Power amplifier assembly
First Claim
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1. A power amplifier assembly that dissipates a maximum of one thousand one hundred watts, the power amplifier assembly comprises:
- a power amplifier circuit that includes at least one power element and a plurality of circuit elements;
at least one thermal coupling device that is thermally coupled to the at least one power element; and
a chassis that includes a heat sink base, wherein the heat sink base includes a mounting pattern for the plurality of circuit elements and the at least one thermal coupling device, wherein the chassis has an overall volume of 0.02 cubic meters, and wherein the heat sink base has a power dissipation of 1,100 watts/0.016 cubic meters.
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Abstract
A power amplifier assembly that dissipates a maximum of one thousand one hundred watts includes a power amplifier circuit and a chassis that has an overall volume of 0.02 cubic meters. The chassis includes a heat sink base that contains a mounting pattern for the power amplifier circuit. By thermally coupling the power amplifier circuit to the heat sink base via thermal coupling devices and the mounting pattern, the heat sink base dissipates a maximum of one thousand one hundred watts in a volume of 0.016 cubic meters.
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Citations
12 Claims
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1. A power amplifier assembly that dissipates a maximum of one thousand one hundred watts, the power amplifier assembly comprises:
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a power amplifier circuit that includes at least one power element and a plurality of circuit elements; at least one thermal coupling device that is thermally coupled to the at least one power element; and a chassis that includes a heat sink base, wherein the heat sink base includes a mounting pattern for the plurality of circuit elements and the at least one thermal coupling device, wherein the chassis has an overall volume of 0.02 cubic meters, and wherein the heat sink base has a power dissipation of 1,100 watts/0.016 cubic meters. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A power amplifier assembly that dissipates a maximum of one thousand one hundred watts, the power amplifier assembly comprises:
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a power amplifier circuit that includes a direct current (DC) distribution module, a pre-amplifier module, a splitter module, at least one power element, a combiner module, an isolator module, and a low pass filter and directional coupler module; a plurality of thermal coupling devices, wherein each of the plurality of thermal coupling devices is thermally coupled to one of either the at least one power element, the splitter module, the combiner module, or the low pass filter and directional coupler module; and a chassis that includes a heat sink base, wherein the heat sink base includes a mounting pattern for the DC distribution module, the preamplifier module, the isolator module, and the plurality of thermal coupling devices, wherein the chassis has an overall volume of 0.02 cubic meters, wherein the heat sink base has a power dissipation of 1,100 watts/0.016 cubic meters, and wherein, when the power amplifier circuit is mounted to the heat sink base, the DC distribution module, the pre-amplifier module, the splitter module, the at least one power element, the combiner module, the isolator module, and the low pass filter and directional coupler module form a substantially planar assembly. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification