapphire by adiabatic expansion, said sapphire clusters being formed in said vacuum chamber outside of said crucible in the vicinity of said nozzle;

bombarding said sapphire clusters with electrons, thereby resulting in some number of said sapphire clusters being partially ionized along with some number of sapphire clusters remaining non-ionized; and

accelerating both said ionized and non-ionized sapphire clusters toward a surface of said substrate to form a deposited sapphire film thereon of a thickness.

2. The method of claim 1, wherein said first pressure level of said vacuum chamber is no greater than 1×

10^-5 Torr.

3. The method of claim 1, wherein said crucible is comprised of graphite.

4. The method of claim 1, wherein said step of heating said crucible comprises the step of emitting electrons towards said crucible so as to heat said crucible by electron impact.

5. The method of claim 1, wherein said step of heating said crucible comprises the step of resistive heating.

6. The method of claim 1, wherein said step of accelerating said sapphire clusters towards said substrate comprises the step of applying an acceleration voltage between said crucible and said substrate.

7. The method of claim 6, wherein said acceleration voltage is substantially in the range of 200 to 500 volts.

8. The method of claim 1, further comprising the step of heating said substrate to a second temperature.

9. The method of claim 8, wherein said second temperature is substantially in the range of 400 to 600 degrees centigrade.

10. The method of claim 1, further comprising the step of providing an oxygen partial pressure within said vacuum chamber in the range of 5×

10^-5 to 1×

10^-4 Torr.

11. The method of claim 1, wherein said step of bombarding said sapphire clusters with electrons comprises the step of applying an electron ionization current to an electron emitting filament.

12. The method of claim 11, wherein said electron ionization current is in the range of 200 to 300 milliamps.

13. The method of claim 1, wherein said substrate comprises aluminum.

14. The method of claim 1, wherein said substrate comprises an aluminum alloy.

15. The method of claim 1, wherein said substrate comprises an oxide.

16. The method of claim 1, wherein said substrate comprises silicon dioxide.

17. The method of claim 1, wherein said substrate comprises silicon nitride.

18. The method of claim 1, wherein said substrate comprises doped glass.

19. The method of claim 1, wherein said substrate comprises undoped glass.

20. The method of claim 1, wherein said substrate comprises silicon.

21. The method of claim 1, wherein said first temperature of said crucible is controlled by a vibration frequency of a crystal coupled to said substrate, said vibration frequency corresponding to a deposition rate of said deposited sapphire film on said substrate.

22. A method for forming a sapphire layer superjacent a substrate, said method comprising the steps of:

providing sapphire in a crucible having a nozzle;

positioning said crucible and a substrate within a vacuum chamber, said vacuum chamber having a first pressure level, said substrate comprising at least one of single crystal silicon, polycrystalline silicon, amorphous silicon, aluminum, silicon dioxide, silicon nitride, doped glass, undoped glass, and an oxide;

heating said crucible to a first temperature to vaporize said sapphire at a second pressure level within said crucible;

regulating said heating of said crucible at said first temperature by a vibration frequency of a crystal coupled to said substrate, said vibration frequency corresponding to a deposition rate of said deposited sapphire film on said substrate, such that said second pressure level substantially exceeds said first pressure level, thereby forming clusters of sapphire and ejecting said sapphire clusters from said crucible in the direction of said substrate;

ionizing a portion of said sapphire clusters by electron bombardment, thereby providing a remaining portion of non-ionized sapphire clusters; and

accelerating both said ionized and said non-ionized clusters toward said substrate, thereby forming a sapphire film superjacent said substrate.

23. The method of claim 22, wherein said regulating comprises the step of:

supercooling said ejected sapphire clusters by means of adiabatic expansion.

24. The method of claim 22, wherein said regulating comprises the step of:

heating said substrate to a temperature substantially in the range of 400 to 600 centigrade after said sapphire clusters are ejected.

25. The method of claim 22, further comprising the step of:

introducing an oxygen partial pressure within said vacuum chamber in the range of 5×

10^-5 and 10^-4 Torr.