Ball grid array with via interconnection
First Claim
1. A packaged integrated circuit, comprising:
- a substrate having first and second opposed surfaces, electrically conductive first traces being formed on the first surface of the substrate;
a series of electrically conductive pads extending across a portion of the substrate opposite the first surface of the substrate;
a series of vias formed in the substrate, each via extending to one of said pads;
electrically conductive plating material on sidewalls of said vias in electrical contact with selected ones of said first traces and with selected ones of said pads;
an electronic device attached to the first surface of the substrate;
means for making electrical connection between the electronic device and at least one of the first traces on the substrate; and
encapsulant formed around the electronic device so as to protect the electronic device, the encapsulant covering at least a portion of the first surface of the substrate, filling said vias and extending against a via-facing surface of said pads.
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0 Petitions
Accused Products
Abstract
A ball grid array is formed by mounting and electrically connecting one or more electronic devices to a substrate in which vias are formed to interconnect electrically conductive traces formed in a surface of the substrate to solder ball pads formed at an opposite surface of the substrate. The vias are formed by mechanical or laser drilling. Solder balls are formed on each of the pads and are reflow-attached to, for instance, a printed circuit board. The electronic components can include one or more integrated circuit chips, as well as passive components. The electronic components are attached to the substrate using wirebonding, TAB or flip chip connection. An encapsulating material is applied to encapsulate the electronic devices.
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Citations
17 Claims
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1. A packaged integrated circuit, comprising:
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a substrate having first and second opposed surfaces, electrically conductive first traces being formed on the first surface of the substrate; a series of electrically conductive pads extending across a portion of the substrate opposite the first surface of the substrate; a series of vias formed in the substrate, each via extending to one of said pads; electrically conductive plating material on sidewalls of said vias in electrical contact with selected ones of said first traces and with selected ones of said pads; an electronic device attached to the first surface of the substrate; means for making electrical connection between the electronic device and at least one of the first traces on the substrate; and encapsulant formed around the electronic device so as to protect the electronic device, the encapsulant covering at least a portion of the first surface of the substrate, filling said vias and extending against a via-facing surface of said pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming a package integrated circuit comprising the steps of:
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fabricating a substrate having a first surface and an opposed second surface; forming a series of electrically conductive first traces on said first surface; forming a series of electrically conductive pads extending across a portion of the substrate opposite to said first surface; then forming a series of vias through said substrate to a via-facing surface of the pads; depositing a conductive plating in said vias and extending from selected ones of said first traces to selected ones of said pads; attaching an electronic device to said first surface; electrically connecting the electronic device to said first traces; and encapsulating the electronic device with an electrically insulating encapsulant so as to protect the electronic device, the encapsulant covering at least part of said first surface, filling said vias and extending against said via-facing surface of said pads. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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Specification