Semiconductor architecture and application thereof

• US 5,361,272 A
• Filed: 09/18/1992
• Issued: 11/01/1994
• Est. Priority Date: 09/18/1992
• Status: Expired due to Fees

• Current Assignee: Integrated Data Systems Inc (ACI Worldwide Incorporated)
• Original Assignee: Integrated Data Systems Inc (ACI Worldwide Incorporated), Stephen Krissman
• Inventors: Gorelik, Vladimir
• Primary Examiner(s): Epps, Georgia Y.
• Application Number:
  US07/947,410
• Time in Patent Office: 774 Days
• Field of Search: 372/50, 372/45, 372/34, 372/35, 257/80
• US Class Current: 372/50.21
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence
• CPC Class Codes: H04N 25/00 Circuitry of solid-state image sensors [SSIS]; Control thereof

Abstract

A new technology in semiconductor electronics is provided wherein basic semiconductor elements (BSEs) are fabricated on the surfaces of hollow, cone-shaped and/or other planar or non-planar substrata. Photosensitive and photoemitting elements are included within each BSE capable of transmitting and receiving signals to and from external sources in a direction that is non-parallel (oblique) to the silicon surface and circuitry plane. Inter-BSE communication are also achieved via fiber optic connectors. In one embodiment, the BSEs may be assembled in an efficient arrangement whereby some numbers of BSEs (for example, six (6)) are located adjacent and surrounding another "polar" BSE, thereby providing for short opto-electronic connections between the polar BSE and its neighbors.

Claims

1. A semiconductor element assembly comprising:

(a) a first non-planar substrate, and

(b) a first semiconductor material coupled to said first non-planar substrate, wherein said first semiconductor material has a curved exterior surface.

2. The semiconductor element assembly of claim 1, further comprising:

(c) at least one electronic circuit fabricated on said first semiconductor material.

3. The semiconductor element assembly of claim 1, wherein said first non-planar substrate is made of a ceramic material.

4. The semiconductor element assembly of claim 1, wherein said first non-planar substrate is made of pure carbon.

5. The semiconductor element assembly of claim 1, wherein said first non-planar substrate is made of silicon dioxide (SiO₂).

6. The semiconductor element assembly of claim 1, wherein said first non-planar substrate is doped to match the lattice structure of said first semiconductor material.

7. The semiconductor element assembly of claim 1, wherein said first non-planar substrate is substantially cone-shaped.

8. The semiconductor element assembly of claim 1, wherein said first non-planar substrate includes a cavity within its interior.

9. The semiconductor element assembly of claim 8, further comprising:

(c) a power supply means within said cavity for providing power to said first non-planar substrate.

10. The semiconductor element assembly of claim 9, further comprising:

(d) coolant conduit means travelling through said power supply means and abutting said first non-planar substrate for cooling said semiconductor element assembly, said coolant conduit means adapted for containing a fluid coolant.

11. The semiconductor element assembly of claim 1, wherein said first non-planar substrate is substantially spherical.

12. The semiconductor element assembly of claim 1, wherein said first non-planar substrate comprises a three-dimensional surface connecting two circles residing in different parallel planes.

13. The semiconductor element assembly of claim 1, wherein said first semiconductor material comprises a first semiconductor layer composed of GaAs.

14. The semiconductor element assembly of claim 13, wherein said GaAs layer is in the range of 50-200 Angstroms thick.

15. The semiconductor element assembly of claim 13, wherein said first semiconductor material further comprises a second semiconductor layer composed of an element from the following group:

Si or GaAs.

16. The semiconductor element assembly of claim 1, further comprising:

(c) transmitting means coupled to said first semiconductor material for transmitting signals from said first semiconductor material to a destination external to said first semiconductor material.

