Production of a polymer/metal or polymer/semiconductor composite

• US 5,356,511 A
• Filed: 07/16/1993
• Issued: 10/18/1994
• Est. Priority Date: 07/21/1992
• Status: Expired due to Fees

• Current Assignee: BASF AG (BASF SE)
• Original Assignee: BASF AG (BASF SE)
• Inventors: Harth, Klaus, Hibst, Hartmut, Hoessel, Peter, Hoffmann, Gerhard
• Primary Examiner(s): Dang, Thi
• Application Number:
  US08/092,494
• Time in Patent Office: 459 Days
• Field of Search: 156/629, 156/633, 156/634, 156/645, 156/643
• US Class Current: 438/780
• CPC Class Codes: B05D 7/14 to metal, e.g. car bodies involving a chemical reaction between the metal and the coating C23
• CPC Class Codes: B05D 7/51 One specific pretreatment, e.g. phosphatation, chromatation, in combination with one specific coating pretreatment of metallic substrates C23C; pretreatment before coating in general B05D3/00
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/082 comprising vinyl resins; comprising acrylic resins
• CPC Class Codes: B32B 15/18 comprising iron or steel B32B15/011, B32B15/012 and B32B15/013 take precedence
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2307/734 Dimensional stability
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C23F 1/02 Local etching
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: H05K 3/383 by microetching
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer

Abstract

A process for producing a polymer/metal or polymer/semiconductor composite having an adhesive layer between the polymer and the metal or between the polymer and the semiconductor in which a layer of at least two different chemical elements is applied to the metal or semiconductor by vapor-deposition or cathode sputtering, then selectively or partially removing at least one chemical element of this layer in an etching process, and then applying the polymer.

Claims

1. A process for producing a polymer/metal or polymer/semiconductor composite having an adhesive layer between a polymer and a metal or between a polymer and a semiconductor, which comprises applying to the metal or semiconductor a layer of at least two different chemical elements by vapor-deposition or cathode sputtering, then selectively or partially removing at least one chemical element of this layer in an etching process to form an adhesion layer, and then applying the polymer.

2. A process as claimed in claim 1, wherein the different chemical elements employed for the production of the adhesive layer are at least one element selected from the group consisting of boron, beryllium, magnesium and aluminum, in combination with at least one element selected from the group consisting of carbon, silicon, titanium and chromium.

3. A process as claimed in claim 1, wherein the adhesive layer has a thickness of from 0.1 nm to 10 μ

m.

4. A process as claimed in claim 1, wherein the polymer is applied by compression molding, injection molding, extrusion, calendering or casting.

5. A process as claimed in claim 1, wherein the etching process is carried out chemically by means of acids, lyes or reactive gases.

6. A process as claimed in claim 1 wherein the etching process is carried out with the aid of a plasma.

7. A process as claimed in claim 1, wherein the metal in the polymer/metal composite is a dimensionally stable, rigid metallic carrier, a flexible, sheet-like metallic carrier, a metal foil, a metallic carrier in wire or fiber form or an article coated with a metal layer.

8. A process as claimed in claim 1, wherein the polymer is in the form of a polymer film.