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Method for fabricating an integrated circuit module

  • US 5,353,498 A
  • Filed: 07/09/1993
  • Issued: 10/11/1994
  • Est. Priority Date: 02/08/1993
  • Status: Expired due to Term
First Claim
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1. A method of fabricating an integrated circuit module substrate on a base, comprising the steps of:

  • applying an insulative base sheet over said base, said base sheet comprising a polymer film having an adhesive coating situated on the side of the polymer film opposite said base;

    placing a plurality of chips having contact pads face down on said base sheet;

    positioning a mold form around said chips;

    adding substrate molding material within said mold form;

    hardening said substrate molding material;

    separating said base from said base sheet;

    forming a plurality of vias through said base sheet, some of said plurality of vias being aligned with predetermined ones of said contact pads; and

    providing a pattern of electrical conductors extending through selected ones of said plurality of vias in said base sheet to form an integrated circuit module.

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