17. The semiconductor element assembly of claim 16, wherein said transmitted signals comprise light signals.

18. The semiconductor element assembly of claim 16, wherein said transmitting means comprises an edge-emitting laser.

19. The semiconductor element assembly of claim 16, wherein said transmitting means comprises a surface-emitting laser.

20. The semiconductor element assembly of claim 19, wherein said surface-emitting laser includes a cone-shaped beam splitter.

21. The semiconductor element assembly of claim 1, further comprising:

(c) receiving means coupled to said first semiconductor material for receiving signals from a source external to said first semiconductor material to said first semiconductor material, and providing said signals to said first semiconductor material.

22. The semiconductor element assembly of claim 21, wherein said received signals comprise light signals.

23. The semiconductor element assembly of claim 21, wherein said receiving means comprises a photo-sensitive element.

24. The semiconductor element assembly of claim 1, further comprising:

(c) transmitting means coupled to said first semiconductor material for transmitting first signals from said first semiconductor material to a receiver associated with another semiconductor element, and

(d) receiving means coupled to said first semiconductor material for receiving second signals from a transmitter associated with another semiconductor element, and providing said second signals to said first semiconductor material.

25. The semiconductor element assembly of claim 24, wherein said transmitting means further comprises a mirror for reflecting said first signals onto said receiver.

26. The semiconductor element assembly of claim 1, further comprising:

(c) a second non-planar substrate,

(d) a second semiconductor material coupled to said second non-planar substrate, and

(e) a plurality of interconnector means for providing communications between said first semiconductor material and said second semiconductor material.

27. The semiconductor element assembly of claim 26, wherein at least one of said plurality of interconnector means comprise a plurality of fiber optic interconnectors.

28. The semiconductor element assembly of claim 26, wherein each of said plurality of interconnector means comprises:

(i) a first terminator means coupled to said first semiconductor material for transmitting signals to and receiving signals from said second semiconductor material,

(ii) a second terminator means coupled to said second semiconductor material for transmitting signals to and receiving signals from said first semiconductor material, and

(iii) connection means for transmitting signals between said first terminator means and said second terminator means.

29. The semiconductor element assembly of claim 28, wherein said connection means comprises a fiber optic cable.

30. The semiconductor element assembly of claim 29, wherein said first terminator means and said second terminator means each comprise:

(A) at least one output laser amplifier for amplifying signals transmitted to said first semiconductor material, and

(B) at least one input laser amplifier for amplifying signals transmitted from said second semiconductor material.

31. The semiconductor element assembly of claim 26, further comprising:

(c) retina means for receiving visual information, wherein said retina means further provides signals corresponding to said visual information to said first semiconductor material.

32. The semiconductor element assembly of claim 31, further comprising:

(d) mirror means for reflecting said visual information onto said retina.

33. The semiconductor element assembly of claim 31, wherein each of said plurality of semiconductor elements includes circuitry to process said signals.

34. A semiconductor element assembly comprising

(a) a first non-planar substrate, wherein said first non-planar substrate includes a cavity within its interior,

(b) a cooling means located within said cavity for cooling said first non-planar substrate, and

(c) a first semiconductor material coupled to said first non-planar substrate, wherein said first semiconductor material has a curved exterior surface.

35. The semiconductor element assembly of claim 34, further comprising:

(d) at least one electronic circuit fabricated on said first semiconductor material.

36. The semiconductor element assembly of claim 34, wherein said first non-planar substrate is made of a ceramic material.

37. The semiconductor element assembly of claim 34, wherein said first non-planar substrate is made of pure carbon.

38. The semiconductor element assembly of claim 34, wherein said first non-planar substrate is made of silicon dioxide (SiO₂) .

39. The semiconductor element assembly of claim 34, wherein said first non-planar substrate is doped to match the lattice structure of said first semiconductor material.

40. The semiconductor element assembly of claim 34, wherein said first non-planar substrate is substantially cone-shaped.

41. The semiconductor element assembly of claim 34, further comprising:

(d) a power supply means within said cavity for providing power to said first non-planar substrate.

