Power amplifier assembly

• US 5,352,991 A
• Filed: 08/12/1993
• Issued: 10/04/1994
• Est. Priority Date: 08/12/1993
• Status: Expired due to Term

• Current Assignee: Motorola Solutions, Inc.
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Lipschultz, Jeffrey S., Lubbe, John N., Pullman, Marc H.
• Primary Examiner(s): Sikes, William L.
• Assistant Examiner(s): Abraham, Fetsum
• Application Number:
  US08/105,243
• Time in Patent Office: 418 Days
• Field of Search: 330/65, 330/66, 330/67, 330/68, 330/289, 257/706, 257/707
• US Class Current: 330/289
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A power amplifier assembly that dissipates a maximum of one thousand one hundred watts includes a power amplifier circuit and a chassis that has an overall volume of 0.02 cubic meters. The chassis includes a heat sink base that contains a mounting pattern for the power amplifier circuit. By thermally coupling the power amplifier circuit to the heat sink base via thermal coupling devices and the mounting pattern, the heat sink base dissipates a maximum of one thousand one hundred watts in a volume of 0.016 cubic meters.

Claims

1. A power amplifier assembly that dissipates a maximum of one thousand one hundred watts, the power amplifier assembly comprises:

a power amplifier circuit that includes at least one power element and a plurality of circuit elements;

at least one thermal coupling device that is thermally coupled to the at least one power element; and

a chassis that includes a heat sink base, wherein the heat sink base includes a mounting pattern for the plurality of circuit elements and the at least one thermal coupling device, wherein the chassis has an overall volume of 0.02 cubic meters, and wherein the heat sink base has a power dissipation of 1,100 watts/0.016 cubic meters.

2. The power amplifier assembly of claim 1 further comprises at least one forced air cooling device, wherein the at least one forced air cooling device forces air across the heat sink base.

3. In the power amplifier assembly of claim 1, the mounting pattern comprises a plurality of recessed areas cast in the heat sink base.

4. In the power amplifier assembly of claim 1, the at least one power element comprises at least one amplifier circuit deposited on a ceramic substrate.

5. In the power amplifier assembly of claim 4, the at least one thermal coupling device comprises a carbon composition material.

6. In the power amplifier assembly of claim 5, the carbon composition material comprises graphite.

7. A power amplifier assembly that dissipates a maximum of one thousand one hundred watts, the power amplifier assembly comprises:

a power amplifier circuit that includes a direct current (DC) distribution module, a pre-amplifier module, a splitter module, at least one power element, a combiner module, an isolator module, and a low pass filter and directional coupler module;

a plurality of thermal coupling devices, wherein each of the plurality of thermal coupling devices is thermally coupled to one of either the at least one power element, the splitter module, the combiner module, or the low pass filter and directional coupler module; and

a chassis that includes a heat sink base, wherein the heat sink base includes a mounting pattern for the DC distribution module, the preamplifier module, the isolator module, and the plurality of thermal coupling devices, wherein the chassis has an overall volume of 0.02 cubic meters, wherein the heat sink base has a power dissipation of 1,100 watts/0.016 cubic meters, and wherein, when the power amplifier circuit is mounted to the heat sink base, the DC distribution module, the pre-amplifier module, the splitter module, the at least one power element, the combiner module, the isolator module, and the low pass filter and directional coupler module form a substantially planar assembly.

8. The power amplifier assembly of claim 7 further comprises at least one forced air cooling device, wherein the at least one forced air cooling device forces air across the heat sink base.

9. In the power amplifier assembly of claim 7, the mounting pattern comprises a plurality of recessed areas cast in the heat sink base.

10. In the power amplifier assembly of claim 7, the at least one power element comprises at least one amplifier circuit deposited on a ceramic substrate.

11. In the power amplifier assembly of claim 10, each of the plurality of thermal coupling devices comprises a carbon composition material.

12. In the power amplifier assembly of claim 11, the carbon composition material comprises graphite.