Curable polyphenylene ether and cyanurate resin composition and a cured resin composition obtainable therefrom

• US 5,352,745 A
• Filed: 11/03/1993
• Issued: 10/04/1994
• Est. Priority Date: 01/11/1991
• Status: Expired due to Term

• Current Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
• Original Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
• Inventors: Oda, Hiroji, Ishii, Yoshiyuki, Katayose, Teruo
• Primary Examiner(s): Marquis, Melvyn I.
• Assistant Examiner(s): GULAKOWSKI, RANDY P
• Application Number:
  US08/145,655
• Time in Patent Office: 335 Days
• Field of Search: 525/391, 525/392, 525/395, 525/396, 525/397, 525/529, 525/533, 525/530, 525/905, 428/461
• US Class Current: 525/391
• CPC Class Codes: C08F 290/142 Polyethers
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 61/00 Compositions of condensation polymers of aldehydes or ketones with polyalcohols C08L59/00; with polynitriles C08L77/00; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 71/126 modified by chemical after-treatment
• CPC Class Codes: H05K 1/0326 containing O
• CPC Class Codes: Y10S 525/905 Polyphenylene oxide
• CPC Class Codes: Y10T 428/31692 Next to addition polymer from unsaturated monomers

Abstract

A novel curable polyphenylene ether resin composition caontains (a) a curable polyphenylene ether resin containing at least a reaction product of a polyphenylene ether with an unsaturated carboxylic acid or an acid anhydride, (b) at least one cyanurate selected from the group consisting of triallyl isocyanurate and triallyl cyanurate, optionally (c) a resin composition comprising an epoxy resin and a curing agent and/or (d) a compound having at least one unsaturated double bond and at least one epoxy group and/or (e) a reinforcement material. The resin composition has excellent film-forming properties, resin flowability in pressing and storage stability. A cured polyphenylene ether resin composition obtained by curing the curable polyphenylene ether resin composition has excellent chemical resistance, heat resistance, dielectric properties and dimensional stability.

Claims

1. A curable polyphenylene ether resin composition consisting essentially of:

(a) 98 to 40% by weight, based on the total weight of components (a) and (b), of a curable polyphenylene ether resin comprising a reaction product of a polyphenylene ether with one of an unsaturated carboxylic acid and an acid anhydride;

(b) 2 to 60% by weight, based on the total weight of components (a) and (b), of at least one cyanurate selected from the group consisting of triallyl isocyanurate and triallyl cyanurate;

(c) 0 to 90% by weight, based on the total weight of components (a), (b) and (c), of a resin composition comprising an epoxy resin and a curing agent;

(d) 0 to 30% by weight, based on the total weight of components (a), (b), (c) and (d), of a compound having at least one unsaturated double bond and at least one epoxy group;

(e) 0 to 90% by weight, based on the total weight of components (a), (b), (c), (d) and (e), of at least one reinforcement material selected from the group consisting of glass fabrics, ceramic fiber fabrics, asbestos fabrics, metallic fiber fabrics synthetic or natural inorganic fiber fabrics, woven or non-woven fabrics of synthetic fibers, natural woven fabrics, carbon fiber fabrics and natural cellulosic fabrics.

2. The curable polyphenylene ether resin composition of claim 1 wherein the amount of each of components (c), (d) and (e) is zero.

3. A film prepared from the curable polyphenylene ether resin composition of claim 2.

4. A cured polyphenylene ether resin composition obtained by curing the curable polyphenylene ether resin composition of claim 2.

5. A film prepared from the curable polyphenylene ether resin composition of claim 4.

6. The curable polyphenylene ether resin composition of claim 1 wherein the amount of component (e) is 5 to 90% by weight, based on the total weight of components (a), (b), (c), (d) and (e), and the amount of each of components (c) and (d) is zero.

7. A cured polyphenylene ether resin composition obtained by curing the curable polyphenylene ether resin composition of claim 6.

8. The curable polyphenylene ether resin composition of claim 1 wherein the amount of component (c) is 10 to 90% by weight, based on the total weight of components (a), (b), (c), (d) and (e), and the amount of each of components (d) and (e) is zero.

9. The curable polyphenylene ether resin composition of claim 1 or claim 8 wherein said epoxy resin comprises a brominated bisphenol polyglycidyl ether resin (i) and a novolak epoxy resin (ii), and said curing agent is a phenol resin (iii) in component (c).

10. The curable polyphenylene ether resin composition of claim 9 wherein a content of bromine is in the range of 5 to 20% by weight .

11. A film prepared from the curable polyphenylene ether resin composition of claim 8.

12. A cured polyphenylene ether resin composition having a single glass transition temperature, obtained by curing the curable polyphenylene ether resin composition of claim 8.

13. A film prepared from the cured polyphenylene ether resin composition of claim 12.

14. The curable polyphenylene ether resin composition of claim 1 or 8 wherein the amount of component (e) is 5 to 90% by weight, based on the total weight of components (a), (b), (c), (d) and (e), and the amount of component (d) is zero.

15. A cured polyphenylene ether resin composition having a single glass transition temperature, obtained by curing the curable polyphenylene ether resin composition of claim 14.

16. The curable polyphenylene ether resin composition claim 1 wherein the amount of component (c) is 10 to 90% by weight and the amount of component (d) is 0.1 to 30% by weight, based on the total weight of components (a), (b), (c), (d) and (e), and the amount of component (e) is zero.

17. The curable polyphenylene ether resin composition of claim 16 wherein said epoxy resin comprises a brominated bisphenol polyglycidyl ether resin (i) and a novolak epoxy resin (ii), and said curing agent is a phenol resin (iii) in component (c).

18. The curable polyphenylene ether resin composition of claim 17 wherein a content of bromine is in the range of 5 to 20% by weight.

19. A film prepared from the curable polyphenylene ether resin composition of any one of claim 16, claim 17 or claim 18.

20. A cured polyphenylene ether resin composition having a single glass transition temperature, obtained by curing the curable polyphenylene ether resin composition of any one of claim 16, claim 17 or claim 18.

21. A film prepared from the cured polyphenylene ether resin composition of claim 20.

22. The curable polyphenylene ether resin composition of any one of claim 1, claim 16, claim 17 or claim 18 wherein the amount of component (e) is 5 to 90% by weight, based on the total weight of components (a), (b), (c), (d) and (e).

23. A cured polyphenylene ether resin composition having a single glass transition temperature, obtained by curing the curable polyphenylene ether resin composition of claim 22.