Acceleration sensor assembly

• US 5,351,542 A
• Filed: 01/27/1992
• Issued: 10/04/1994
• Est. Priority Date: 01/27/1992
• Status: Expired due to Fees

• Current Assignee: Kansei Company
• Original Assignee: Kansei Company
• Inventors: Goto, Masaru, Ichimura, Etsuo
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): NOT, DEFINED
• Application Number:
  US07/826,950
• Time in Patent Office: 981 Days
• Field of Search: 73/517 R, 73/516 R, 338/2, 338/5
• US Class Current: 73/514.33
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges

Abstract

An acceleration sensor assembly is shown, which comprises a base board; a ceramic plate bonded to the base board, the ceramic plate having predetermined circuits printed thereon; an operational amplifier in the shape of Silicon-chip, the amplifier being mounted on the ceramic plate; an acceleration sensor proper mounted on the ceramic plate, the sensor proper being of a piezoresistance semiconductor type; a first group of bonding wires through which the operational amplifier and the circuits are connected; and a second group of bonding wires through which the acceleration sensor proper and the circuits are connected. In order to facilitate the bonding connection of the bonding wires to their associated parts, the bonding wires of the first and second groups are identical in diameter.

Claims

1. An acceleration sensor assembly comprising:

a base board;

a ceramic plate bonded to said base board and having predetermined circuits printed thereon;

a silicon-chip operational amplifier mounted on said ceramic plate;

a piezoresistance semiconductor acceleration sensor mounted on said ceramic plate;

a first group of bonding wires through which said operational amplifier and said circuits are electrically connected; and

a second group of bonding wires through which said acceleration sensor and said circuits are electrically connected,

wherein said acceleration sensor includes lower and upper cases united to constitute a housing;

an apertured silicon plate member installed in said housing and having a frame portion, a center weight portion, and thinner beam portions through which said frame portion and said center weight portion are integrally connected, said center weight portion being displaceable relative to said frame portion causing deformation of said thinner beam portions upon application of a specific acceleration to said center weight portion;

piezoelectric resistors mounted on said thinner beam portions;

wires connecting said piezoelectric resistors to constitute a bridge circuit; and

a plurality of terminals connected to said wires and said second group of bonding wires, and

wherein the bonding wires of said first and second groups are of the same type and are identical in diameter.

2. An acceleration sensor assembly as claimed in claim 1, in which said bonding wires of said first and second groups are bonded to respective terminals of said operational amplifier and said acceleration sensor.

3. An acceleration sensor assembly as claimed in claim 1, in which said wiring connecting said piezoelectric resistors is made by gold wires.

4. An acceleration sensor assembly as claimed in claim 3, in which said lower and upper cases have inwardly projected stopper portions by which excessive movement of said center weight portion is suppressed.

5. An acceleration sensor assembly as claimed in claim 4, in which said center weight portion is shaped thicker than the remaining portion of said silicon plate member.

6. An acceleration sensor assembly as claimed in claim 1, in which the bridge circuit of said wires has five terminals.

7. An acceleration sensor assembly as claimed in claim 1, in which said bonding wires of said first and second groups are gold wires of about 30μ

to about 35μ

in diameter or aluminum wires of about 150μ

in diameter.