Plasma etching process control

• US 5,362,356 A
• Filed: 01/14/1992
• Issued: 11/08/1994
• Est. Priority Date: 12/20/1990
• Status: Expired due to Term

• Current Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Schoenborn, Philippe
• Primary Examiner(s): DANG, THI D
• Application Number:
  US07/821,727
• Time in Patent Office: 1,029 Days
• Field of Search: 156/626, 156/627, 156/651, 156/643, 156/646, 156/657, 156/653, 156/656, 204/192.33
• US Class Current: 216/60
• CPC Class Codes: H01L 21/28026 characterised by the conductor H01L21/28176 takes precedence
• CPC Class Codes: H01L 21/32137 of silicon-containing layers
• CPC Class Codes: H01L 21/32139 using masks

Abstract

A passive, in-line method of monitoring film removal (or deposition) during plasma etching (or deposition) based on interference phenomena is disclosed. Plasma emission intensity is monitored at a selected wavelength, without additional illuminating apparatus, and variations in plasma emission intensity are correlated to remaining film thickness, etch rate and uniformity, and etch selectivity. The method is useful in conjunction with nitride island etch, polysilicon etch, oxide spacer etch, contact etch, etc. The method is also useful in determining a particular remaining film thickness (e.g., just prior to clearing) at which point the etch recipe can be changed from a high-rate, low selectivity etch to a low-rate, high-selectivity etch.

Claims

1. Method of monitoring removal of a film on a product wafer during plasma etching, comprising:

removing a film on a wafer, overlying an underlying material, by a plasma etching process with a plasma having an emission intensity, said film having an initial thickness prior to etching and a remaining thickness during etching;

while etching the film, monitoring the plasma emission intensity at a selected wavelength, said monitoring occurring non-perpendicularly to the wafer; and

correlating variations in the plasma emission intensity, attributable to reflected light interference phenomena, by observing a cyclic pattern in emission intensity, to the remaining film thickness.

2. Method according to claim 1, further comprising:

determining the selectivity (film;

underlying material) of the etching process.

3. Method according to claim 1, further comprising:

determining etch rate and uniformity based on changes in the plasma emission intensity during etching.

4. Method according to claim 1, wherein:

the film is nitride.

5. Method according to claim 1, wherein:

the film is polysilicon.

6. Method according to claim 1, wherein:

the film is oxide.

7. Method according to claim 1, wherein:

the underlying material includes a contact.

8. Method according to claim 1, further comprising:

etching the wafer with a high-rate, low-selectivity (film;

underlying material) etch recipe until a known film thickness remains; and

thereafter continuing to etch with a low-rate, high-selectivity (film;

underlying material) etch recipe until the film is at least cleared.

9. Method according to claim 8, further comprising:

continuing to etch after the film has been cleared from the underlying material using the low-rate, high-selectivity etch recipe, to ensure that the film is cleared.

10. Method, according to claim 1, further comprising:

determining, prior to etching, an initial thickness "d₀ " for the underlying material;

determining, after completion of etching, a minimum final thickness "d_m " for the underlying material;

etching for a total etch time of "T_E ", including any overetch;

determining a time "t₁ " whereupon the film begins clearing from the wafer;

determining an etch rate "E", averaged across the wafer, for the film being etched;

determining a uniformity "u" of the etch rate "E"; and

estimating a selectivity "R_m " of etch rates between the film and the underlying material, according to the relationship;

space="preserve" listing-type="equation">R.sub.m =E(1-u)(T.sub.E -t.sub.1)/(d.sub.0 -d.sub.m).

11. Method, according to claim 1, further comprising:

determining, prior to etching, an initial thickness "d₀ " for the underlying material;

determining, after completion of etching, an average remaining thickness "d_a " for the underlying material;

determining an endpoint of etching, exclusive of any overetch;

determining a time "T" as the etching time required to reach the endpoint of etching;

etching for a total time of "T_E ", including any overetch;

determining an etch rate "E", averaged across the wafer, for the film being etched; and

estimating a selectivity "R_m " of etch rate between the film and the underlying material, according to the relationship;

R=E(T_E -T)/(d₀ -d_a).

12. Method, according to claim 1, further comprising:

determining an endpoint of etching, exclusive of any overetch;

determining a time "T" as the etching time required to reach the endpoint of etching; and

determining a uniformity "u" of the film subsequent to etching, according to the relationship;

space="preserve" listing-type="equation">u=[-δ

+{δ

.sup.2 +4(1+δ

U.sub.n)}.sup.1/2 ]/2;

wherein;

"δ

"=2T dS/dT / (S.sub.∞

-S_o);

"S" is the plasma emission intensity measured during etching;

"S.sub.∞

" is the plasma emission intensity measured after complete clearing of the film;

"S_o " is the plasma emission intensity measured prior to the endpoint of etching; and

"U_n " is the initial, pre-etch uniformity of the film.