Micromachined differential pressure transducers

• US 5,357,807 A
• Filed: 10/05/1992
• Issued: 10/25/1994
• Est. Priority Date: 12/07/1990
• Status: Expired due to Term

• Current Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Original Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Inventors: Christensen, Todd R., Guckel, Henry
• Primary Examiner(s): Woodiel, Donald
• Application Number:
  US07/957,505
• Time in Patent Office: 750 Days
• Field of Search: 73/715, 73/716-728, 73/756, 73/706, 361/283, 338/4
• US Class Current: 73/721
• CPC Class Codes: G01L 19/0618 Overload protection
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0055 bonded on a diaphragm
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: Y10S 430/168 X-ray exposure process
• CPC Class Codes: Y10T 29/49103 Strain gauge making
• CPC Class Codes: Y10T 29/49812 Temporary protective coating, impregnation, or cast layer

Abstract

Microminiature pressure transducers are formed on semiconductor substrates such as silicon and include a membrane which spans a cavity over the substrate, with the membrane being mounted to and sealed to the substrate at the peripheral edges of the membrane. The bottom of the cavity forms an overpressure stop to prevent over deflections of the membrane toward the substrate. An overpressure stop formed as a bridge of a material such as nickel extends above the membrane and is spaced therefrom to allow the membrane to deflect freely under normal pressure situations but prevent over deflections. The thickness of the polysilicon membrane and the spacing between the membrane and the overpressure stops is preferably in the range of 10 micrometers or less, and typically in the range of one micrometer. The overpressure stop bridge is formed utilizing deep X-ray lithography to form a well-defined bridge structure. The gap between the membrane and the bottom surface of the bridge is established with a sacrificial layer, such as a polyimide film, which dissolves in a solvent. The transducer is formed utilizing processing techniques which do not affect the performance of the membrane as a pressure sensor and which allow the substrate to have further micromechanical or microelectronic devices formed thereon.

Claims

1. A micromachined differential pressure transducer comprising:

(a) a substrate having top and bottom sides;

(b) a deformable membrane mounted to and sealed at its peripheral edges to the top of the substrate and spaced from the substrate at its central portion to define a cavity which is sealed between the membrane and the substrate, the bottom of the cavity in the substrate being spaced from the membrane to allow normal deflections of the membrane but providing an overpressure stop for membrane deflection toward the substrate to prevent damage to the membrane;

(c) at least one channel leading from a remote position in the substrate to the cavity to provide communication therefrom to the cavity;

(d) an overpressure stop mounted to the top of the substrate and having a bridge portion spanning the membrane and spaced therefrom to allow normal deflections of the membrane while providing an overpressure stop to prevent displacements of the membrane away from the substrate which would damage the membrane, the spacing between the overpressure stop bridge and the membrane and between the membrane and the bottom of the cavity being less than about 10 micrometers; and

(e) means for sensing the deflections of the membrane.

2. The transducer of claim 1 wherein the substrate is formed of single crystal silicon.

3. The transducer of claim 1 wherein the membrane is formed of polycrystalline silicon.

4. The transducer of claim 3 including piezoresistive resistors formed on the polysilicon membrane to provide the means for sensing the deflections in the membrane by changes in the resistance of such resistors.

5. The transducer of claim 4 wherein the bridge is formed of a conductive metal, and further including a layer of conductive metal formed on the top surface of the membrane such that a capacitor is formed between the metal layer on the membrane and the bridge to provide the means for sensing deflections of the membrane by measuring the change in capacitance of such capacitor which is indicative of changes in displacement of the membrane, whereby the measurements of membrane displacements made by the change in capacitance and by the change in resistance of the piezoresistors can be correlated with each other.

6. The transducer of claim 1 wherein the overpressure stop bridge is formed of electroplated nickel.

7. The transducer of claim 4 including a layer of conductive metal on the top surface of the membrane facing the overpressure stop bridge such that the layer of metal on the membrane and the bridge form two plates of a capacitor to provide the means for sensing the deflections of the membrane by changes in capacitance of such capacitor.

8. The transducer of claim 1 wherein the cavity is defined as an indentation in the substrate.

9. The transducer of claim 6 wherein the indentation has a deep central portion and shallow peripheral portions, and wherein the channel in the substrate is in communication with the shallower peripheral portions of the cavity.

10. The transducer of claim 1 wherein the channels are formed to extend from the bottom side of the substrate through the substrate to communication with the cavity.

11. The transducer of claim 1 wherein the bridge is formed of a conductive metal, and further including a layer of conductive metal formed on the top surface of the membrane facing the bridge such that a capacitor is formed between the metal layer on the membrane and the bridge to provide the means for sensing deflections of the membrane by changes in capacitance of such capacitor.

12. The transducer of claim 1 wherein the membrane has a thickness in the range of 10 micrometers or less.

13. The transducer of claim 1 wherein the membrane has a thickness of approximately 1 micrometer.

14. A micromachined differential pressure transducer comprising:

(a) a single crystal silicon substrate having top and bottom sides;

(b) a deformable polycrystalline silicon membrane mounted to and sealed at its peripheral edges to the top of the substrate and spaced from the substrate at its central portion to define a cavity which is sealed between the membrane and the substrate, the bottom of the cavity in the substrate being spaced from the membrane to allow normal deflections of the membrane but providing an overpressure stop for membrane deflection toward the substrate to prevent damage to the membrane, the membrane having a thickness of about 10 micrometers or less;

(c) at least one channel leading from a remote position in the substrate to the cavity to provide communication therefrom to the cavity;

(d) an overpressure stop formed of electroplated metal mounted to the top of the substrate and having a bridge portion spanning the membrane and spaced therefrom to allow normal deflections of the membrane while providing an overpressure stop to prevent displacements of the membrane away from the substrate which would damage the membrane, the spacing between the overpressure stop bridge and the membrane and between the membrane and the bottom of the cavity being less than about 10 micrometers; and

(e) means for sensing the deflections of the membrane.

15. The transducer of claim 14 wherein the overpressure stop bridge is formed of electroplated nickel.

16. The transducer of claim 14 including a layer of conductive metal on the top surface of the membrane facing the overpressure stop bridge such that the layer of metal on the membrane and the bridge form two plates of a capacitor to provide the means for sensing the deflections of the membrane by changes in capacitance of such capacitor.

17. The transducer of claim 14 wherein the cavity is formed as an indentation in the substrate having a deep central portion and shallow peripheral portions, and wherein the channel in the substrate is in communication with the shallower peripheral portions of the cavity.

18. The transducer of claim 14 including piezoresistive resistors formed on the polysilicon membrane to provide the means for sensing the deflections in the membrane by changes in the resistance of such resistors.

19. The transducer of claim 18 wherein the bridge is formed of a conductive metal, and further including a layer of conductive metal formed on the top surface of the membrane such that a capacitor is formed between the metal layer on the membrane and the bridge to provide the means for sensing deflections of the membrane by measuring the change in capacitance of such capacitor which is indicative of changes in displacement of the membrane, whereby the measurements of membrane displacements made by the change in capacitance and by the change in resistance of the piezoresistors can be correlated with each other.