Electrically conductive adhesive compositions
First Claim
1. An anisotropically conductive adhesive curable composition comprising:
- (a) at least one cationically curable epoxy resin;
(b) at least one thermoplastic resin essentially free of nucleophilic or metal complexing functional groups;
(c) a multi-component thermal initiator comprising;
(1) at least one salt of an organometallic complex cation wherein the organometallic cation is selected from a class of substituted and unsubstituted aromatic compounds based on a benzene or cyclopentadienyl nucleus, and the anion is tetrafluoroborate, hexafluorophosphate, hexafluoroarsenate, hydroxypentafluoroantimonate, trifluoromethanesulfonate, or hexafluoroantimonate; and
(2) at least one stabilizing additive;
(3) at least one cure rate enhancer;
(d) a plurality of conductive particles; and
(e) optionally, at least one silane coupling agent;
wherein the composition are curable at a temperature of about 120°
-125°
C.
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Accused Products
Abstract
An anisotropically conductive adhesive composition provides electrical conductivity between facing electrodes but maintains electric insulation laterally between adjacent electrodes and comprises (a) a cationically polymerizable monomer, such as a glycidyl epoxy resin; (b) a thermoplastic resin, essentially free of nucleophilic or metal complexing functional groups; (c) optionally, an alcohol containing material; (d) a thermally initiated catalyst system comprising: (1) a salt of an organometallic cation; (2) a cure rate enhancer; and (3) a stabilizing additive; (e) conductive particles; and (f) optionally, a silane coupling agent, wherein the adhesive compositions cure at a temperature of 120°-125° C.
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Citations
11 Claims
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1. An anisotropically conductive adhesive curable composition comprising:
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(a) at least one cationically curable epoxy resin; (b) at least one thermoplastic resin essentially free of nucleophilic or metal complexing functional groups; (c) a multi-component thermal initiator comprising; (1) at least one salt of an organometallic complex cation wherein the organometallic cation is selected from a class of substituted and unsubstituted aromatic compounds based on a benzene or cyclopentadienyl nucleus, and the anion is tetrafluoroborate, hexafluorophosphate, hexafluoroarsenate, hydroxypentafluoroantimonate, trifluoromethanesulfonate, or hexafluoroantimonate; and (2) at least one stabilizing additive; (3) at least one cure rate enhancer; (d) a plurality of conductive particles; and (e) optionally, at least one silane coupling agent; wherein the composition are curable at a temperature of about 120°
-125°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11)
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10. A thermally cationically cured adhesive composition prepared according to the steps of:
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(a) providing a thermally cationically curable adhesive composition comprising; (1) at least one epoxy functional resin; (2) at least one thermoplastic resin essentially free of nucleophilic or metal complexing functional groups; (3) a multi-component thermal initiator comprising; (i) at least one salt of an organometallic complex cation wherein the organometallic cation is selected from a class of substituted or unsubstituted aromatic compounds based on a benzene or cyclopentadienyl nucleus, and the anion is tetrafluoroborate, hexafluorophosphate, hexafluoroarsenate, hydroxypentafluoroantimonate, trifluoromethanesulfonate, or hexafluoroantimonate; and (ii) at least one stabilizing additive; (iii) at least one cure rate enhancer; (4) a plurality of conductive particle'"'"'s; and (5) optionally, at least one silane coupling agent; and (b) adding sufficient heat at a temperature of about 120°
-125°
C. to cationically cure the composition.
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Specification