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Flip chip package and method of making

  • US 5,352,926 A
  • Filed: 01/04/1993
  • Issued: 10/04/1994
  • Est. Priority Date: 01/04/1993
  • Status: Expired due to Term
First Claim
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1. A semiconductor package, comprising:

  • a base plate comprised of a thermally and electrically conductive material; and

    a semiconductor die having at least a first and a second bump formed thereon, wherein the semiconductor die is rigidly connected to the base plate through the first bump and is flexibly connected to the base plate through the second bump by way of a flexible dielectric material which is disposed on a portion of the base plate.

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