42. The semiconductor element assembly of claim 41, further comprising:

(e) coolant conduit means travelling through said power supply means and abutting said first non-planar substrate for cooling said semiconductor element assembly, said coolant conduit means adapted for containing a fluid coolant.

43. The semiconductor element assembly of claim 34, wherein said first non-planar substrate is substantially spherical.

44. The semiconductor element assembly of claim 34, wherein said first non-planar substrate comprises a three-dimensional surface connecting two circles residing in different parallel planes.

45. The semiconductor element assembly of claim 34, wherein said first semiconductor material comprises a first semiconductor layer composed of GaAs.

46. The semiconductor element assembly of claim 45, wherein said GaAs layer is in the range of 50-200 Angstroms thick.

47. The semiconductor element assembly of claim 45, wherein said first semiconductor material further comprises a second semiconductor layer composed of an element from the following group:

Si or GaAs.

48. The semiconductor element assembly of claim 34, further comprising:

(d) transmitting means coupled to said first semiconductor material for transmitting signals from said first semiconductor material to a destination external to said first semiconductor material.

49. The semiconductor element assembly of claim 48, wherein said transmitted signals comprise light signals.

50. The semiconductor element assembly of claim 48, wherein said transmitting means comprises an edge-emitting laser.

51. The semiconductor element assembly of claim 48, wherein said transmitting means comprises a surface-emitting laser.

52. The semiconductor element assembly of claim 51, wherein said surface-emitting laser includes a cone-shaped beam splitter.

53. The semiconductor element assembly of claim 34, further comprising:

(d) receiving means coupled to said first semiconductor material for receiving signals from a source external to said first semiconductor material to said first semiconductor material, and providing said signals to said first semiconductor material.

54. The semiconductor element assembly of claim 53, wherein said received signals comprise light signals.

55. The semiconductor element assembly of claim 53, wherein said receiving means comprises a photo-sensitive element.

56. The semiconductor element assembly of claim 34, further comprising:

(d) transmitting means coupled to said first semiconductor material for transmitting first signals from said first semiconductor material to a receiver associated with another semiconductor element, and

(e) receiving means coupled to said first semiconductor material for receiving second signals from a transmitter associated with another semiconductor element, and providing said second signals to said first semiconductor material.

57. The semiconductor element assembly of claim 56, wherein said transmitting means further comprises a mirror for reflecting said first signals onto said receiver.

58. The semiconductor element assembly of claim 34, further comprising:

(d) a second non-planar substrate,

(e) a second semiconductor material coupled to said second non-planar substrate, and

(f) a plurality of interconnector means for providing communications between said first semiconductor material and said second semiconductor material.

59. The semiconductor element assembly of claim 58, wherein at least one of said plurality of interconnector means comprise a plurality of fiber optic interconnectors.

60. The semiconductor element assembly of claim 58, wherein each of said plurality of interconnector means comprises:

(i) a first terminator means coupled to said second semiconductor material for transmitting signals to and receiving signals from said first semiconductor material,

(ii) a second terminator means coupled to said first semiconductor material for transmitting signals to and receiving signals from said second semiconductor material, and

(iii) connection means for transmitting signals between said first terminator means and said second terminator means.

61. The semiconductor element assembly of claim 60, wherein said connection means comprises a fiber optic cable.

62. The semiconductor element assembly of claim 61, wherein said first terminator means and said second terminator means each comprise:

(A) at least one output laser amplifier for amplifying signals transmitted to said first semiconductor material, and

(B) at least one input laser amplifier for amplifying signals transmitted from said second semiconductor material.

63. The semiconductor element assembly of claim 58, further comprising:

(d) retina means for receiving visual information, wherein said retina means further provides signals corresponding to said visual information to said first semiconductor material.

64. The semiconductor element assembly of claim 63, further comprising:

(e) mirror means for reflecting said visual information onto said retina.

65. The semiconductor element assembly of claim 63, wherein each of said plurality of semiconductor elements includes circuitry to process said signals.